JP2018130791A - 研削ホイール - Google Patents
研削ホイール Download PDFInfo
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- JP2018130791A JP2018130791A JP2017025387A JP2017025387A JP2018130791A JP 2018130791 A JP2018130791 A JP 2018130791A JP 2017025387 A JP2017025387 A JP 2017025387A JP 2017025387 A JP2017025387 A JP 2017025387A JP 2018130791 A JP2018130791 A JP 2018130791A
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- Prior art keywords
- grinding
- grinding wheel
- wheel
- workpiece
- peripheral side
- Prior art date
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- 238000000227 grinding Methods 0.000 title claims abstract description 454
- 230000002093 peripheral effect Effects 0.000 claims abstract description 57
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 239000004575 stone Substances 0.000 abstract 2
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 35
- 239000011347 resin Substances 0.000 description 35
- 239000006247 magnetic powder Substances 0.000 description 29
- 239000006061 abrasive grain Substances 0.000 description 11
- 230000007423 decrease Effects 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 4
- -1 for example Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004708 Very-low-density polyethylene Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001866 very low density polyethylene Polymers 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017112 Fe—C Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003296 Ni-Mo Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910000815 supermalloy Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
Abstract
Description
本発明の実施形態1に係る研削ホイールを図面に基づいて説明する。図1は、実施形態1に係る研削ホイールを備える研削装置の構成例を示す斜視図である。図2は、実施形態1に係る研削ホイールの加工対象の被加工物の一例を示す斜視図である。図3は、実施形態1に係る研削ホイールの加工対象の被加工物の他の例を示す断面図である。図4は、実施形態1に係る研削ホイールとチャックテーブルとを示す斜視図である。
110は、保持面111を構成する部分がポーラスセラミック等から形成された円盤形状であり、図示しない真空吸引経路を介して図示しない真空吸引源と接続され、保持面111に載置された被加工物201を吸引することで保持する。また。チャックテーブル110は、Z軸方向と平行な軸心回りに回転自在な支持基台112に支持されている。なお、Z軸方向は、鉛直方向と平行である。
本発明の実施形態2に係る研削ホイールを図面に基づいて説明する。図7は、実施形態2に係る研削ホイールの平面図である。図7は、実施形態1と同一部分に同一符号を付して説明を省略する。
本発明の実施形態3に係る研削ホイールを図面に基づいて説明する。図8は、実施形態3に係る研削ホイールの平面図である。図8は、実施形態1及び実施形態2と同一部分に同一符号を付して説明を省略する。
本発明の実施形態4に係る研削ホイールを図面に基づいて説明する。図9は、実施形態4に係る研削ホイールの平面図である。図10は、図9に示された研削砥石の断面図である。図9及び図10は、実施形態3と同一部分に同一符号を付して説明を省略する。
本発明の実施形態5に係る研削ホイールを図面に基づいて説明する。図11は、実施形態5に係る研削ホイールの平面図である。図11は、実施形態1から実施形態3と同一部分に同一符号を付して説明を省略する。
本発明の実施形態6に係る研削ホイールを図面に基づいて説明する。図12は、実施形態6に係る研削ホイールの平面図である。図12は、実施形態1から実施形態5と同一部分に同一符号を付して説明を省略する。
本発明の実施形態7に係る研削ホイールを図面に基づいて説明する。図13は、実施形態7に係る研削ホイールの平面図である。図13は、実施形態1から実施形態6と同一部分に同一符号を付して説明を省略する。
本発明の実施形態8に係る研削ホイールを図面に基づいて説明する。図14は、実施形態8に係る研削ホイールの平面図である。図14は、実施形態1から実施形態7と同一部分に同一符号を付して説明を省略する。
10 ホイール基台
20,20−2,20−3,20−4,20−5,20−6,20−7,20−8,28,29,30,31,32 研削砥石
22 研削面
25,25−6 セグメント砥石
26 砥石群
27,33 溝
110 チャックテーブル
120 研削ユニット(研削手段)
122 回転スピンドル
124 ホイールマウント
201,201−1 被加工物
211 回転方向
Claims (5)
- チャックテーブルに保持された被加工物を研削する研削手段を構成する回転スピンドルの一端に設けられたホイールマウントに取り付けられるホイール基台と、該ホイール基台に略円環状に配設された複数の研削砥石と、を備える研削ホイールであって、
該研削砥石の研削面の面積は、前記ホイール基台の内周側の面積から外周側に徐々に少なく構成される研削ホイール。 - 前記研削砥石は、一つのセグメント砥石から構成される請求項1に記載の研削ホイール。
- 前記研削砥石は、複数のセグメント砥石から構成される1つの砥石群である請求項1に記載の研削ホイール。
- 前記研削砥石は、前記ホイール基台の内周側から外周側に至る溝が形成される請求項2又は請求項3に記載の研削ホイール。
- 前記研削砥石の研削面の面積は、回転方向前側の面積よりも回転方向後側の面積の方が少ない請求項1から請求項4のうちいずれか一項に記載の研削ホイール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017025387A JP6948798B2 (ja) | 2017-02-14 | 2017-02-14 | 研削ホイール |
TW107100875A TWI759401B (zh) | 2017-02-14 | 2018-01-10 | 研磨輪 |
CN201810116890.0A CN108422318B (zh) | 2017-02-14 | 2018-02-06 | 磨削磨轮 |
KR1020180016159A KR102322555B1 (ko) | 2017-02-14 | 2018-02-09 | 연삭 휠 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017025387A JP6948798B2 (ja) | 2017-02-14 | 2017-02-14 | 研削ホイール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018130791A true JP2018130791A (ja) | 2018-08-23 |
JP6948798B2 JP6948798B2 (ja) | 2021-10-13 |
Family
ID=63156647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017025387A Active JP6948798B2 (ja) | 2017-02-14 | 2017-02-14 | 研削ホイール |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6948798B2 (ja) |
KR (1) | KR102322555B1 (ja) |
CN (1) | CN108422318B (ja) |
TW (1) | TWI759401B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022231308A1 (en) * | 2021-04-27 | 2022-11-03 | Globalwafers Co., Ltd. | Double side grinding apparatus having convex polygon-shaped abrasive members |
WO2023130015A1 (en) * | 2021-12-29 | 2023-07-06 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for forming same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113977789A (zh) * | 2021-11-05 | 2022-01-28 | 锦州神工半导体股份有限公司 | 一种环形硅部件端面切削方法 |
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JP2000326235A (ja) * | 1999-05-17 | 2000-11-28 | Inst Of Physical & Chemical Res | Elid用砥石とこれを用いたelid平面研削装置 |
JP2014151425A (ja) * | 2013-02-13 | 2014-08-25 | Showa Denko Kk | 単結晶SiC基板の表面加工方法、その製造方法及び単結晶SiC基板の表面加工用研削プレート |
JP2017132033A (ja) * | 2016-01-27 | 2017-08-03 | 周 景星Chin−Hsin CHOU | 研削装置及びそれを用いた研削方法 |
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JPS55144970A (en) * | 1979-04-28 | 1980-11-12 | Tomoaki Goto | Diamond grind stone for surface grinder |
SE525501C2 (sv) * | 2003-06-11 | 2005-03-01 | Htc Sweden Ab | Slipplatta samt en slipelementbärande hållarplatta för lösbar montering på en slipplatta |
KR20050120534A (ko) * | 2004-06-22 | 2005-12-22 | 이해동 | 웨이퍼 연마용 레진 본드 숫돌 |
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TWM524763U (zh) * | 2016-01-27 | 2016-07-01 | 周景星 | 硏磨裝置 |
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2017
- 2017-02-14 JP JP2017025387A patent/JP6948798B2/ja active Active
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2018
- 2018-01-10 TW TW107100875A patent/TWI759401B/zh active
- 2018-02-06 CN CN201810116890.0A patent/CN108422318B/zh active Active
- 2018-02-09 KR KR1020180016159A patent/KR102322555B1/ko active IP Right Grant
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JP2000326235A (ja) * | 1999-05-17 | 2000-11-28 | Inst Of Physical & Chemical Res | Elid用砥石とこれを用いたelid平面研削装置 |
JP2014151425A (ja) * | 2013-02-13 | 2014-08-25 | Showa Denko Kk | 単結晶SiC基板の表面加工方法、その製造方法及び単結晶SiC基板の表面加工用研削プレート |
JP2017132033A (ja) * | 2016-01-27 | 2017-08-03 | 周 景星Chin−Hsin CHOU | 研削装置及びそれを用いた研削方法 |
Cited By (2)
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WO2022231308A1 (en) * | 2021-04-27 | 2022-11-03 | Globalwafers Co., Ltd. | Double side grinding apparatus having convex polygon-shaped abrasive members |
WO2023130015A1 (en) * | 2021-12-29 | 2023-07-06 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for forming same |
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KR20180093809A (ko) | 2018-08-22 |
TW201838769A (zh) | 2018-11-01 |
TWI759401B (zh) | 2022-04-01 |
JP6948798B2 (ja) | 2021-10-13 |
CN108422318B (zh) | 2022-02-11 |
KR102322555B1 (ko) | 2021-11-04 |
CN108422318A (zh) | 2018-08-21 |
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