JP2024509684A5 - - Google Patents
Info
- Publication number
- JP2024509684A5 JP2024509684A5 JP2023546059A JP2023546059A JP2024509684A5 JP 2024509684 A5 JP2024509684 A5 JP 2024509684A5 JP 2023546059 A JP2023546059 A JP 2023546059A JP 2023546059 A JP2023546059 A JP 2023546059A JP 2024509684 A5 JP2024509684 A5 JP 2024509684A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor die
- risk
- semiconductor
- pat
- subsystems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163149367P | 2021-02-15 | 2021-02-15 | |
| US63/149,367 | 2021-02-15 | ||
| US17/212,877 | 2021-03-25 | ||
| US17/212,877 US11656274B2 (en) | 2021-02-15 | 2021-03-25 | Systems and methods for evaluating the reliability of semiconductor die packages |
| PCT/US2022/015561 WO2022173712A1 (en) | 2021-02-15 | 2022-02-08 | Systems and methods for evaluating the reliability of semiconductor die packages |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024509684A JP2024509684A (ja) | 2024-03-05 |
| JP2024509684A5 true JP2024509684A5 (https=) | 2024-09-27 |
| JP7664405B2 JP7664405B2 (ja) | 2025-04-17 |
Family
ID=82800286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023546059A Active JP7664405B2 (ja) | 2021-02-15 | 2022-02-08 | 半導体ダイパッケージの信頼性を評価するためのシステムおよび方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11656274B2 (https=) |
| EP (1) | EP4281998A4 (https=) |
| JP (1) | JP7664405B2 (https=) |
| KR (1) | KR102812585B1 (https=) |
| CN (1) | CN116686076B (https=) |
| IL (1) | IL304264A (https=) |
| TW (1) | TWI888691B (https=) |
| WO (1) | WO2022173712A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11754625B2 (en) * | 2020-01-30 | 2023-09-12 | Kla Corporation | System and method for identifying latent reliability defects in semiconductor devices |
| US12487282B2 (en) * | 2021-12-28 | 2025-12-02 | Advanced Micro Devices Products (China) Co., Ltd. | On-chip distribution of test data for multiple dies |
| US20240371822A1 (en) * | 2023-05-02 | 2024-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit package and method |
| CN118380354B (zh) * | 2024-06-26 | 2024-10-29 | 南通华隆微电子股份有限公司 | 一种半导体封装绷片压力自适应调节系统 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7485548B2 (en) * | 2006-03-10 | 2009-02-03 | Micron Technology, Inc. | Die loss estimation using universal in-line metric (UILM) |
| JP2009147015A (ja) | 2007-12-12 | 2009-07-02 | Hitachi Ulsi Systems Co Ltd | 半導体装置の検査方法、検査システム及び製造方法 |
| JP2009302246A (ja) | 2008-06-12 | 2009-12-24 | Fujitsu Microelectronics Ltd | 半導体装置の選別方法 |
| US20140303912A1 (en) | 2013-04-07 | 2014-10-09 | Kla-Tencor Corporation | System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring |
| JP6166120B2 (ja) | 2013-08-01 | 2017-07-19 | ラピスセミコンダクタ株式会社 | データ処理装置、測定装置、選別装置、データ処理方法およびプログラム |
| TWI538156B (zh) * | 2014-01-07 | 2016-06-11 | 甯樹樑 | 晶片間無微接觸點之晶圓級晶片堆疊結構及其製造方法 |
| US9653184B2 (en) | 2014-06-16 | 2017-05-16 | Sandisk Technologies Llc | Non-volatile memory module with physical-to-physical address remapping |
| KR102521159B1 (ko) | 2014-11-25 | 2023-04-13 | 피디에프 솔루션즈, 인코포레이티드 | 반도체 제조 공정을 위한 개선된 공정 제어 기술 |
| US10127651B2 (en) * | 2016-01-15 | 2018-11-13 | Kla-Tencor Corporation | Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data |
| EP3437133A4 (en) * | 2016-04-01 | 2019-11-27 | INTEL Corporation | TECHNIQUES FOR STACKING MATRICES AND ASSOCIATED CONFIGURATIONS |
| US10761128B2 (en) | 2017-03-23 | 2020-09-01 | Kla-Tencor Corporation | Methods and systems for inline parts average testing and latent reliability defect detection |
| US10726038B2 (en) * | 2017-05-24 | 2020-07-28 | MphasiS Limited | System and method for optimizing aggregation and analysis of data across multiple data sources |
| US10585049B2 (en) * | 2018-03-10 | 2020-03-10 | Kla-Tencor Corporation | Process-induced excursion characterization |
| US10867877B2 (en) * | 2018-03-20 | 2020-12-15 | Kla Corporation | Targeted recall of semiconductor devices based on manufacturing data |
| CN110596566B (zh) | 2018-06-12 | 2022-03-04 | 北京华峰测控技术股份有限公司 | 一种用于ate系统的dpat测试方法 |
| CN109830447B (zh) * | 2019-01-17 | 2020-11-27 | 深圳赛意法微电子有限公司 | 半导体晶圆芯片分选方法、半导体产品的封装方法及系统 |
| KR101991757B1 (ko) | 2019-04-10 | 2019-09-30 | (주)에이피텍 | 웨이퍼 레벨 패키징을 수행하는 자동화 시스템 |
| US11293970B2 (en) | 2020-01-12 | 2022-04-05 | Kla Corporation | Advanced in-line part average testing |
| US11754625B2 (en) | 2020-01-30 | 2023-09-12 | Kla Corporation | System and method for identifying latent reliability defects in semiconductor devices |
-
2021
- 2021-03-25 US US17/212,877 patent/US11656274B2/en active Active
-
2022
- 2022-01-10 TW TW111100921A patent/TWI888691B/zh active
- 2022-02-08 JP JP2023546059A patent/JP7664405B2/ja active Active
- 2022-02-08 KR KR1020237031120A patent/KR102812585B1/ko active Active
- 2022-02-08 EP EP22753191.0A patent/EP4281998A4/en active Pending
- 2022-02-08 CN CN202280008416.0A patent/CN116686076B/zh active Active
- 2022-02-08 WO PCT/US2022/015561 patent/WO2022173712A1/en not_active Ceased
-
2023
- 2023-07-05 IL IL304264A patent/IL304264A/en unknown
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