KR102797770B1 - 조기 수명 장애에 취약한 다이 예측 - Google Patents

조기 수명 장애에 취약한 다이 예측 Download PDF

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KR102797770B1
KR102797770B1 KR1020227033698A KR20227033698A KR102797770B1 KR 102797770 B1 KR102797770 B1 KR 102797770B1 KR 1020227033698 A KR1020227033698 A KR 1020227033698A KR 20227033698 A KR20227033698 A KR 20227033698A KR 102797770 B1 KR102797770 B1 KR 102797770B1
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dies
predicted
yield
die
value
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KR20220149714A (ko
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리차드 버치
칭 주
키스 아놀드
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피디에프 솔루션즈, 인코포레이티드
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/27—Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/02—Reliability analysis or reliability optimisation; Failure analysis, e.g. worst case scenario performance, failure mode and effects analysis [FMEA]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/04—Ageing analysis or optimisation against ageing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/22—Yield analysis or yield optimisation

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Geometry (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020227033698A 2020-03-03 2021-03-02 조기 수명 장애에 취약한 다이 예측 Active KR102797770B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062984337P 2020-03-03 2020-03-03
US62/984,337 2020-03-03
PCT/US2021/020396 WO2021178361A1 (en) 2020-03-03 2021-03-02 Predicting die susceptible to early lifetime failure

Publications (2)

Publication Number Publication Date
KR20220149714A KR20220149714A (ko) 2022-11-08
KR102797770B1 true KR102797770B1 (ko) 2025-04-17

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KR1020227033698A Active KR102797770B1 (ko) 2020-03-03 2021-03-02 조기 수명 장애에 취약한 다이 예측

Country Status (6)

Country Link
US (1) US11328108B2 (https=)
JP (1) JP7518180B2 (https=)
KR (1) KR102797770B1 (https=)
CN (1) CN115362457B (https=)
TW (1) TWI862795B (https=)
WO (1) WO2021178361A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230049810A (ko) * 2021-10-06 2023-04-14 삼성전자주식회사 컴퓨팅 장치, 그것을 갖는 트랜지스터 모델링 장치, 및 그것의 동작 방법
JP7777433B2 (ja) * 2021-11-25 2025-11-28 株式会社フジクラ 検査装置、検査方法、検査プログラム、半導体デバイスの製造方法
TWI841293B (zh) * 2023-03-14 2024-05-01 華邦電子股份有限公司 記憶體測試方法及裝置
CN119129403B (zh) * 2024-08-29 2025-04-25 辰极智航(北京)科技有限公司 一种芯片立体封装工艺技术的可靠性数据管理方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040121495A1 (en) 2002-12-18 2004-06-24 Sonderman Thomas J. Dynamic adaptive sampling rate for model prediction
US20120136629A1 (en) 2009-06-11 2012-05-31 Kenji Tamaki Apparatus abnormality monitoring method and system
US20170176983A1 (en) 2015-12-17 2017-06-22 Lam Research Corporation Methods and apparatuses for etch profile matching by surface kinetic model optimization
US20200051235A1 (en) 2018-08-10 2020-02-13 Micron Technology, Inc. System for predicting properties of structures, imager system, and related methods

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265232B1 (en) 1998-08-21 2001-07-24 Micron Technology, Inc. Yield based, in-line defect sampling method
US6789032B2 (en) 2001-12-26 2004-09-07 International Business Machines Corporation Method of statistical binning for reliability selection
US7440869B1 (en) 2004-05-26 2008-10-21 Pdf Solutions, Inc. Mapping yield information of semiconductor dice
US8042070B2 (en) 2007-10-23 2011-10-18 International Business Machines Corporation Methods and system for analysis and management of parametric yield
US20110153660A1 (en) 2008-10-15 2011-06-23 Inotera Memories, Inc. Method of searching for key semiconductor operation with randomization for wafer position
JP5799508B2 (ja) 2011-01-14 2015-10-28 富士通セミコンダクター株式会社 欠陥検査装置及び欠陥検査方法
KR102521159B1 (ko) 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
EP3352013A1 (en) * 2017-01-23 2018-07-25 ASML Netherlands B.V. Generating predicted data for control or monitoring of a production process
US11086229B2 (en) * 2017-05-05 2021-08-10 Asml Netherlands B.V. Method to predict yield of a device manufacturing process
US10522376B2 (en) * 2017-10-20 2019-12-31 Kla-Tencor Corporation Multi-step image alignment method for large offset die-die inspection
KR102549196B1 (ko) * 2018-02-07 2023-06-30 어플라이드 머티리얼즈 이스라엘 리미티드 반도체 시편의 심층 학습 기반 검사 방법 및 그의 시스템
US10867877B2 (en) * 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
CN110378490A (zh) * 2019-07-24 2019-10-25 江苏壹度科技股份有限公司 基于改进鲸鱼算法优化支持向量机的半导体良率预测方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040121495A1 (en) 2002-12-18 2004-06-24 Sonderman Thomas J. Dynamic adaptive sampling rate for model prediction
US20120136629A1 (en) 2009-06-11 2012-05-31 Kenji Tamaki Apparatus abnormality monitoring method and system
US20170176983A1 (en) 2015-12-17 2017-06-22 Lam Research Corporation Methods and apparatuses for etch profile matching by surface kinetic model optimization
US20200051235A1 (en) 2018-08-10 2020-02-13 Micron Technology, Inc. System for predicting properties of structures, imager system, and related methods

Also Published As

Publication number Publication date
JP2023517873A (ja) 2023-04-27
WO2021178361A1 (en) 2021-09-10
TW202146918A (zh) 2021-12-16
US20210279388A1 (en) 2021-09-09
US11328108B2 (en) 2022-05-10
JP7518180B2 (ja) 2024-07-17
CN115362457B (zh) 2024-01-23
TWI862795B (zh) 2024-11-21
KR20220149714A (ko) 2022-11-08
CN115362457A (zh) 2022-11-18

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