JP2021515993A5 - - Google Patents

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Publication number
JP2021515993A5
JP2021515993A5 JP2020571333A JP2020571333A JP2021515993A5 JP 2021515993 A5 JP2021515993 A5 JP 2021515993A5 JP 2020571333 A JP2020571333 A JP 2020571333A JP 2020571333 A JP2020571333 A JP 2020571333A JP 2021515993 A5 JP2021515993 A5 JP 2021515993A5
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JP
Japan
Prior art keywords
dies
steps include
map
deviation
die
Prior art date
Application number
JP2020571333A
Other languages
English (en)
Japanese (ja)
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JPWO2019177895A5 (https=
JP2021515993A (ja
JP7097466B2 (ja
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Priority claimed from US16/273,876 external-priority patent/US10585049B2/en
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Publication of JP2021515993A publication Critical patent/JP2021515993A/ja
Publication of JPWO2019177895A5 publication Critical patent/JPWO2019177895A5/ja
Publication of JP2021515993A5 publication Critical patent/JP2021515993A5/ja
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JP2020571333A 2018-03-10 2019-03-08 プロセス誘起逸脱特性評価 Active JP7097466B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862641297P 2018-03-10 2018-03-10
US62/641,297 2018-03-10
US16/273,876 2019-02-12
US16/273,876 US10585049B2 (en) 2018-03-10 2019-02-12 Process-induced excursion characterization
PCT/US2019/021389 WO2019177895A1 (en) 2018-03-10 2019-03-08 Process-induced excursion characterization

Publications (4)

Publication Number Publication Date
JP2021515993A JP2021515993A (ja) 2021-06-24
JPWO2019177895A5 JPWO2019177895A5 (https=) 2022-03-10
JP2021515993A5 true JP2021515993A5 (https=) 2022-03-10
JP7097466B2 JP7097466B2 (ja) 2022-07-07

Family

ID=67843829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020571333A Active JP7097466B2 (ja) 2018-03-10 2019-03-08 プロセス誘起逸脱特性評価

Country Status (8)

Country Link
US (1) US10585049B2 (https=)
JP (1) JP7097466B2 (https=)
KR (1) KR102443351B1 (https=)
CN (1) CN111937129B (https=)
IL (1) IL277250B2 (https=)
SG (1) SG11202008760WA (https=)
TW (1) TWI797271B (https=)
WO (1) WO2019177895A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11656274B2 (en) * 2021-02-15 2023-05-23 Kla Corporation Systems and methods for evaluating the reliability of semiconductor die packages
US12191215B2 (en) * 2021-10-22 2025-01-07 Nanya Technology Corporation Manufacturing and measuring system for semiconductor structures
US12431393B2 (en) 2021-10-26 2025-09-30 Nanya Technology Corporation Manufacturing method for semiconductor structures

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3698075B2 (ja) * 2001-06-20 2005-09-21 株式会社日立製作所 半導体基板の検査方法およびその装置
US6885977B2 (en) 2002-12-20 2005-04-26 Applied Materials, Inc. System to identify a wafer manufacturing problem and method therefor
JP3896996B2 (ja) * 2003-06-27 2007-03-22 株式会社日立製作所 回路パターンの検査装置および検査方法
US7394534B1 (en) 2003-11-19 2008-07-01 Kla-Tencor Corporation Process excursion detection
KR100909474B1 (ko) * 2005-08-10 2009-07-28 삼성전자주식회사 웨이퍼 결함지수를 사용하여 국부성 불량 모드를 갖는결함성 반도체 웨이퍼의 검출 방법들 및 이에 사용되는장비들
KR101565071B1 (ko) * 2005-11-18 2015-11-03 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8284394B2 (en) 2006-02-09 2012-10-09 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of a wafer
US8611639B2 (en) * 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
US7937234B2 (en) * 2008-08-29 2011-05-03 Intel Corporation Classification of spatial patterns on wafer maps
CN102292804B (zh) * 2009-02-03 2014-02-12 Q概念技术公司 利用非振动接触势差传感器的图案化晶片检查系统
US10192303B2 (en) * 2012-11-12 2019-01-29 Kla Tencor Corporation Method and system for mixed mode wafer inspection
US10101386B2 (en) 2014-02-14 2018-10-16 Texas Instruments Incorporated Real time semiconductor process excursion monitor
KR102574171B1 (ko) * 2014-08-29 2023-09-06 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법, 타겟 및 기판
JP6685301B2 (ja) * 2014-11-19 2020-04-22 デカ テクノロジーズ インコーポレイテッド ユニット固有パターニングの自動光学検査
US10747830B2 (en) * 2014-11-21 2020-08-18 Mesh Labs Inc. Method and system for displaying electronic information
US9779202B2 (en) * 2015-06-22 2017-10-03 Kla-Tencor Corporation Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements

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