JP2024518332A - 凸多角形の研磨部材を有する両面研削装置 - Google Patents

凸多角形の研磨部材を有する両面研削装置 Download PDF

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Publication number
JP2024518332A
JP2024518332A JP2023566021A JP2023566021A JP2024518332A JP 2024518332 A JP2024518332 A JP 2024518332A JP 2023566021 A JP2023566021 A JP 2023566021A JP 2023566021 A JP2023566021 A JP 2023566021A JP 2024518332 A JP2024518332 A JP 2024518332A
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JP
Japan
Prior art keywords
grinding
base
wafer
double
semiconductor structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023566021A
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English (en)
Japanese (ja)
Other versions
JP2024518332A5 (https=
Inventor
イ，ミンギュ
チェ，チョルウォン
キム，ジョンスン
クォン，ヒョシク
イ，ジェフン
イ，ビョンチョル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
Original Assignee
GlobalWafers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Publication of JP2024518332A publication Critical patent/JP2024518332A/ja
Publication of JP2024518332A5 publication Critical patent/JP2024518332A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2023566021A 2021-04-27 2022-04-27 凸多角形の研磨部材を有する両面研削装置 Pending JP2024518332A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163180481P 2021-04-27 2021-04-27
US63/180,481 2021-04-27
PCT/KR2022/006034 WO2022231308A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members

Publications (2)

Publication Number Publication Date
JP2024518332A true JP2024518332A (ja) 2024-05-01
JP2024518332A5 JP2024518332A5 (https=) 2025-04-09

Family

ID=83847073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566021A Pending JP2024518332A (ja) 2021-04-27 2022-04-27 凸多角形の研磨部材を有する両面研削装置

Country Status (7)

Country Link
US (1) US20240217053A1 (https=)
EP (1) EP4329982A4 (https=)
JP (1) JP2024518332A (https=)
KR (1) KR20230175281A (https=)
CN (1) CN117460597A (https=)
TW (1) TW202245033A (https=)
WO (1) WO2022231308A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015651A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Double-side grinding apparatus and methods having a wheelbase with porous abrasive members

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
JP2007529332A (ja) * 2004-03-19 2007-10-25 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 両側研削装置用のウエハ・クランピングデバイス
JP2016209963A (ja) * 2015-05-11 2016-12-15 信越半導体株式会社 研削用砥石
JP2018130791A (ja) * 2017-02-14 2018-08-23 株式会社ディスコ 研削ホイール
JP2018199197A (ja) * 2017-05-29 2018-12-20 株式会社アライドマテリアル 超砥粒ホイール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207634A (ja) * 1998-01-26 1999-08-03 Mitsubishi Materials Corp カップ型砥石およびウェーハの平面研削方法
JP4352588B2 (ja) * 2000-06-19 2009-10-28 三菱マテリアル株式会社 研削砥石
KR100486429B1 (ko) 2000-09-13 2005-04-29 가부시키가이샤 아라이도 마테리아루 경면 가공용 초지립 휠
JP5541941B2 (ja) * 2010-02-15 2014-07-09 金井 宏彰 固定砥粒式ソーワイヤ
CN202088116U (zh) * 2011-04-26 2011-12-28 博深工具股份有限公司 一种钻石型金刚石磨盘
JP6281988B2 (ja) * 2016-09-29 2018-02-21 株式会社フェムテック 表面加工装置及び方法
CN110722465A (zh) * 2019-11-06 2020-01-24 西安奕斯伟硅片技术有限公司 一种硅片减薄砂轮

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007529332A (ja) * 2004-03-19 2007-10-25 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 両側研削装置用のウエハ・クランピングデバイス
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
JP2016209963A (ja) * 2015-05-11 2016-12-15 信越半導体株式会社 研削用砥石
JP2018130791A (ja) * 2017-02-14 2018-08-23 株式会社ディスコ 研削ホイール
JP2018199197A (ja) * 2017-05-29 2018-12-20 株式会社アライドマテリアル 超砥粒ホイール

Also Published As

Publication number Publication date
EP4329982A4 (en) 2025-02-12
US20240217053A1 (en) 2024-07-04
WO2022231308A1 (en) 2022-11-03
CN117460597A (zh) 2024-01-26
EP4329982A1 (en) 2024-03-06
TW202245033A (zh) 2022-11-16
KR20230175281A (ko) 2023-12-29

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