IL304264A - Systems and methods for evaluating the reliability of semiconductor ring packages - Google Patents

Systems and methods for evaluating the reliability of semiconductor ring packages

Info

Publication number
IL304264A
IL304264A IL304264A IL30426423A IL304264A IL 304264 A IL304264 A IL 304264A IL 304264 A IL304264 A IL 304264A IL 30426423 A IL30426423 A IL 30426423A IL 304264 A IL304264 A IL 304264A
Authority
IL
Israel
Prior art keywords
evaluating
reliability
systems
methods
semiconductor die
Prior art date
Application number
IL304264A
Other languages
English (en)
Hebrew (he)
Original Assignee
Kla Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Corp filed Critical Kla Corp
Publication of IL304264A publication Critical patent/IL304264A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
IL304264A 2021-02-15 2023-07-05 Systems and methods for evaluating the reliability of semiconductor ring packages IL304264A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163149367P 2021-02-15 2021-02-15
US17/212,877 US11656274B2 (en) 2021-02-15 2021-03-25 Systems and methods for evaluating the reliability of semiconductor die packages
PCT/US2022/015561 WO2022173712A1 (en) 2021-02-15 2022-02-08 Systems and methods for evaluating the reliability of semiconductor die packages

Publications (1)

Publication Number Publication Date
IL304264A true IL304264A (en) 2023-09-01

Family

ID=82800286

Family Applications (1)

Application Number Title Priority Date Filing Date
IL304264A IL304264A (en) 2021-02-15 2023-07-05 Systems and methods for evaluating the reliability of semiconductor ring packages

Country Status (8)

Country Link
US (1) US11656274B2 (https=)
EP (1) EP4281998A4 (https=)
JP (1) JP7664405B2 (https=)
KR (1) KR102812585B1 (https=)
CN (1) CN116686076B (https=)
IL (1) IL304264A (https=)
TW (1) TWI888691B (https=)
WO (1) WO2022173712A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11754625B2 (en) * 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices
US12487282B2 (en) * 2021-12-28 2025-12-02 Advanced Micro Devices Products (China) Co., Ltd. On-chip distribution of test data for multiple dies
US20240371822A1 (en) * 2023-05-02 2024-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method
CN118380354B (zh) * 2024-06-26 2024-10-29 南通华隆微电子股份有限公司 一种半导体封装绷片压力自适应调节系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7485548B2 (en) * 2006-03-10 2009-02-03 Micron Technology, Inc. Die loss estimation using universal in-line metric (UILM)
JP2009147015A (ja) 2007-12-12 2009-07-02 Hitachi Ulsi Systems Co Ltd 半導体装置の検査方法、検査システム及び製造方法
JP2009302246A (ja) 2008-06-12 2009-12-24 Fujitsu Microelectronics Ltd 半導体装置の選別方法
US20140303912A1 (en) 2013-04-07 2014-10-09 Kla-Tencor Corporation System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring
JP6166120B2 (ja) 2013-08-01 2017-07-19 ラピスセミコンダクタ株式会社 データ処理装置、測定装置、選別装置、データ処理方法およびプログラム
TWI538156B (zh) * 2014-01-07 2016-06-11 甯樹樑 晶片間無微接觸點之晶圓級晶片堆疊結構及其製造方法
US9653184B2 (en) 2014-06-16 2017-05-16 Sandisk Technologies Llc Non-volatile memory module with physical-to-physical address remapping
KR102521159B1 (ko) 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
EP3437133A4 (en) * 2016-04-01 2019-11-27 INTEL Corporation TECHNIQUES FOR STACKING MATRICES AND ASSOCIATED CONFIGURATIONS
US10761128B2 (en) 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US10726038B2 (en) * 2017-05-24 2020-07-28 MphasiS Limited System and method for optimizing aggregation and analysis of data across multiple data sources
US10585049B2 (en) * 2018-03-10 2020-03-10 Kla-Tencor Corporation Process-induced excursion characterization
US10867877B2 (en) * 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
CN110596566B (zh) 2018-06-12 2022-03-04 北京华峰测控技术股份有限公司 一种用于ate系统的dpat测试方法
CN109830447B (zh) * 2019-01-17 2020-11-27 深圳赛意法微电子有限公司 半导体晶圆芯片分选方法、半导体产品的封装方法及系统
KR101991757B1 (ko) 2019-04-10 2019-09-30 (주)에이피텍 웨이퍼 레벨 패키징을 수행하는 자동화 시스템
US11293970B2 (en) 2020-01-12 2022-04-05 Kla Corporation Advanced in-line part average testing
US11754625B2 (en) 2020-01-30 2023-09-12 Kla Corporation System and method for identifying latent reliability defects in semiconductor devices

Also Published As

Publication number Publication date
TWI888691B (zh) 2025-07-01
KR102812585B1 (ko) 2025-05-26
US11656274B2 (en) 2023-05-23
CN116686076B (zh) 2024-12-24
US20220260632A1 (en) 2022-08-18
KR20230145420A (ko) 2023-10-17
EP4281998A1 (en) 2023-11-29
JP2024509684A (ja) 2024-03-05
TW202246787A (zh) 2022-12-01
CN116686076A (zh) 2023-09-01
WO2022173712A1 (en) 2022-08-18
JP7664405B2 (ja) 2025-04-17
EP4281998A4 (en) 2025-01-01

Similar Documents

Publication Publication Date Title
IL304264A (en) Systems and methods for evaluating the reliability of semiconductor ring packages
SG10201907920TA (en) Semiconductor Package And Method Of Manufacturing The Same
SG10201907458SA (en) Semiconductor device and method of manufacturing the same
EP4046192A4 (en) MICROELECTRONIC DEVICE ASSEMBLY AND PACKAGING AND ASSOCIATED METHODS AND SYSTEMS
SG10201907737SA (en) Semiconductor package and method of fabricating the same
SG10201907903YA (en) Method of forming and packaging semiconductor die
SG10202006561WA (en) Semiconductor device and method of fabricating the same
PL4298666T3 (pl) Podłoże opakowaniowe i urządzenie półprzewodnikowe zawierające takie podłoże
PL3916771T3 (pl) Podłoże opakowaniowe i urządzenie półprzewodnikowe zawierające takie podłoże
SG10201905833RA (en) Semiconductor device and manufacturing method of the semiconductor device
SG11202100905XA (en) Semiconductor package and method of forming the same
SG10201909446PA (en) Semiconductor memory device and method for forming the same
SG10201913388VA (en) Semiconductor package and method of forming the same
SG10201913140RA (en) Semiconductor package and method of forming the same
SG10201909519PA (en) Semiconductor memory device and manufacturing method thereof
WO2014113632A3 (en) Sealing device
SG10202007985RA (en) Semiconductor memory device and a method of fabricating the same
SG10201904480SA (en) Semiconductor chips and methods of manufacturing the same
SG10202004731SA (en) Semiconductor die, semiconductor wafer, semiconductor device including the semiconductor die and method of manufacturing the semiconductor device
SG10201907013YA (en) Semiconductor Device And Method Of Manufacturing The Same
TWI562323B (en) Semiconductor device package and method of manufacturing the same
SG10201911724QA (en) Vertical semiconductor device and method for fabricating the vertical semiconductor device
SG10201907327RA (en) Redistribution substrate, method of fabricating the same, and semiconductor package including the same
SG10201909074TA (en) Method Of Fabricating Semiconductor Package And Semiconductor Package
SG10202010251PA (en) Semiconductor memory device and method of operating the same