JP2023517873A5 - - Google Patents

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Publication number
JP2023517873A5
JP2023517873A5 JP2022552923A JP2022552923A JP2023517873A5 JP 2023517873 A5 JP2023517873 A5 JP 2023517873A5 JP 2022552923 A JP2022552923 A JP 2022552923A JP 2022552923 A JP2022552923 A JP 2022552923A JP 2023517873 A5 JP2023517873 A5 JP 2023517873A5
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JP
Japan
Prior art keywords
dies
predicted
yield
yield value
value
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JP2022552923A
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English (en)
Japanese (ja)
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JP2023517873A (ja
JP7518180B2 (ja
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Priority claimed from PCT/US2021/020396 external-priority patent/WO2021178361A1/en
Publication of JP2023517873A publication Critical patent/JP2023517873A/ja
Publication of JP2023517873A5 publication Critical patent/JP2023517873A5/ja
Application granted granted Critical
Publication of JP7518180B2 publication Critical patent/JP7518180B2/ja
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JP2022552923A 2020-03-03 2021-03-02 寿命初期故障を起こしやすいダイの予測 Active JP7518180B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062984337P 2020-03-03 2020-03-03
US62/984,337 2020-03-03
PCT/US2021/020396 WO2021178361A1 (en) 2020-03-03 2021-03-02 Predicting die susceptible to early lifetime failure

Publications (3)

Publication Number Publication Date
JP2023517873A JP2023517873A (ja) 2023-04-27
JP2023517873A5 true JP2023517873A5 (https=) 2024-03-12
JP7518180B2 JP7518180B2 (ja) 2024-07-17

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JP2022552923A Active JP7518180B2 (ja) 2020-03-03 2021-03-02 寿命初期故障を起こしやすいダイの予測

Country Status (6)

Country Link
US (1) US11328108B2 (https=)
JP (1) JP7518180B2 (https=)
KR (1) KR102797770B1 (https=)
CN (1) CN115362457B (https=)
TW (1) TWI862795B (https=)
WO (1) WO2021178361A1 (https=)

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KR20230049810A (ko) * 2021-10-06 2023-04-14 삼성전자주식회사 컴퓨팅 장치, 그것을 갖는 트랜지스터 모델링 장치, 및 그것의 동작 방법
JP7777433B2 (ja) * 2021-11-25 2025-11-28 株式会社フジクラ 検査装置、検査方法、検査プログラム、半導体デバイスの製造方法
TWI841293B (zh) * 2023-03-14 2024-05-01 華邦電子股份有限公司 記憶體測試方法及裝置
CN119129403B (zh) * 2024-08-29 2025-04-25 辰极智航(北京)科技有限公司 一种芯片立体封装工艺技术的可靠性数据管理方法及系统

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US6789032B2 (en) 2001-12-26 2004-09-07 International Business Machines Corporation Method of statistical binning for reliability selection
US8017411B2 (en) * 2002-12-18 2011-09-13 GlobalFoundries, Inc. Dynamic adaptive sampling rate for model prediction
US7440869B1 (en) 2004-05-26 2008-10-21 Pdf Solutions, Inc. Mapping yield information of semiconductor dice
US8042070B2 (en) 2007-10-23 2011-10-18 International Business Machines Corporation Methods and system for analysis and management of parametric yield
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JP5297272B2 (ja) * 2009-06-11 2013-09-25 株式会社日立製作所 装置異常監視方法及びシステム
JP5799508B2 (ja) 2011-01-14 2015-10-28 富士通セミコンダクター株式会社 欠陥検査装置及び欠陥検査方法
KR102521159B1 (ko) 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
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