TWI862795B - 用於預測容易發生早期故障的晶粒之方法及模組 - Google Patents

用於預測容易發生早期故障的晶粒之方法及模組 Download PDF

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TWI862795B
TWI862795B TW110107496A TW110107496A TWI862795B TW I862795 B TWI862795 B TW I862795B TW 110107496 A TW110107496 A TW 110107496A TW 110107496 A TW110107496 A TW 110107496A TW I862795 B TWI862795 B TW I862795B
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dies
die
yield
predicted
value
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TW110107496A
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TW202146918A (zh
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理查 伯奇
祝青
基斯 阿諾德
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美商Ｐｄｆ對策公司
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/27—Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/02—Reliability analysis or reliability optimisation; Failure analysis, e.g. worst case scenario performance, failure mode and effects analysis [FMEA]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/04—Ageing analysis or optimisation against ageing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/22—Yield analysis or yield optimisation

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Geometry (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW110107496A 2020-03-03 2021-03-03 用於預測容易發生早期故障的晶粒之方法及模組 TWI862795B (zh)

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US202062984337P 2020-03-03 2020-03-03
US62/984,337 2020-03-03

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TW202146918A TW202146918A (zh) 2021-12-16
TWI862795B true TWI862795B (zh) 2024-11-21

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US (1) US11328108B2 (https=)
JP (1) JP7518180B2 (https=)
KR (1) KR102797770B1 (https=)
CN (1) CN115362457B (https=)
TW (1) TWI862795B (https=)
WO (1) WO2021178361A1 (https=)

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KR20230049810A (ko) * 2021-10-06 2023-04-14 삼성전자주식회사 컴퓨팅 장치, 그것을 갖는 트랜지스터 모델링 장치, 및 그것의 동작 방법
JP7777433B2 (ja) * 2021-11-25 2025-11-28 株式会社フジクラ 検査装置、検査方法、検査プログラム、半導体デバイスの製造方法
TWI841293B (zh) * 2023-03-14 2024-05-01 華邦電子股份有限公司 記憶體測試方法及裝置
CN119129403B (zh) * 2024-08-29 2025-04-25 辰极智航(北京)科技有限公司 一种芯片立体封装工艺技术的可靠性数据管理方法及系统

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TW201841066A (zh) * 2017-01-23 2018-11-16 荷蘭商Ａｓｍｌ荷蘭公司 產生用於控制或監控一生產程序的經預測資料
TW201928541A (zh) * 2017-10-20 2019-07-16 美商克萊譚克公司 用於大型偏移晶粒對晶粒檢測之多步驟影像對準方法
TW201935590A (zh) * 2018-02-07 2019-09-01 以色列商應用材料以色列公司 半導體樣品的基於深度學習的檢查的方法及其系統
US20200051235A1 (en) * 2018-08-10 2020-02-13 Micron Technology, Inc. System for predicting properties of structures, imager system, and related methods

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US8017411B2 (en) * 2002-12-18 2011-09-13 GlobalFoundries, Inc. Dynamic adaptive sampling rate for model prediction
US7440869B1 (en) 2004-05-26 2008-10-21 Pdf Solutions, Inc. Mapping yield information of semiconductor dice
US8042070B2 (en) 2007-10-23 2011-10-18 International Business Machines Corporation Methods and system for analysis and management of parametric yield
US20110153660A1 (en) 2008-10-15 2011-06-23 Inotera Memories, Inc. Method of searching for key semiconductor operation with randomization for wafer position
JP5799508B2 (ja) 2011-01-14 2015-10-28 富士通セミコンダクター株式会社 欠陥検査装置及び欠陥検査方法
KR102521159B1 (ko) 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
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CN110378490A (zh) * 2019-07-24 2019-10-25 江苏壹度科技股份有限公司 基于改进鲸鱼算法优化支持向量机的半导体良率预测方法

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US20120136629A1 (en) * 2009-06-11 2012-05-31 Kenji Tamaki Apparatus abnormality monitoring method and system
TW201841066A (zh) * 2017-01-23 2018-11-16 荷蘭商Ａｓｍｌ荷蘭公司 產生用於控制或監控一生產程序的經預測資料
TW201928541A (zh) * 2017-10-20 2019-07-16 美商克萊譚克公司 用於大型偏移晶粒對晶粒檢測之多步驟影像對準方法
TW201935590A (zh) * 2018-02-07 2019-09-01 以色列商應用材料以色列公司 半導體樣品的基於深度學習的檢查的方法及其系統
US20200051235A1 (en) * 2018-08-10 2020-02-13 Micron Technology, Inc. System for predicting properties of structures, imager system, and related methods

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Publication number Publication date
JP2023517873A (ja) 2023-04-27
WO2021178361A1 (en) 2021-09-10
TW202146918A (zh) 2021-12-16
US20210279388A1 (en) 2021-09-09
US11328108B2 (en) 2022-05-10
KR102797770B1 (ko) 2025-04-17
JP7518180B2 (ja) 2024-07-17
CN115362457B (zh) 2024-01-23
KR20220149714A (ko) 2022-11-08
CN115362457A (zh) 2022-11-18

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