JP7369851B2 - オーバーレイ計測システム用の自動レシピ最適化 - Google Patents
オーバーレイ計測システム用の自動レシピ最適化 Download PDFInfo
- Publication number
- JP7369851B2 JP7369851B2 JP2022503926A JP2022503926A JP7369851B2 JP 7369851 B2 JP7369851 B2 JP 7369851B2 JP 2022503926 A JP2022503926 A JP 2022503926A JP 2022503926 A JP2022503926 A JP 2022503926A JP 7369851 B2 JP7369851 B2 JP 7369851B2
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- Prior art keywords
- overlay
- overlay metrology
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- machine learning
- recipe
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/09—Supervised learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
- G06N20/10—Machine learning using kernel methods, e.g. support vector machines [SVM]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N5/00—Computing arrangements using knowledge-based models
- G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Software Systems (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Computation (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Artificial Intelligence (AREA)
- Mathematical Physics (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computational Linguistics (AREA)
- Biophysics (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Business, Economics & Management (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Medical Informatics (AREA)
- Economics (AREA)
- Human Resources & Organizations (AREA)
- Strategic Management (AREA)
- Signal Processing (AREA)
- Game Theory and Decision Science (AREA)
- Tourism & Hospitality (AREA)
- Quality & Reliability (AREA)
- Operations Research (AREA)
- Marketing (AREA)
- Entrepreneurship & Innovation (AREA)
- General Business, Economics & Management (AREA)
- Development Economics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962877397P | 2019-07-23 | 2019-07-23 | |
| US62/877,397 | 2019-07-23 | ||
| US16/919,378 | 2020-07-02 | ||
| US16/919,378 US11340060B2 (en) | 2019-07-23 | 2020-07-02 | Automatic recipe optimization for overlay metrology system |
| PCT/US2020/042699 WO2021016144A1 (en) | 2019-07-23 | 2020-07-20 | Automatic recipe optimization for overlay metrology system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022542557A JP2022542557A (ja) | 2022-10-05 |
| JP2022542557A5 JP2022542557A5 (https=) | 2023-07-04 |
| JP7369851B2 true JP7369851B2 (ja) | 2023-10-26 |
Family
ID=74189904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022503926A Active JP7369851B2 (ja) | 2019-07-23 | 2020-07-20 | オーバーレイ計測システム用の自動レシピ最適化 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11340060B2 (https=) |
| JP (1) | JP7369851B2 (https=) |
| KR (1) | KR102630494B1 (https=) |
| CN (1) | CN114514542B (https=) |
| TW (1) | TWI821585B (https=) |
| WO (1) | WO2021016144A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI740529B (zh) * | 2020-06-05 | 2021-09-21 | 財團法人資訊工業策進會 | 分層建模之方法及系統 |
| US12430401B2 (en) * | 2020-09-08 | 2025-09-30 | Wisconsin Alumni Research Foundation | System for automatic error estimate correction for a machine learning model |
| US12250503B2 (en) * | 2020-12-24 | 2025-03-11 | Applied Materials Israel Ltd. | Prediction of electrical properties of a semiconductor specimen |
| TW202400966A (zh) * | 2022-03-21 | 2024-01-01 | 美商艾拉奇公司 | 用於繞射式覆蓋的外差式光學相位測量裝置 |
| KR102519813B1 (ko) | 2022-10-17 | 2023-04-11 | (주)오로스테크놀로지 | 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램 |
| KR102546552B1 (ko) | 2022-11-14 | 2023-06-22 | (주)오로스테크놀로지 | 오버레이 계측 장치의 동작을 제어하는 데이터를 저장하기 위한 데이터 구조를 기록한 컴퓨터 판독 가능 저장 매체 및 이를 위한 오버레이 계측 장치 |
| KR102560241B1 (ko) | 2022-11-14 | 2023-07-28 | (주)오로스테크놀로지 | 딥러닝 기반 오버레이 키 센터링 시스템 및 그 방법 |
| US20240210916A1 (en) * | 2022-12-22 | 2024-06-27 | Applied Materials, Inc. | Machine and deep learning techniques for predicting ecological efficiency in substrate processing |
| KR102936585B1 (ko) | 2023-05-08 | 2026-03-09 | 삼성전자주식회사 | 다중 피크 포커스를 가진 웨이퍼에서의 포커스 최적화 방식 |
| US12615990B2 (en) * | 2023-07-19 | 2026-04-28 | Tokyo Electron Limited | Integrated metrology for process controls in wafer bonding system |
| KR102882312B1 (ko) | 2023-08-23 | 2025-11-06 | (주) 오로스테크놀로지 | 오버레이 계측 장치 및 방법 |
| KR102738956B1 (ko) * | 2023-10-31 | 2024-12-06 | (주)오로스 테크놀로지 | 오버레이 계측 방법 및 오버레이 계측 시스템 |
| US20260064014A1 (en) * | 2024-09-04 | 2026-03-05 | Kla Corporation | System and method for target centering detection in overlay metrology |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060064280A1 (en) | 2004-09-21 | 2006-03-23 | Timbre Technologies, Inc. | Optical metrology model optimization based on goals |
| US20150323316A1 (en) | 2014-05-09 | 2015-11-12 | Kla-Tencor Corporation | Signal Response Metrology For Scatterometry Based Overlay Measurements |
| JP2017536584A (ja) | 2014-11-25 | 2017-12-07 | ストリーム モザイク,インコーポレイテッド | 半導体製造プロセスのための改善されたプロセス制御技術 |
| WO2018072980A1 (en) | 2016-10-21 | 2018-04-26 | Asml Netherlands B.V. | Methods of determining corrections for a patterning process |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7525673B2 (en) | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Optimizing selected variables of an optical metrology system |
| US7949490B2 (en) | 2007-08-30 | 2011-05-24 | Tokyo Electron Limited | Determining profile parameters of a structure using approximation and fine diffraction models in optical metrology |
| US8396582B2 (en) * | 2008-03-08 | 2013-03-12 | Tokyo Electron Limited | Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool |
| US7742889B2 (en) | 2008-03-27 | 2010-06-22 | Tokyo Electron Limited | Designing an optical metrology system optimized with signal criteria |
| US7761178B2 (en) | 2008-06-18 | 2010-07-20 | Tokyo Electron Limited | Automated process control using an optical metrology system optimized with design goals |
| DE102009006887B3 (de) * | 2009-01-30 | 2010-07-15 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zur Halbleiterprozesssteuerung und Überwachung unter Anwendung eines Datenqualitätsmaßes |
| US8577820B2 (en) | 2011-03-04 | 2013-11-05 | Tokyo Electron Limited | Accurate and fast neural network training for library-based critical dimension (CD) metrology |
| EP3779598B1 (en) * | 2011-04-06 | 2022-12-21 | Kla-Tencor Corporation | Method for providing a set of process tool correctables |
| US20130110477A1 (en) | 2011-10-31 | 2013-05-02 | Stilian Pandev | Process variation-based model optimization for metrology |
| US10255385B2 (en) | 2012-03-28 | 2019-04-09 | Kla-Tencor Corporation | Model optimization approach based on spectral sensitivity |
| US9490182B2 (en) | 2013-12-23 | 2016-11-08 | Kla-Tencor Corporation | Measurement of multiple patterning parameters |
| US10152654B2 (en) * | 2014-02-20 | 2018-12-11 | Kla-Tencor Corporation | Signal response metrology for image based overlay measurements |
| US10210606B2 (en) * | 2014-10-14 | 2019-02-19 | Kla-Tencor Corporation | Signal response metrology for image based and scatterometry overlay measurements |
| US9710728B2 (en) * | 2014-10-28 | 2017-07-18 | Kla-Tencor Corporation | Image based signal response metrology |
| US10430719B2 (en) | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US10409165B2 (en) | 2014-12-15 | 2019-09-10 | Asml Netherlands B.V. | Optimization based on machine learning |
| US9903711B2 (en) * | 2015-04-06 | 2018-02-27 | KLA—Tencor Corporation | Feed forward of metrology data in a metrology system |
| US10360477B2 (en) | 2016-01-11 | 2019-07-23 | Kla-Tencor Corp. | Accelerating semiconductor-related computations using learning based models |
| CN116936393B (zh) * | 2016-02-24 | 2024-12-20 | 科磊股份有限公司 | 光学计量的准确度提升 |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| US10395362B2 (en) * | 2017-04-07 | 2019-08-27 | Kla-Tencor Corp. | Contour based defect detection |
| US11275361B2 (en) * | 2017-06-30 | 2022-03-15 | Kla-Tencor Corporation | Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process |
| US10401738B2 (en) * | 2017-08-02 | 2019-09-03 | Kla-Tencor Corporation | Overlay metrology using multiple parameter configurations |
-
2020
- 2020-07-02 US US16/919,378 patent/US11340060B2/en active Active
- 2020-07-20 JP JP2022503926A patent/JP7369851B2/ja active Active
- 2020-07-20 WO PCT/US2020/042699 patent/WO2021016144A1/en not_active Ceased
- 2020-07-20 CN CN202080052179.9A patent/CN114514542B/zh active Active
- 2020-07-20 KR KR1020227004733A patent/KR102630494B1/ko active Active
- 2020-07-21 TW TW109124568A patent/TWI821585B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060064280A1 (en) | 2004-09-21 | 2006-03-23 | Timbre Technologies, Inc. | Optical metrology model optimization based on goals |
| US20150323316A1 (en) | 2014-05-09 | 2015-11-12 | Kla-Tencor Corporation | Signal Response Metrology For Scatterometry Based Overlay Measurements |
| JP2017536584A (ja) | 2014-11-25 | 2017-12-07 | ストリーム モザイク,インコーポレイテッド | 半導体製造プロセスのための改善されたプロセス制御技術 |
| WO2018072980A1 (en) | 2016-10-21 | 2018-04-26 | Asml Netherlands B.V. | Methods of determining corrections for a patterning process |
Also Published As
| Publication number | Publication date |
|---|---|
| US20210025695A1 (en) | 2021-01-28 |
| CN114514542B (zh) | 2023-03-21 |
| TW202120888A (zh) | 2021-06-01 |
| KR20220038707A (ko) | 2022-03-29 |
| CN114514542A (zh) | 2022-05-17 |
| TWI821585B (zh) | 2023-11-11 |
| KR102630494B1 (ko) | 2024-01-29 |
| WO2021016144A1 (en) | 2021-01-28 |
| JP2022542557A (ja) | 2022-10-05 |
| US11340060B2 (en) | 2022-05-24 |
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