TWI821585B - 用於重疊計量學系統之自動配方最佳化 - Google Patents

用於重疊計量學系統之自動配方最佳化 Download PDF

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Publication number
TWI821585B
TWI821585B TW109124568A TW109124568A TWI821585B TW I821585 B TWI821585 B TW I821585B TW 109124568 A TW109124568 A TW 109124568A TW 109124568 A TW109124568 A TW 109124568A TW I821585 B TWI821585 B TW I821585B
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Taiwan
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overlay
overlay metrology
subsystem
machine learning
recipe
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TW109124568A
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English (en)
Chinese (zh)
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TW202120888A (zh
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李瑋驊
魏石銘
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美商科磊股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00Administration; Management
    • G06Q10/04Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • G06N3/09Supervised learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • G06N20/10Machine learning using kernel methods, e.g. support vector machines [SVM]
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00Computing arrangements using knowledge-based models
    • G06N5/01Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computational Linguistics (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Business, Economics & Management (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Medical Informatics (AREA)
  • Economics (AREA)
  • Human Resources & Organizations (AREA)
  • Strategic Management (AREA)
  • Signal Processing (AREA)
  • Game Theory and Decision Science (AREA)
  • Tourism & Hospitality (AREA)
  • Quality & Reliability (AREA)
  • Operations Research (AREA)
  • Marketing (AREA)
  • Entrepreneurship & Innovation (AREA)
  • General Business, Economics & Management (AREA)
  • Development Economics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109124568A 2019-07-23 2020-07-21 用於重疊計量學系統之自動配方最佳化 TWI821585B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962877397P 2019-07-23 2019-07-23
US62/877,397 2019-07-23
US16/919,378 2020-07-02
US16/919,378 US11340060B2 (en) 2019-07-23 2020-07-02 Automatic recipe optimization for overlay metrology system

Publications (2)

Publication Number Publication Date
TW202120888A TW202120888A (zh) 2021-06-01
TWI821585B true TWI821585B (zh) 2023-11-11

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TW109124568A TWI821585B (zh) 2019-07-23 2020-07-21 用於重疊計量學系統之自動配方最佳化

Country Status (6)

Country Link
US (1) US11340060B2 (https=)
JP (1) JP7369851B2 (https=)
KR (1) KR102630494B1 (https=)
CN (1) CN114514542B (https=)
TW (1) TWI821585B (https=)
WO (1) WO2021016144A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740529B (zh) * 2020-06-05 2021-09-21 財團法人資訊工業策進會 分層建模之方法及系統
US12430401B2 (en) * 2020-09-08 2025-09-30 Wisconsin Alumni Research Foundation System for automatic error estimate correction for a machine learning model
US12250503B2 (en) * 2020-12-24 2025-03-11 Applied Materials Israel Ltd. Prediction of electrical properties of a semiconductor specimen
TW202400966A (zh) * 2022-03-21 2024-01-01 美商艾拉奇公司 用於繞射式覆蓋的外差式光學相位測量裝置
KR102519813B1 (ko) 2022-10-17 2023-04-11 (주)오로스테크놀로지 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램
KR102546552B1 (ko) 2022-11-14 2023-06-22 (주)오로스테크놀로지 오버레이 계측 장치의 동작을 제어하는 데이터를 저장하기 위한 데이터 구조를 기록한 컴퓨터 판독 가능 저장 매체 및 이를 위한 오버레이 계측 장치
KR102560241B1 (ko) 2022-11-14 2023-07-28 (주)오로스테크놀로지 딥러닝 기반 오버레이 키 센터링 시스템 및 그 방법
US20240210916A1 (en) * 2022-12-22 2024-06-27 Applied Materials, Inc. Machine and deep learning techniques for predicting ecological efficiency in substrate processing
KR102936585B1 (ko) 2023-05-08 2026-03-09 삼성전자주식회사 다중 피크 포커스를 가진 웨이퍼에서의 포커스 최적화 방식
US12615990B2 (en) * 2023-07-19 2026-04-28 Tokyo Electron Limited Integrated metrology for process controls in wafer bonding system
KR102882312B1 (ko) 2023-08-23 2025-11-06 (주) 오로스테크놀로지 오버레이 계측 장치 및 방법
KR102738956B1 (ko) * 2023-10-31 2024-12-06 (주)오로스 테크놀로지 오버레이 계측 방법 및 오버레이 계측 시스템
US20260064014A1 (en) * 2024-09-04 2026-03-05 Kla Corporation System and method for target centering detection in overlay metrology

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8396582B2 (en) * 2008-03-08 2013-03-12 Tokyo Electron Limited Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool
US8849615B2 (en) * 2009-01-30 2014-09-30 Globalfoundries Inc. Method and system for semiconductor process control and monitoring by using a data quality metric
US20150323316A1 (en) * 2014-05-09 2015-11-12 Kla-Tencor Corporation Signal Response Metrology For Scatterometry Based Overlay Measurements
US20180047646A1 (en) * 2016-02-24 2018-02-15 Kla-Tencor Corporation Accuracy improvements in optical metrology
US20180252514A1 (en) * 2017-03-01 2018-09-06 Kla-Tencor Corporation Process Robust Overlay Metrology Based On Optical Scatterometry
US10210606B2 (en) * 2014-10-14 2019-02-19 Kla-Tencor Corporation Signal response metrology for image based and scatterometry overlay measurements

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7171284B2 (en) 2004-09-21 2007-01-30 Timbre Technologies, Inc. Optical metrology model optimization based on goals
US7525673B2 (en) 2006-07-10 2009-04-28 Tokyo Electron Limited Optimizing selected variables of an optical metrology system
US7949490B2 (en) 2007-08-30 2011-05-24 Tokyo Electron Limited Determining profile parameters of a structure using approximation and fine diffraction models in optical metrology
US7742889B2 (en) 2008-03-27 2010-06-22 Tokyo Electron Limited Designing an optical metrology system optimized with signal criteria
US7761178B2 (en) 2008-06-18 2010-07-20 Tokyo Electron Limited Automated process control using an optical metrology system optimized with design goals
US8577820B2 (en) 2011-03-04 2013-11-05 Tokyo Electron Limited Accurate and fast neural network training for library-based critical dimension (CD) metrology
EP3779598B1 (en) * 2011-04-06 2022-12-21 Kla-Tencor Corporation Method for providing a set of process tool correctables
US20130110477A1 (en) 2011-10-31 2013-05-02 Stilian Pandev Process variation-based model optimization for metrology
US10255385B2 (en) 2012-03-28 2019-04-09 Kla-Tencor Corporation Model optimization approach based on spectral sensitivity
US9490182B2 (en) 2013-12-23 2016-11-08 Kla-Tencor Corporation Measurement of multiple patterning parameters
US10152654B2 (en) * 2014-02-20 2018-12-11 Kla-Tencor Corporation Signal response metrology for image based overlay measurements
US9710728B2 (en) * 2014-10-28 2017-07-18 Kla-Tencor Corporation Image based signal response metrology
KR102521159B1 (ko) * 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US10409165B2 (en) 2014-12-15 2019-09-10 Asml Netherlands B.V. Optimization based on machine learning
US9903711B2 (en) * 2015-04-06 2018-02-27 KLA—Tencor Corporation Feed forward of metrology data in a metrology system
US10360477B2 (en) 2016-01-11 2019-07-23 Kla-Tencor Corp. Accelerating semiconductor-related computations using learning based models
KR102334937B1 (ko) * 2016-10-21 2021-12-03 에이에스엠엘 네델란즈 비.브이. 패터닝 프로세스용 보정 결정 방법
US10395362B2 (en) * 2017-04-07 2019-08-27 Kla-Tencor Corp. Contour based defect detection
US11275361B2 (en) * 2017-06-30 2022-03-15 Kla-Tencor Corporation Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process
US10401738B2 (en) * 2017-08-02 2019-09-03 Kla-Tencor Corporation Overlay metrology using multiple parameter configurations

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8396582B2 (en) * 2008-03-08 2013-03-12 Tokyo Electron Limited Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool
US8849615B2 (en) * 2009-01-30 2014-09-30 Globalfoundries Inc. Method and system for semiconductor process control and monitoring by using a data quality metric
US20150323316A1 (en) * 2014-05-09 2015-11-12 Kla-Tencor Corporation Signal Response Metrology For Scatterometry Based Overlay Measurements
US10210606B2 (en) * 2014-10-14 2019-02-19 Kla-Tencor Corporation Signal response metrology for image based and scatterometry overlay measurements
US20180047646A1 (en) * 2016-02-24 2018-02-15 Kla-Tencor Corporation Accuracy improvements in optical metrology
US20180252514A1 (en) * 2017-03-01 2018-09-06 Kla-Tencor Corporation Process Robust Overlay Metrology Based On Optical Scatterometry

Also Published As

Publication number Publication date
US20210025695A1 (en) 2021-01-28
CN114514542B (zh) 2023-03-21
TW202120888A (zh) 2021-06-01
JP7369851B2 (ja) 2023-10-26
KR20220038707A (ko) 2022-03-29
CN114514542A (zh) 2022-05-17
KR102630494B1 (ko) 2024-01-29
WO2021016144A1 (en) 2021-01-28
JP2022542557A (ja) 2022-10-05
US11340060B2 (en) 2022-05-24

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