TWI888691B - 用於評估半導體晶粒封裝之可靠性之系統及方法 - Google Patents

用於評估半導體晶粒封裝之可靠性之系統及方法 Download PDF

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Publication number
TWI888691B
TWI888691B TW111100921A TW111100921A TWI888691B TW I888691 B TWI888691 B TW I888691B TW 111100921 A TW111100921 A TW 111100921A TW 111100921 A TW111100921 A TW 111100921A TW I888691 B TWI888691 B TW I888691B
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TW
Taiwan
Prior art keywords
semiconductor die
semiconductor
risk
pat
semiconductor dies
Prior art date
Application number
TW111100921A
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English (en)
Chinese (zh)
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TW202246787A (zh
Inventor
羅伯 J 拉瑟
大衛 W 普利斯
切特 Ｖ 萊諾克斯
歐艾斯特 唐賽拉
Original Assignee
美商科磊股份有限公司
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Application filed by 美商科磊股份有限公司 filed Critical 美商科磊股份有限公司
Publication of TW202246787A publication Critical patent/TW202246787A/zh
Application granted granted Critical
Publication of TWI888691B publication Critical patent/TWI888691B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
TW111100921A 2021-02-15 2022-01-10 用於評估半導體晶粒封裝之可靠性之系統及方法 TWI888691B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163149367P 2021-02-15 2021-02-15
US63/149,367 2021-02-15
US17/212,877 2021-03-25
US17/212,877 US11656274B2 (en) 2021-02-15 2021-03-25 Systems and methods for evaluating the reliability of semiconductor die packages

Publications (2)

Publication Number Publication Date
TW202246787A TW202246787A (zh) 2022-12-01
TWI888691B true TWI888691B (zh) 2025-07-01

Family

ID=82800286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111100921A TWI888691B (zh) 2021-02-15 2022-01-10 用於評估半導體晶粒封裝之可靠性之系統及方法

Country Status (8)

Country Link
US (1) US11656274B2 (https=)
EP (1) EP4281998A4 (https=)
JP (1) JP7664405B2 (https=)
KR (1) KR102812585B1 (https=)
CN (1) CN116686076B (https=)
IL (1) IL304264A (https=)
TW (1) TWI888691B (https=)
WO (1) WO2022173712A1 (https=)

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* Cited by examiner, † Cited by third party
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US11754625B2 (en) * 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices
US12487282B2 (en) * 2021-12-28 2025-12-02 Advanced Micro Devices Products (China) Co., Ltd. On-chip distribution of test data for multiple dies
US20240371822A1 (en) * 2023-05-02 2024-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method
CN118380354B (zh) * 2024-06-26 2024-10-29 南通华隆微电子股份有限公司 一种半导体封装绷片压力自适应调节系统

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US20160148850A1 (en) * 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
TW201734949A (zh) * 2016-01-15 2017-10-01 克萊譚克公司 使用具有晶圓影像資料之設計資料改良半導體晶圓檢測器之缺陷敏感度
WO2017171863A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Techniques for die stacking and associated configurations
WO2018175214A1 (en) * 2017-03-23 2018-09-27 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
CN109830447A (zh) * 2019-01-17 2019-05-31 深圳赛意法微电子有限公司 半导体晶圆芯片分选方法、半导体产品的封装方法及系统
US20190295908A1 (en) * 2018-03-20 2019-09-26 Kla-Tencor Corporation Targeted Recall of Semiconductor Devices Based on Manufacturing Data

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JP2009302246A (ja) 2008-06-12 2009-12-24 Fujitsu Microelectronics Ltd 半導体装置の選別方法
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JP6166120B2 (ja) 2013-08-01 2017-07-19 ラピスセミコンダクタ株式会社 データ処理装置、測定装置、選別装置、データ処理方法およびプログラム
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KR101991757B1 (ko) 2019-04-10 2019-09-30 (주)에이피텍 웨이퍼 레벨 패키징을 수행하는 자동화 시스템
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TW201528473A (zh) * 2014-01-07 2015-07-16 甯樹樑 晶片間無微接觸點之晶圓級晶片堆疊結構及其製造方法
US20160148850A1 (en) * 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
TW201734949A (zh) * 2016-01-15 2017-10-01 克萊譚克公司 使用具有晶圓影像資料之設計資料改良半導體晶圓檢測器之缺陷敏感度
WO2017171863A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Techniques for die stacking and associated configurations
WO2018175214A1 (en) * 2017-03-23 2018-09-27 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US20190295908A1 (en) * 2018-03-20 2019-09-26 Kla-Tencor Corporation Targeted Recall of Semiconductor Devices Based on Manufacturing Data
CN109830447A (zh) * 2019-01-17 2019-05-31 深圳赛意法微电子有限公司 半导体晶圆芯片分选方法、半导体产品的封装方法及系统

Also Published As

Publication number Publication date
KR102812585B1 (ko) 2025-05-26
US11656274B2 (en) 2023-05-23
CN116686076B (zh) 2024-12-24
US20220260632A1 (en) 2022-08-18
KR20230145420A (ko) 2023-10-17
EP4281998A1 (en) 2023-11-29
JP2024509684A (ja) 2024-03-05
TW202246787A (zh) 2022-12-01
CN116686076A (zh) 2023-09-01
IL304264A (en) 2023-09-01
WO2022173712A1 (en) 2022-08-18
JP7664405B2 (ja) 2025-04-17
EP4281998A4 (en) 2025-01-01

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