TW202245033A - 具有凸多邊形磨料構件的雙面研磨裝置 - Google Patents

具有凸多邊形磨料構件的雙面研磨裝置 Download PDF

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Publication number
TW202245033A
TW202245033A TW111116079A TW111116079A TW202245033A TW 202245033 A TW202245033 A TW 202245033A TW 111116079 A TW111116079 A TW 111116079A TW 111116079 A TW111116079 A TW 111116079A TW 202245033 A TW202245033 A TW 202245033A
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TW
Taiwan
Prior art keywords
face
base
grinding
double
semiconductor structure
Prior art date
Application number
TW111116079A
Other languages
English (en)
Chinese (zh)
Inventor
李旻圭
崔哲原
金鐘善
權孝植
李載勳
李秉哲
Original Assignee
環球晶圓股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 環球晶圓股份有限公司 filed Critical 環球晶圓股份有限公司
Publication of TW202245033A publication Critical patent/TW202245033A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW111116079A 2021-04-27 2022-04-27 具有凸多邊形磨料構件的雙面研磨裝置 TW202245033A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163180481P 2021-04-27 2021-04-27
US63/180,481 2021-04-27

Publications (1)

Publication Number Publication Date
TW202245033A true TW202245033A (zh) 2022-11-16

Family

ID=83847073

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111116079A TW202245033A (zh) 2021-04-27 2022-04-27 具有凸多邊形磨料構件的雙面研磨裝置

Country Status (7)

Country Link
US (1) US20240217053A1 (https=)
EP (1) EP4329982A4 (https=)
JP (1) JP2024518332A (https=)
KR (1) KR20230175281A (https=)
CN (1) CN117460597A (https=)
TW (1) TW202245033A (https=)
WO (1) WO2022231308A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015651A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Double-side grinding apparatus and methods having a wheelbase with porous abrasive members

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207634A (ja) * 1998-01-26 1999-08-03 Mitsubishi Materials Corp カップ型砥石およびウェーハの平面研削方法
JP4352588B2 (ja) * 2000-06-19 2009-10-28 三菱マテリアル株式会社 研削砥石
KR100486429B1 (ko) 2000-09-13 2005-04-29 가부시키가이샤 아라이도 마테리아루 경면 가공용 초지립 휠
US8066553B2 (en) * 2004-03-19 2011-11-29 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
JP5541941B2 (ja) * 2010-02-15 2014-07-09 金井 宏彰 固定砥粒式ソーワイヤ
CN202088116U (zh) * 2011-04-26 2011-12-28 博深工具股份有限公司 一种钻石型金刚石磨盘
JP6350384B2 (ja) * 2015-05-11 2018-07-04 信越半導体株式会社 研削用砥石
JP6281988B2 (ja) * 2016-09-29 2018-02-21 株式会社フェムテック 表面加工装置及び方法
JP6948798B2 (ja) * 2017-02-14 2021-10-13 株式会社ディスコ 研削ホイール
JP2018199197A (ja) * 2017-05-29 2018-12-20 株式会社アライドマテリアル 超砥粒ホイール
CN110722465A (zh) * 2019-11-06 2020-01-24 西安奕斯伟硅片技术有限公司 一种硅片减薄砂轮

Also Published As

Publication number Publication date
EP4329982A4 (en) 2025-02-12
JP2024518332A (ja) 2024-05-01
US20240217053A1 (en) 2024-07-04
WO2022231308A1 (en) 2022-11-03
CN117460597A (zh) 2024-01-26
EP4329982A1 (en) 2024-03-06
KR20230175281A (ko) 2023-12-29

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