KR102812585B1 - 반도체 다이 패키지의 신뢰성을 평가하기 위한 시스템 및 방법 - Google Patents

반도체 다이 패키지의 신뢰성을 평가하기 위한 시스템 및 방법 Download PDF

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Publication number
KR102812585B1
KR102812585B1 KR1020237031120A KR20237031120A KR102812585B1 KR 102812585 B1 KR102812585 B1 KR 102812585B1 KR 1020237031120 A KR1020237031120 A KR 1020237031120A KR 20237031120 A KR20237031120 A KR 20237031120A KR 102812585 B1 KR102812585 B1 KR 102812585B1
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South Korea
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semiconductor die
semiconductor
reliability
risk
pat
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KR20230145420A (ko
Inventor
로버트 제이. 래서트
데이비드 더블유. 프라이스
체트 브이. 레녹스
오레스테 돈젤라
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케이엘에이 코포레이션
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    • H01L22/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020237031120A 2021-02-15 2022-02-08 반도체 다이 패키지의 신뢰성을 평가하기 위한 시스템 및 방법 Active KR102812585B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163149367P 2021-02-15 2021-02-15
US63/149,367 2021-02-15
US17/212,877 2021-03-25
US17/212,877 US11656274B2 (en) 2021-02-15 2021-03-25 Systems and methods for evaluating the reliability of semiconductor die packages
PCT/US2022/015561 WO2022173712A1 (en) 2021-02-15 2022-02-08 Systems and methods for evaluating the reliability of semiconductor die packages

Publications (2)

Publication Number Publication Date
KR20230145420A KR20230145420A (ko) 2023-10-17
KR102812585B1 true KR102812585B1 (ko) 2025-05-26

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KR1020237031120A Active KR102812585B1 (ko) 2021-02-15 2022-02-08 반도체 다이 패키지의 신뢰성을 평가하기 위한 시스템 및 방법

Country Status (8)

Country Link
US (1) US11656274B2 (https=)
EP (1) EP4281998A4 (https=)
JP (1) JP7664405B2 (https=)
KR (1) KR102812585B1 (https=)
CN (1) CN116686076B (https=)
IL (1) IL304264A (https=)
TW (1) TWI888691B (https=)
WO (1) WO2022173712A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
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US11754625B2 (en) * 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices
US12487282B2 (en) * 2021-12-28 2025-12-02 Advanced Micro Devices Products (China) Co., Ltd. On-chip distribution of test data for multiple dies
US20240371822A1 (en) * 2023-05-02 2024-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method
CN118380354B (zh) * 2024-06-26 2024-10-29 南通华隆微电子股份有限公司 一种半导体封装绷片压力自适应调节系统

Citations (1)

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WO2017171863A1 (en) 2016-04-01 2017-10-05 Intel Corporation Techniques for die stacking and associated configurations

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US7485548B2 (en) * 2006-03-10 2009-02-03 Micron Technology, Inc. Die loss estimation using universal in-line metric (UILM)
JP2009147015A (ja) 2007-12-12 2009-07-02 Hitachi Ulsi Systems Co Ltd 半導体装置の検査方法、検査システム及び製造方法
JP2009302246A (ja) 2008-06-12 2009-12-24 Fujitsu Microelectronics Ltd 半導体装置の選別方法
US20140303912A1 (en) 2013-04-07 2014-10-09 Kla-Tencor Corporation System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring
JP6166120B2 (ja) 2013-08-01 2017-07-19 ラピスセミコンダクタ株式会社 データ処理装置、測定装置、選別装置、データ処理方法およびプログラム
TWI538156B (zh) * 2014-01-07 2016-06-11 甯樹樑 晶片間無微接觸點之晶圓級晶片堆疊結構及其製造方法
US9653184B2 (en) 2014-06-16 2017-05-16 Sandisk Technologies Llc Non-volatile memory module with physical-to-physical address remapping
KR102521159B1 (ko) 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
US10761128B2 (en) 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US10726038B2 (en) * 2017-05-24 2020-07-28 MphasiS Limited System and method for optimizing aggregation and analysis of data across multiple data sources
US10585049B2 (en) * 2018-03-10 2020-03-10 Kla-Tencor Corporation Process-induced excursion characterization
US10867877B2 (en) * 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
CN110596566B (zh) 2018-06-12 2022-03-04 北京华峰测控技术股份有限公司 一种用于ate系统的dpat测试方法
CN109830447B (zh) * 2019-01-17 2020-11-27 深圳赛意法微电子有限公司 半导体晶圆芯片分选方法、半导体产品的封装方法及系统
KR101991757B1 (ko) 2019-04-10 2019-09-30 (주)에이피텍 웨이퍼 레벨 패키징을 수행하는 자동화 시스템
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US11754625B2 (en) 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices

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WO2017171863A1 (en) 2016-04-01 2017-10-05 Intel Corporation Techniques for die stacking and associated configurations

Non-Patent Citations (2)

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Title
비특허문헌1
비특허문헌2

Also Published As

Publication number Publication date
TWI888691B (zh) 2025-07-01
US11656274B2 (en) 2023-05-23
CN116686076B (zh) 2024-12-24
US20220260632A1 (en) 2022-08-18
KR20230145420A (ko) 2023-10-17
EP4281998A1 (en) 2023-11-29
JP2024509684A (ja) 2024-03-05
TW202246787A (zh) 2022-12-01
CN116686076A (zh) 2023-09-01
IL304264A (en) 2023-09-01
WO2022173712A1 (en) 2022-08-18
JP7664405B2 (ja) 2025-04-17
EP4281998A4 (en) 2025-01-01

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