JP7664405B2 - 半導体ダイパッケージの信頼性を評価するためのシステムおよび方法 - Google Patents

半導体ダイパッケージの信頼性を評価するためのシステムおよび方法 Download PDF

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Publication number
JP7664405B2
JP7664405B2 JP2023546059A JP2023546059A JP7664405B2 JP 7664405 B2 JP7664405 B2 JP 7664405B2 JP 2023546059 A JP2023546059 A JP 2023546059A JP 2023546059 A JP2023546059 A JP 2023546059A JP 7664405 B2 JP7664405 B2 JP 7664405B2
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semiconductor die
semiconductor
risk
pat
subsystems
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Japanese (ja)
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JP2024509684A5 (https=
JP2024509684A (ja
Inventor
ロバート ジェイ ラザート
デービッド ダブリュ プライス
チェット ブイ レノックス
オレステ ドンツェッラ
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KLA Corp
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KLA Corp
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2023546059A 2021-02-15 2022-02-08 半導体ダイパッケージの信頼性を評価するためのシステムおよび方法 Active JP7664405B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163149367P 2021-02-15 2021-02-15
US63/149,367 2021-02-15
US17/212,877 2021-03-25
US17/212,877 US11656274B2 (en) 2021-02-15 2021-03-25 Systems and methods for evaluating the reliability of semiconductor die packages
PCT/US2022/015561 WO2022173712A1 (en) 2021-02-15 2022-02-08 Systems and methods for evaluating the reliability of semiconductor die packages

Publications (3)

Publication Number Publication Date
JP2024509684A JP2024509684A (ja) 2024-03-05
JP2024509684A5 JP2024509684A5 (https=) 2024-09-27
JP7664405B2 true JP7664405B2 (ja) 2025-04-17

Family

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JP2023546059A Active JP7664405B2 (ja) 2021-02-15 2022-02-08 半導体ダイパッケージの信頼性を評価するためのシステムおよび方法

Country Status (8)

Country Link
US (1) US11656274B2 (https=)
EP (1) EP4281998A4 (https=)
JP (1) JP7664405B2 (https=)
KR (1) KR102812585B1 (https=)
CN (1) CN116686076B (https=)
IL (1) IL304264A (https=)
TW (1) TWI888691B (https=)
WO (1) WO2022173712A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11754625B2 (en) * 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices
US12487282B2 (en) * 2021-12-28 2025-12-02 Advanced Micro Devices Products (China) Co., Ltd. On-chip distribution of test data for multiple dies
US20240371822A1 (en) * 2023-05-02 2024-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method
CN118380354B (zh) * 2024-06-26 2024-10-29 南通华隆微电子股份有限公司 一种半导体封装绷片压力自适应调节系统

Citations (5)

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JP2009147015A (ja) 2007-12-12 2009-07-02 Hitachi Ulsi Systems Co Ltd 半導体装置の検査方法、検査システム及び製造方法
JP2009302246A (ja) 2008-06-12 2009-12-24 Fujitsu Microelectronics Ltd 半導体装置の選別方法
US20140303912A1 (en) 2013-04-07 2014-10-09 Kla-Tencor Corporation System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring
JP2015032666A (ja) 2013-08-01 2015-02-16 ラピスセミコンダクタ株式会社 データ処理装置、測定装置、選別装置、データ処理方法およびプログラム
CN110596566A (zh) 2018-06-12 2019-12-20 北京华峰测控技术股份有限公司 一种用于ate系统的dpat测试方法

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US7485548B2 (en) * 2006-03-10 2009-02-03 Micron Technology, Inc. Die loss estimation using universal in-line metric (UILM)
TWI538156B (zh) * 2014-01-07 2016-06-11 甯樹樑 晶片間無微接觸點之晶圓級晶片堆疊結構及其製造方法
US9653184B2 (en) 2014-06-16 2017-05-16 Sandisk Technologies Llc Non-volatile memory module with physical-to-physical address remapping
KR102521159B1 (ko) 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
EP3437133A4 (en) * 2016-04-01 2019-11-27 INTEL Corporation TECHNIQUES FOR STACKING MATRICES AND ASSOCIATED CONFIGURATIONS
US10761128B2 (en) 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US10726038B2 (en) * 2017-05-24 2020-07-28 MphasiS Limited System and method for optimizing aggregation and analysis of data across multiple data sources
US10585049B2 (en) * 2018-03-10 2020-03-10 Kla-Tencor Corporation Process-induced excursion characterization
US10867877B2 (en) * 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
CN109830447B (zh) * 2019-01-17 2020-11-27 深圳赛意法微电子有限公司 半导体晶圆芯片分选方法、半导体产品的封装方法及系统
KR101991757B1 (ko) 2019-04-10 2019-09-30 (주)에이피텍 웨이퍼 레벨 패키징을 수행하는 자동화 시스템
US11293970B2 (en) 2020-01-12 2022-04-05 Kla Corporation Advanced in-line part average testing
US11754625B2 (en) 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147015A (ja) 2007-12-12 2009-07-02 Hitachi Ulsi Systems Co Ltd 半導体装置の検査方法、検査システム及び製造方法
JP2009302246A (ja) 2008-06-12 2009-12-24 Fujitsu Microelectronics Ltd 半導体装置の選別方法
US20140303912A1 (en) 2013-04-07 2014-10-09 Kla-Tencor Corporation System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring
JP2015032666A (ja) 2013-08-01 2015-02-16 ラピスセミコンダクタ株式会社 データ処理装置、測定装置、選別装置、データ処理方法およびプログラム
CN110596566A (zh) 2018-06-12 2019-12-20 北京华峰测控技术股份有限公司 一种用于ate系统的dpat测试方法

Also Published As

Publication number Publication date
TWI888691B (zh) 2025-07-01
KR102812585B1 (ko) 2025-05-26
US11656274B2 (en) 2023-05-23
CN116686076B (zh) 2024-12-24
US20220260632A1 (en) 2022-08-18
KR20230145420A (ko) 2023-10-17
EP4281998A1 (en) 2023-11-29
JP2024509684A (ja) 2024-03-05
TW202246787A (zh) 2022-12-01
CN116686076A (zh) 2023-09-01
IL304264A (en) 2023-09-01
WO2022173712A1 (en) 2022-08-18
EP4281998A4 (en) 2025-01-01

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