CN111868903B - 半导体装置的基于制造数据的针对性召回 - Google Patents

半导体装置的基于制造数据的针对性召回 Download PDF

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Publication number
CN111868903B
CN111868903B CN201980017077.0A CN201980017077A CN111868903B CN 111868903 B CN111868903 B CN 111868903B CN 201980017077 A CN201980017077 A CN 201980017077A CN 111868903 B CN111868903 B CN 111868903B
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CN111868903A (zh
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R·J·拉瑟
D·W·普利斯
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q30/00—Commerce
    • G06Q30/01—Customer relationship services
    • G06Q30/014—Providing recall services for goods or products
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking

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  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Marketing (AREA)
  • Finance (AREA)
  • Strategic Management (AREA)
  • Economics (AREA)
  • General Business, Economics & Management (AREA)
  • Development Economics (AREA)
  • Accounting & Taxation (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Automation & Control Theory (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Hall/Mr Elements (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Volatile Memory (AREA)
CN201980017077.0A 2018-03-20 2019-03-19 半导体装置的基于制造数据的针对性召回 Active CN111868903B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862645406P 2018-03-20 2018-03-20
US62/645,406 2018-03-20
US16/038,973 2018-07-18
US16/038,973 US10867877B2 (en) 2018-03-20 2018-07-18 Targeted recall of semiconductor devices based on manufacturing data
PCT/US2019/022833 WO2019183008A1 (en) 2018-03-20 2019-03-19 Targeted recall of semiconductor devices based on manufacturing data

Publications (2)

Publication Number Publication Date
CN111868903A CN111868903A (zh) 2020-10-30
CN111868903B true CN111868903B (zh) 2024-03-19

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Country Link
US (1) US10867877B2 (https=)
JP (1) JP7105904B2 (https=)
KR (1) KR102450010B1 (https=)
CN (1) CN111868903B (https=)
DE (1) DE112019001445T5 (https=)
TW (1) TWI787484B (https=)
WO (1) WO2019183008A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7219046B2 (ja) * 2018-10-12 2023-02-07 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
JP7219045B2 (ja) * 2018-10-12 2023-02-07 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
US10930597B2 (en) * 2019-03-27 2021-02-23 Kla-Tencor Corporation Die screening using inline defect information
US11615533B2 (en) * 2019-07-12 2023-03-28 Bruker Nano, Inc. Methods and systems for product failure prediction based on X-ray image re-examination
US11293970B2 (en) * 2020-01-12 2022-04-05 Kla Corporation Advanced in-line part average testing
US11754625B2 (en) * 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices
JP7518180B2 (ja) * 2020-03-03 2024-07-17 ピーディーエフ ソリューションズ，インコーポレイテッド 寿命初期故障を起こしやすいダイの予測
WO2022098354A1 (en) 2020-11-05 2022-05-12 Kla Corporation Systems and methods for measurement of misregistration and amelioration thereof
CN114512415B (zh) * 2020-11-17 2025-09-02 台湾积体电路制造股份有限公司 半导体测试元件及半导体测试方法
US20220196723A1 (en) * 2020-12-18 2022-06-23 Kla Corporation System and method for automatically identifying defect-based test coverage gaps in semiconductor devices
US11656274B2 (en) * 2021-02-15 2023-05-23 Kla Corporation Systems and methods for evaluating the reliability of semiconductor die packages
US12422376B2 (en) * 2021-03-24 2025-09-23 Kla Corporation Imaging reflectometry for inline screening
US11798827B2 (en) 2021-05-06 2023-10-24 Kla Corporation Systems and methods for semiconductor adaptive testing using inline defect part average testing
US11624775B2 (en) * 2021-06-07 2023-04-11 Kla Corporation Systems and methods for semiconductor defect-guided burn-in and system level tests
US11614480B2 (en) * 2021-06-08 2023-03-28 Kla Corporation System and method for Z-PAT defect-guided statistical outlier detection of semiconductor reliability failures
US12007428B2 (en) * 2021-10-08 2024-06-11 Advantest Corporation Systems and methods for multidimensional dynamic part average testing
CN117074923B (zh) * 2023-10-11 2023-12-12 蓝芯存储技术(赣州)有限公司 芯片老化测试方法、装置、设备及存储介质
CN118858892B (zh) * 2024-07-17 2025-08-22 深圳市立可自动化设备有限公司 半导体芯片测试方法及系统
CN119556177B (zh) * 2025-01-24 2025-06-10 山东科技大学 一种燃料电池故障诊断方法、设备及介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101672800A (zh) * 2008-09-09 2010-03-17 政美仪器有限公司 用于承载盘内的芯片的检测系统及其检测方法
WO2014022682A1 (en) * 2012-08-01 2014-02-06 Kla-Tencor Corporation Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
CN105960702A (zh) * 2014-02-06 2016-09-21 科磊股份有限公司 基于从标准参考图像确定的属性的缺陷检测及分类

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7796801B2 (en) 1999-08-26 2010-09-14 Nanogeometry Research Inc. Pattern inspection apparatus and method
US7474001B2 (en) 2001-11-21 2009-01-06 Hermes-Microvision, Inc. Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
US7062411B2 (en) 2003-06-11 2006-06-13 Scientific Systems Research Limited Method for process control of semiconductor manufacturing equipment
JP3913715B2 (ja) * 2003-06-18 2007-05-09 株式会社東芝 不良検出方法
US7291507B2 (en) * 2004-09-23 2007-11-06 Pixim, Inc. Using a time invariant statistical process variable of a semiconductor chip as the chip identifier
JP4799574B2 (ja) * 2008-02-29 2011-10-26 株式会社東芝 線状パターンの検知方法および装置
JP5416025B2 (ja) 2010-04-22 2014-02-12 株式会社神戸製鋼所 表面形状測定装置および半導体ウェハ検査装置
US8627251B2 (en) * 2012-04-25 2014-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes
US9466101B2 (en) 2013-05-01 2016-10-11 Taiwan Semiconductor Manufacturing Company Limited Detection of defects on wafer during semiconductor fabrication
JP2017009379A (ja) * 2015-06-19 2017-01-12 株式会社ニューフレアテクノロジー 検査装置および検査方法
US9891267B2 (en) * 2016-06-14 2018-02-13 Nxp Usa, Inc. Kernel based cluster fault analysis
US10761128B2 (en) 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US11435393B2 (en) 2017-11-03 2022-09-06 Tokyo Electron Limited Enhancement of yield of functional microelectronic devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101672800A (zh) * 2008-09-09 2010-03-17 政美仪器有限公司 用于承载盘内的芯片的检测系统及其检测方法
WO2014022682A1 (en) * 2012-08-01 2014-02-06 Kla-Tencor Corporation Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
CN105960702A (zh) * 2014-02-06 2016-09-21 科磊股份有限公司 基于从标准参考图像确定的属性的缺陷检测及分类

Also Published As

Publication number Publication date
TWI787484B (zh) 2022-12-21
CN111868903A (zh) 2020-10-30
TW202004947A (zh) 2020-01-16
KR102450010B1 (ko) 2022-09-30
US10867877B2 (en) 2020-12-15
KR20200123857A (ko) 2020-10-30
US20190295908A1 (en) 2019-09-26
JP2021518657A (ja) 2021-08-02
DE112019001445T5 (de) 2020-12-10
JP7105904B2 (ja) 2022-07-25
WO2019183008A1 (en) 2019-09-26

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