JP2021518657A5 - - Google Patents
Info
- Publication number
- JP2021518657A5 JP2021518657A5 JP2020549592A JP2020549592A JP2021518657A5 JP 2021518657 A5 JP2021518657 A5 JP 2021518657A5 JP 2020549592 A JP2020549592 A JP 2020549592A JP 2020549592 A JP2020549592 A JP 2020549592A JP 2021518657 A5 JP2021518657 A5 JP 2021518657A5
- Authority
- JP
- Japan
- Prior art keywords
- dies
- manufacturing
- profile
- identifying
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862645406P | 2018-03-20 | 2018-03-20 | |
| US62/645,406 | 2018-03-20 | ||
| US16/038,973 | 2018-07-18 | ||
| US16/038,973 US10867877B2 (en) | 2018-03-20 | 2018-07-18 | Targeted recall of semiconductor devices based on manufacturing data |
| PCT/US2019/022833 WO2019183008A1 (en) | 2018-03-20 | 2019-03-19 | Targeted recall of semiconductor devices based on manufacturing data |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021518657A JP2021518657A (ja) | 2021-08-02 |
| JP2021518657A5 true JP2021518657A5 (https=) | 2022-03-29 |
| JP7105904B2 JP7105904B2 (ja) | 2022-07-25 |
Family
ID=67983244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020549592A Active JP7105904B2 (ja) | 2018-03-20 | 2019-03-19 | 製造データに基づく半導体デバイスのターゲットされたリコール |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10867877B2 (https=) |
| JP (1) | JP7105904B2 (https=) |
| KR (1) | KR102450010B1 (https=) |
| CN (1) | CN111868903B (https=) |
| DE (1) | DE112019001445T5 (https=) |
| TW (1) | TWI787484B (https=) |
| WO (1) | WO2019183008A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7219046B2 (ja) * | 2018-10-12 | 2023-02-07 | 株式会社アドバンテスト | 解析装置、解析方法および解析プログラム |
| JP7219045B2 (ja) * | 2018-10-12 | 2023-02-07 | 株式会社アドバンテスト | 解析装置、解析方法および解析プログラム |
| US10930597B2 (en) * | 2019-03-27 | 2021-02-23 | Kla-Tencor Corporation | Die screening using inline defect information |
| US11615533B2 (en) * | 2019-07-12 | 2023-03-28 | Bruker Nano, Inc. | Methods and systems for product failure prediction based on X-ray image re-examination |
| US11293970B2 (en) * | 2020-01-12 | 2022-04-05 | Kla Corporation | Advanced in-line part average testing |
| US11754625B2 (en) * | 2020-01-30 | 2023-09-12 | Kla Corporation | System and method for identifying latent reliability defects in semiconductor devices |
| JP7518180B2 (ja) * | 2020-03-03 | 2024-07-17 | ピーディーエフ ソリューションズ，インコーポレイテッド | 寿命初期故障を起こしやすいダイの予測 |
| WO2022098354A1 (en) | 2020-11-05 | 2022-05-12 | Kla Corporation | Systems and methods for measurement of misregistration and amelioration thereof |
| CN114512415B (zh) * | 2020-11-17 | 2025-09-02 | 台湾积体电路制造股份有限公司 | 半导体测试元件及半导体测试方法 |
| US20220196723A1 (en) * | 2020-12-18 | 2022-06-23 | Kla Corporation | System and method for automatically identifying defect-based test coverage gaps in semiconductor devices |
| US11656274B2 (en) * | 2021-02-15 | 2023-05-23 | Kla Corporation | Systems and methods for evaluating the reliability of semiconductor die packages |
| US12422376B2 (en) * | 2021-03-24 | 2025-09-23 | Kla Corporation | Imaging reflectometry for inline screening |
| US11798827B2 (en) | 2021-05-06 | 2023-10-24 | Kla Corporation | Systems and methods for semiconductor adaptive testing using inline defect part average testing |
| US11624775B2 (en) * | 2021-06-07 | 2023-04-11 | Kla Corporation | Systems and methods for semiconductor defect-guided burn-in and system level tests |
| US11614480B2 (en) * | 2021-06-08 | 2023-03-28 | Kla Corporation | System and method for Z-PAT defect-guided statistical outlier detection of semiconductor reliability failures |
| US12007428B2 (en) * | 2021-10-08 | 2024-06-11 | Advantest Corporation | Systems and methods for multidimensional dynamic part average testing |
| CN117074923B (zh) * | 2023-10-11 | 2023-12-12 | 蓝芯存储技术(赣州)有限公司 | 芯片老化测试方法、装置、设备及存储介质 |
| CN118858892B (zh) * | 2024-07-17 | 2025-08-22 | 深圳市立可自动化设备有限公司 | 半导体芯片测试方法及系统 |
| CN119556177B (zh) * | 2025-01-24 | 2025-06-10 | 山东科技大学 | 一种燃料电池故障诊断方法、设备及介质 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7796801B2 (en) | 1999-08-26 | 2010-09-14 | Nanogeometry Research Inc. | Pattern inspection apparatus and method |
| US7474001B2 (en) | 2001-11-21 | 2009-01-06 | Hermes-Microvision, Inc. | Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing |
| US7062411B2 (en) | 2003-06-11 | 2006-06-13 | Scientific Systems Research Limited | Method for process control of semiconductor manufacturing equipment |
| JP3913715B2 (ja) * | 2003-06-18 | 2007-05-09 | 株式会社東芝 | 不良検出方法 |
| US7291507B2 (en) * | 2004-09-23 | 2007-11-06 | Pixim, Inc. | Using a time invariant statistical process variable of a semiconductor chip as the chip identifier |
| JP4799574B2 (ja) * | 2008-02-29 | 2011-10-26 | 株式会社東芝 | 線状パターンの検知方法および装置 |
| US7878336B2 (en) * | 2008-09-09 | 2011-02-01 | Cheng Mei Instrument Technology Co., Ltd. | System and method for inspection of chips on tray |
| JP5416025B2 (ja) | 2010-04-22 | 2014-02-12 | 株式会社神戸製鋼所 | 表面形状測定装置および半導体ウェハ検査装置 |
| US8627251B2 (en) * | 2012-04-25 | 2014-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes |
| US8948495B2 (en) * | 2012-08-01 | 2015-02-03 | Kla-Tencor Corp. | Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer |
| US9466101B2 (en) | 2013-05-01 | 2016-10-11 | Taiwan Semiconductor Manufacturing Company Limited | Detection of defects on wafer during semiconductor fabrication |
| US10127652B2 (en) * | 2014-02-06 | 2018-11-13 | Kla-Tencor Corp. | Defect detection and classification based on attributes determined from a standard reference image |
| JP2017009379A (ja) * | 2015-06-19 | 2017-01-12 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| US9891267B2 (en) * | 2016-06-14 | 2018-02-13 | Nxp Usa, Inc. | Kernel based cluster fault analysis |
| US10761128B2 (en) | 2017-03-23 | 2020-09-01 | Kla-Tencor Corporation | Methods and systems for inline parts average testing and latent reliability defect detection |
| US11435393B2 (en) | 2017-11-03 | 2022-09-06 | Tokyo Electron Limited | Enhancement of yield of functional microelectronic devices |
-
2018
- 2018-07-18 US US16/038,973 patent/US10867877B2/en active Active
-
2019
- 2019-03-19 WO PCT/US2019/022833 patent/WO2019183008A1/en not_active Ceased
- 2019-03-19 KR KR1020207030152A patent/KR102450010B1/ko active Active
- 2019-03-19 TW TW108109371A patent/TWI787484B/zh active
- 2019-03-19 DE DE112019001445.5T patent/DE112019001445T5/de active Pending
- 2019-03-19 JP JP2020549592A patent/JP7105904B2/ja active Active
- 2019-03-19 CN CN201980017077.0A patent/CN111868903B/zh active Active
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