JP2022526748A5 - - Google Patents
Info
- Publication number
- JP2022526748A5 JP2022526748A5 JP2021556496A JP2021556496A JP2022526748A5 JP 2022526748 A5 JP2022526748 A5 JP 2022526748A5 JP 2021556496 A JP2021556496 A JP 2021556496A JP 2021556496 A JP2021556496 A JP 2021556496A JP 2022526748 A5 JP2022526748 A5 JP 2022526748A5
- Authority
- JP
- Japan
- Prior art keywords
- measurement
- parameter
- positional
- positional displacement
- displacement measurement
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962821596P | 2019-03-21 | 2019-03-21 | |
| US62/821,596 | 2019-03-21 | ||
| PCT/US2019/047797 WO2020190318A1 (en) | 2019-03-21 | 2019-08-23 | Parameter-stable misregistration measurement amelioration in semiconductor devices |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2022526748A JP2022526748A (ja) | 2022-05-26 |
| JPWO2020190318A5 JPWO2020190318A5 (https=) | 2022-08-25 |
| JP2022526748A5 true JP2022526748A5 (https=) | 2022-08-25 |
| JP7177949B2 JP7177949B2 (ja) | 2022-11-24 |
Family
ID=72521076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021556496A Active JP7177949B2 (ja) | 2019-03-21 | 2019-08-23 | 半導体デバイスにおけるパラメタ安定位置ずれ計測改善 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11101153B2 (https=) |
| JP (1) | JP7177949B2 (https=) |
| KR (1) | KR102509764B1 (https=) |
| CN (1) | CN113574643B (https=) |
| TW (1) | TWI845639B (https=) |
| WO (1) | WO2020190318A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102817032B1 (ko) | 2020-04-05 | 2025-06-04 | 케이엘에이 코포레이션 | 웨이퍼 틸트가 오정합 측정에 끼친 영향을 보정하기 시스템 및 방법 |
| US12165930B2 (en) | 2021-06-03 | 2024-12-10 | Kla Corporation | Adaptive modeling misregistration measurement system and method |
| TWI833185B (zh) * | 2022-01-04 | 2024-02-21 | 南亞科技股份有限公司 | 疊置誤差的校正方法及半導體元件的製備方法 |
| US12002765B2 (en) | 2022-01-04 | 2024-06-04 | Nanya Technology Corporation | Marks for overlay measurement and overlay error correction |
| US11796924B2 (en) | 2022-01-04 | 2023-10-24 | Nanya Technology Corporation | Method for overlay error correction and method for manufacturing a semiconductor device structure with overlay marks |
| US12487533B2 (en) | 2024-01-25 | 2025-12-02 | Kla Corporation | Amplitude asymmetry measurements in overlay metrology |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6064486A (en) * | 1998-05-21 | 2000-05-16 | Leland Stanford Junior University | Systems, methods and computer program products for detecting the position of a new alignment mark on a substrate based on fitting to sample alignment signals |
| US6281027B1 (en) * | 1999-09-15 | 2001-08-28 | Therma-Wave Inc | Spatial averaging technique for ellipsometry and reflectometry |
| US6462818B1 (en) * | 2000-06-22 | 2002-10-08 | Kla-Tencor Corporation | Overlay alignment mark design |
| TW569368B (en) * | 2001-11-14 | 2004-01-01 | Tokyo Electron Ltd | Substrate inspecting apparatus, coating and developing apparatus, and substrate inspecting method |
| EP1512112A4 (en) * | 2002-06-05 | 2006-11-02 | Kla Tencor Tech Corp | USE OF OVERLAY DIAGNOSIS FOR ADVANCED AUTOMATIC PROCESS CONTROL |
| JP4072465B2 (ja) * | 2003-06-19 | 2008-04-09 | キヤノン株式会社 | 位置検出方法 |
| WO2005098686A2 (en) * | 2004-04-02 | 2005-10-20 | Clear Shape Technologies, Inc. | Modeling resolution enhancement processes in integrated circuit fabrication |
| US20070099097A1 (en) * | 2005-11-03 | 2007-05-03 | Samsung Electronics Co., Ltd. | Multi-purpose measurement marks for semiconductor devices, and methods, systems and computer program products for using same |
| CN101063661B (zh) * | 2006-04-29 | 2010-05-12 | 中芯国际集成电路制造(上海)有限公司 | 利用微影区域迭对测量仪监控硅单晶外延层层错状况的方法 |
| TWI416096B (zh) * | 2007-07-11 | 2013-11-21 | Nova Measuring Instr Ltd | 用於監控圖案化結構的性質之方法及系統 |
| US7873585B2 (en) * | 2007-08-31 | 2011-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for predicting a semiconductor parameter across an area of a wafer |
| US8214771B2 (en) * | 2009-01-08 | 2012-07-03 | Kla-Tencor Corporation | Scatterometry metrology target design optimization |
| CN105074896B (zh) * | 2013-02-20 | 2018-04-27 | 株式会社日立高新技术 | 图案测定装置以及半导体测量系统 |
| US10296554B2 (en) * | 2013-03-01 | 2019-05-21 | Nanometrics Incorporated | Correction of angular error of plane-of-incidence azimuth of optical metrology device |
| CN103398666B (zh) * | 2013-05-27 | 2015-12-23 | 电子科技大学 | 一种用于双层周期性微结构的层间错位测试方法 |
| US9383661B2 (en) * | 2013-08-10 | 2016-07-05 | Kla-Tencor Corporation | Methods and apparatus for determining focus |
| WO2015031337A1 (en) * | 2013-08-27 | 2015-03-05 | Kla-Tencor Corporation | Removing process-variation-related inaccuracies from scatterometry measurements |
| US10152654B2 (en) * | 2014-02-20 | 2018-12-11 | Kla-Tencor Corporation | Signal response metrology for image based overlay measurements |
| TWI715582B (zh) * | 2015-05-19 | 2021-01-11 | 美商克萊譚克公司 | 用於疊對測量之形貌相位控制 |
| US10504759B2 (en) * | 2016-04-04 | 2019-12-10 | Kla-Tencor Corporation | Semiconductor metrology with information from multiple processing steps |
-
2019
- 2019-08-23 WO PCT/US2019/047797 patent/WO2020190318A1/en not_active Ceased
- 2019-08-23 JP JP2021556496A patent/JP7177949B2/ja active Active
- 2019-08-23 KR KR1020217033551A patent/KR102509764B1/ko active Active
- 2019-08-23 CN CN201980093578.7A patent/CN113574643B/zh active Active
- 2019-08-23 US US16/496,918 patent/US11101153B2/en active Active
-
2020
- 2020-03-16 TW TW109108584A patent/TWI845639B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2022526748A5 (https=) | ||
| TWI752237B (zh) | 疊加度量衡方法及系統 | |
| KR102321887B1 (ko) | 산업 프로세스를 제어하기 위한 방법 및 장치 | |
| KR102509764B1 (ko) | 반도체 디바이스에서의 파라미터-안정적 오정렬 측정 개선 | |
| TWI649641B (zh) | 判定圖案化製程之校正之方法、元件製造方法、用於微影裝置之控制系統及微影裝置 | |
| US9513565B2 (en) | Using wafer geometry to improve scanner correction effectiveness for overlay control | |
| US20130201461A1 (en) | Method and apparatus to characterize photolithography lens quality | |
| JP2020533787A (ja) | 光計測を質量計測と組合せるためのシステム及び方法 | |
| US20160062252A1 (en) | Breakdown Analysis of Geometry Induced Overlay and Utilization of Breakdown Analysis for Improved Overlay Control | |
| TW201617978A (zh) | 基於預測模型化之聚焦誤差預測 | |
| US11862521B2 (en) | Multiple-tool parameter set calibration and misregistration measurement system and method | |
| TW201903534A (zh) | 最佳化微影製程之方法及裝置 | |
| TW202043931A (zh) | 使用結合光學與電子束之技術的偏移量測 | |
| US20170363970A1 (en) | Test structure for use in metrology measurements of patterns | |
| JPWO2020190318A5 (https=) | ||
| US10008422B2 (en) | Method for assessing the usability of an exposed and developed semiconductor wafer | |
| CN108885407A (zh) | 叠加方差稳定化方法及系统 | |
| TWI877260B (zh) | 基於計量景觀之用於計量優化之系統及方法 | |
| TWI544288B (zh) | 疊對度量方法 | |
| US20240134290A1 (en) | Multi-wavelength selection method for overlay measurement, and overlay measurement method and semiconductor device manufacturing method using multi-wavelengths | |
| JP2022160187A5 (https=) |