JP2022542557A5 - - Google Patents
Info
- Publication number
- JP2022542557A5 JP2022542557A5 JP2022503926A JP2022503926A JP2022542557A5 JP 2022542557 A5 JP2022542557 A5 JP 2022542557A5 JP 2022503926 A JP2022503926 A JP 2022503926A JP 2022503926 A JP2022503926 A JP 2022503926A JP 2022542557 A5 JP2022542557 A5 JP 2022542557A5
- Authority
- JP
- Japan
- Prior art keywords
- overlay measurement
- measurement system
- machine learning
- learning algorithm
- recipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962877397P | 2019-07-23 | 2019-07-23 | |
| US62/877,397 | 2019-07-23 | ||
| US16/919,378 | 2020-07-02 | ||
| US16/919,378 US11340060B2 (en) | 2019-07-23 | 2020-07-02 | Automatic recipe optimization for overlay metrology system |
| PCT/US2020/042699 WO2021016144A1 (en) | 2019-07-23 | 2020-07-20 | Automatic recipe optimization for overlay metrology system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022542557A JP2022542557A (ja) | 2022-10-05 |
| JP2022542557A5 true JP2022542557A5 (https=) | 2023-07-04 |
| JP7369851B2 JP7369851B2 (ja) | 2023-10-26 |
Family
ID=74189904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022503926A Active JP7369851B2 (ja) | 2019-07-23 | 2020-07-20 | オーバーレイ計測システム用の自動レシピ最適化 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11340060B2 (https=) |
| JP (1) | JP7369851B2 (https=) |
| KR (1) | KR102630494B1 (https=) |
| CN (1) | CN114514542B (https=) |
| TW (1) | TWI821585B (https=) |
| WO (1) | WO2021016144A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI740529B (zh) * | 2020-06-05 | 2021-09-21 | 財團法人資訊工業策進會 | 分層建模之方法及系統 |
| US12430401B2 (en) * | 2020-09-08 | 2025-09-30 | Wisconsin Alumni Research Foundation | System for automatic error estimate correction for a machine learning model |
| US12250503B2 (en) * | 2020-12-24 | 2025-03-11 | Applied Materials Israel Ltd. | Prediction of electrical properties of a semiconductor specimen |
| TW202400966A (zh) * | 2022-03-21 | 2024-01-01 | 美商艾拉奇公司 | 用於繞射式覆蓋的外差式光學相位測量裝置 |
| KR102519813B1 (ko) | 2022-10-17 | 2023-04-11 | (주)오로스테크놀로지 | 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램 |
| KR102546552B1 (ko) | 2022-11-14 | 2023-06-22 | (주)오로스테크놀로지 | 오버레이 계측 장치의 동작을 제어하는 데이터를 저장하기 위한 데이터 구조를 기록한 컴퓨터 판독 가능 저장 매체 및 이를 위한 오버레이 계측 장치 |
| KR102560241B1 (ko) | 2022-11-14 | 2023-07-28 | (주)오로스테크놀로지 | 딥러닝 기반 오버레이 키 센터링 시스템 및 그 방법 |
| US20240210916A1 (en) * | 2022-12-22 | 2024-06-27 | Applied Materials, Inc. | Machine and deep learning techniques for predicting ecological efficiency in substrate processing |
| KR102936585B1 (ko) | 2023-05-08 | 2026-03-09 | 삼성전자주식회사 | 다중 피크 포커스를 가진 웨이퍼에서의 포커스 최적화 방식 |
| US12615990B2 (en) * | 2023-07-19 | 2026-04-28 | Tokyo Electron Limited | Integrated metrology for process controls in wafer bonding system |
| KR102882312B1 (ko) | 2023-08-23 | 2025-11-06 | (주) 오로스테크놀로지 | 오버레이 계측 장치 및 방법 |
| KR102738956B1 (ko) * | 2023-10-31 | 2024-12-06 | (주)오로스 테크놀로지 | 오버레이 계측 방법 및 오버레이 계측 시스템 |
| US20260064014A1 (en) * | 2024-09-04 | 2026-03-05 | Kla Corporation | System and method for target centering detection in overlay metrology |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7171284B2 (en) | 2004-09-21 | 2007-01-30 | Timbre Technologies, Inc. | Optical metrology model optimization based on goals |
| US7525673B2 (en) | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Optimizing selected variables of an optical metrology system |
| US7949490B2 (en) | 2007-08-30 | 2011-05-24 | Tokyo Electron Limited | Determining profile parameters of a structure using approximation and fine diffraction models in optical metrology |
| US8396582B2 (en) * | 2008-03-08 | 2013-03-12 | Tokyo Electron Limited | Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool |
| US7742889B2 (en) | 2008-03-27 | 2010-06-22 | Tokyo Electron Limited | Designing an optical metrology system optimized with signal criteria |
| US7761178B2 (en) | 2008-06-18 | 2010-07-20 | Tokyo Electron Limited | Automated process control using an optical metrology system optimized with design goals |
| DE102009006887B3 (de) * | 2009-01-30 | 2010-07-15 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zur Halbleiterprozesssteuerung und Überwachung unter Anwendung eines Datenqualitätsmaßes |
| US8577820B2 (en) | 2011-03-04 | 2013-11-05 | Tokyo Electron Limited | Accurate and fast neural network training for library-based critical dimension (CD) metrology |
| EP3779598B1 (en) * | 2011-04-06 | 2022-12-21 | Kla-Tencor Corporation | Method for providing a set of process tool correctables |
| US20130110477A1 (en) | 2011-10-31 | 2013-05-02 | Stilian Pandev | Process variation-based model optimization for metrology |
| US10255385B2 (en) | 2012-03-28 | 2019-04-09 | Kla-Tencor Corporation | Model optimization approach based on spectral sensitivity |
| US9490182B2 (en) | 2013-12-23 | 2016-11-08 | Kla-Tencor Corporation | Measurement of multiple patterning parameters |
| US10152654B2 (en) * | 2014-02-20 | 2018-12-11 | Kla-Tencor Corporation | Signal response metrology for image based overlay measurements |
| US10352876B2 (en) | 2014-05-09 | 2019-07-16 | KLA—Tencor Corporation | Signal response metrology for scatterometry based overlay measurements |
| US10210606B2 (en) * | 2014-10-14 | 2019-02-19 | Kla-Tencor Corporation | Signal response metrology for image based and scatterometry overlay measurements |
| US9710728B2 (en) * | 2014-10-28 | 2017-07-18 | Kla-Tencor Corporation | Image based signal response metrology |
| KR102521159B1 (ko) * | 2014-11-25 | 2023-04-13 | 피디에프 솔루션즈, 인코포레이티드 | 반도체 제조 공정을 위한 개선된 공정 제어 기술 |
| US10430719B2 (en) | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US10409165B2 (en) | 2014-12-15 | 2019-09-10 | Asml Netherlands B.V. | Optimization based on machine learning |
| US9903711B2 (en) * | 2015-04-06 | 2018-02-27 | KLA—Tencor Corporation | Feed forward of metrology data in a metrology system |
| US10360477B2 (en) | 2016-01-11 | 2019-07-23 | Kla-Tencor Corp. | Accelerating semiconductor-related computations using learning based models |
| CN116936393B (zh) * | 2016-02-24 | 2024-12-20 | 科磊股份有限公司 | 光学计量的准确度提升 |
| KR102334937B1 (ko) * | 2016-10-21 | 2021-12-03 | 에이에스엠엘 네델란즈 비.브이. | 패터닝 프로세스용 보정 결정 방법 |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| US10395362B2 (en) * | 2017-04-07 | 2019-08-27 | Kla-Tencor Corp. | Contour based defect detection |
| US11275361B2 (en) * | 2017-06-30 | 2022-03-15 | Kla-Tencor Corporation | Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process |
| US10401738B2 (en) * | 2017-08-02 | 2019-09-03 | Kla-Tencor Corporation | Overlay metrology using multiple parameter configurations |
-
2020
- 2020-07-02 US US16/919,378 patent/US11340060B2/en active Active
- 2020-07-20 JP JP2022503926A patent/JP7369851B2/ja active Active
- 2020-07-20 WO PCT/US2020/042699 patent/WO2021016144A1/en not_active Ceased
- 2020-07-20 CN CN202080052179.9A patent/CN114514542B/zh active Active
- 2020-07-20 KR KR1020227004733A patent/KR102630494B1/ko active Active
- 2020-07-21 TW TW109124568A patent/TWI821585B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2022542557A5 (https=) | ||
| US11650968B2 (en) | Systems and methods for predictive early stopping in neural network training | |
| Liu et al. | Mechanistically informed data-driven modeling of cyclic plasticity via artificial neural networks | |
| US20170326771A1 (en) | Abrasion amount estimation device and abrasion amount estimation method for check valve of injection molding machine | |
| CN110991495B (zh) | 生产制造过程中产品质量预测方法、系统、介质及设备 | |
| CN112534362B (zh) | 控制装置、控制方法及计算机可读存储介质 | |
| JP2022507110A5 (https=) | ||
| US20010051858A1 (en) | Method of setting parameters for injection molding machines | |
| CN112668809B (zh) | 建立自闭症儿童康复效果预测模型的方法 | |
| Yu et al. | Stable soft sensor modeling based on causality analysis | |
| JP6974651B2 (ja) | 特徴推定方法、特徴推定装置、プログラム及び記録媒体 | |
| CN115062612A (zh) | 一种针对结构化数值型数据生成文本的方法及装置 | |
| CN114169531A (zh) | 一种组态化机器学习建模任务描述的预测方法及系统 | |
| JP2023517873A5 (https=) | ||
| JP2023076513A5 (https=) | ||
| JP2024540956A5 (https=) | ||
| JPWO2021256141A5 (ja) | 予測スコア算出装置、予測スコア算出方法および予測スコア算出プログラム | |
| CN113743461A (zh) | 无人机集群健康度评估方法及装置 | |
| JPWO2022038785A5 (https=) | ||
| JP7251955B2 (ja) | 検出装置及び機械学習方法 | |
| CN115686995A (zh) | 一种数据监控处理方法及装置 | |
| JPWO2018083853A1 (ja) | 視野感度推定装置、視野感度推定装置の制御方法、及びプログラム | |
| CN114758397B (zh) | 模型训练方法和装置、人脸识别方法和设备、存储介质 | |
| CN113743595B (zh) | 基于物理驱动自编码器神经网络的结构参数识别方法 | |
| JPWO2021181676A5 (ja) | 情報処理装置、制御方法及びプログラム |