TWI787484B - 基於製造資料針對性召回半導體裝置 - Google Patents

基於製造資料針對性召回半導體裝置 Download PDF

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Publication number
TWI787484B
TWI787484B TW108109371A TW108109371A TWI787484B TW I787484 B TWI787484 B TW I787484B TW 108109371 A TW108109371 A TW 108109371A TW 108109371 A TW108109371 A TW 108109371A TW I787484 B TWI787484 B TW I787484B
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manufacturing
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TW108109371A
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TW202004947A (zh
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羅伯 J 拉瑟
大衛 W 普利斯
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美商克萊譚克公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q30/00—Commerce
    • G06Q30/01—Customer relationship services
    • G06Q30/014—Providing recall services for goods or products
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking

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  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Marketing (AREA)
  • Finance (AREA)
  • Strategic Management (AREA)
  • Economics (AREA)
  • General Business, Economics & Management (AREA)
  • Development Economics (AREA)
  • Accounting & Taxation (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Automation & Control Theory (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Hall/Mr Elements (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Volatile Memory (AREA)
TW108109371A 2018-03-20 2019-03-19 基於製造資料針對性召回半導體裝置 TWI787484B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862645406P 2018-03-20 2018-03-20
US62/645,406 2018-03-20
US16/038,973 2018-07-18
US16/038,973 US10867877B2 (en) 2018-03-20 2018-07-18 Targeted recall of semiconductor devices based on manufacturing data

Publications (2)

Publication Number Publication Date
TW202004947A TW202004947A (zh) 2020-01-16
TWI787484B true TWI787484B (zh) 2022-12-21

Family

ID=67983244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109371A TWI787484B (zh) 2018-03-20 2019-03-19 基於製造資料針對性召回半導體裝置

Country Status (7)

Country Link
US (1) US10867877B2 (https=)
JP (1) JP7105904B2 (https=)
KR (1) KR102450010B1 (https=)
CN (1) CN111868903B (https=)
DE (1) DE112019001445T5 (https=)
TW (1) TWI787484B (https=)
WO (1) WO2019183008A1 (https=)

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JP7219046B2 (ja) * 2018-10-12 2023-02-07 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
JP7219045B2 (ja) * 2018-10-12 2023-02-07 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
US10930597B2 (en) * 2019-03-27 2021-02-23 Kla-Tencor Corporation Die screening using inline defect information
US11615533B2 (en) * 2019-07-12 2023-03-28 Bruker Nano, Inc. Methods and systems for product failure prediction based on X-ray image re-examination
US11293970B2 (en) * 2020-01-12 2022-04-05 Kla Corporation Advanced in-line part average testing
US11754625B2 (en) * 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices
JP7518180B2 (ja) * 2020-03-03 2024-07-17 ピーディーエフ ソリューションズ，インコーポレイテッド 寿命初期故障を起こしやすいダイの予測
WO2022098354A1 (en) 2020-11-05 2022-05-12 Kla Corporation Systems and methods for measurement of misregistration and amelioration thereof
CN114512415B (zh) * 2020-11-17 2025-09-02 台湾积体电路制造股份有限公司 半导体测试元件及半导体测试方法
US20220196723A1 (en) * 2020-12-18 2022-06-23 Kla Corporation System and method for automatically identifying defect-based test coverage gaps in semiconductor devices
US11656274B2 (en) * 2021-02-15 2023-05-23 Kla Corporation Systems and methods for evaluating the reliability of semiconductor die packages
US12422376B2 (en) * 2021-03-24 2025-09-23 Kla Corporation Imaging reflectometry for inline screening
US11798827B2 (en) 2021-05-06 2023-10-24 Kla Corporation Systems and methods for semiconductor adaptive testing using inline defect part average testing
US11624775B2 (en) * 2021-06-07 2023-04-11 Kla Corporation Systems and methods for semiconductor defect-guided burn-in and system level tests
US11614480B2 (en) * 2021-06-08 2023-03-28 Kla Corporation System and method for Z-PAT defect-guided statistical outlier detection of semiconductor reliability failures
US12007428B2 (en) * 2021-10-08 2024-06-11 Advantest Corporation Systems and methods for multidimensional dynamic part average testing
CN117074923B (zh) * 2023-10-11 2023-12-12 蓝芯存储技术(赣州)有限公司 芯片老化测试方法、装置、设备及存储介质
CN118858892B (zh) * 2024-07-17 2025-08-22 深圳市立可自动化设备有限公司 半导体芯片测试方法及系统
CN119556177B (zh) * 2025-01-24 2025-06-10 山东科技大学 一种燃料电池故障诊断方法、设备及介质

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US20100303334A1 (en) * 1999-08-26 2010-12-02 Tadashi Kitamura Pattern inspection apparatus and method
US20130288403A1 (en) * 2012-04-25 2013-10-31 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

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JP4799574B2 (ja) * 2008-02-29 2011-10-26 株式会社東芝 線状パターンの検知方法および装置
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US8948495B2 (en) * 2012-08-01 2015-02-03 Kla-Tencor Corp. Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
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JP2017009379A (ja) * 2015-06-19 2017-01-12 株式会社ニューフレアテクノロジー 検査装置および検査方法
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US20060234496A1 (en) * 2001-11-21 2006-10-19 Yan Zhao Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
US20130288403A1 (en) * 2012-04-25 2013-10-31 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

Also Published As

Publication number Publication date
CN111868903B (zh) 2024-03-19
CN111868903A (zh) 2020-10-30
TW202004947A (zh) 2020-01-16
KR102450010B1 (ko) 2022-09-30
US10867877B2 (en) 2020-12-15
KR20200123857A (ko) 2020-10-30
US20190295908A1 (en) 2019-09-26
JP2021518657A (ja) 2021-08-02
DE112019001445T5 (de) 2020-12-10
JP7105904B2 (ja) 2022-07-25
WO2019183008A1 (en) 2019-09-26

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