EP4329982A4 - DOUBLE-SIDED GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIVE ELEMENTS - Google Patents

DOUBLE-SIDED GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIVE ELEMENTS

Info

Publication number
EP4329982A4
EP4329982A4 EP22796140.6A EP22796140A EP4329982A4 EP 4329982 A4 EP4329982 A4 EP 4329982A4 EP 22796140 A EP22796140 A EP 22796140A EP 4329982 A4 EP4329982 A4 EP 4329982A4
Authority
EP
European Patent Office
Prior art keywords
grinding apparatus
shaped abrasive
double side
convex polygon
side grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22796140.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP4329982A1 (en
Inventor
Minkyu Lee
Cheulwon CHOI
Jongsun Kim
Hyoshik KWEON
Jaehoon Lee
Byungchul Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
Original Assignee
GlobalWafers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Publication of EP4329982A1 publication Critical patent/EP4329982A1/en
Publication of EP4329982A4 publication Critical patent/EP4329982A4/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
EP22796140.6A 2021-04-27 2022-04-27 DOUBLE-SIDED GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIVE ELEMENTS Pending EP4329982A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163180481P 2021-04-27 2021-04-27
PCT/KR2022/006034 WO2022231308A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members

Publications (2)

Publication Number Publication Date
EP4329982A1 EP4329982A1 (en) 2024-03-06
EP4329982A4 true EP4329982A4 (en) 2025-02-12

Family

ID=83847073

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22796140.6A Pending EP4329982A4 (en) 2021-04-27 2022-04-27 DOUBLE-SIDED GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIVE ELEMENTS

Country Status (7)

Country Link
US (1) US20240217053A1 (https=)
EP (1) EP4329982A4 (https=)
JP (1) JP2024518332A (https=)
KR (1) KR20230175281A (https=)
CN (1) CN117460597A (https=)
TW (1) TW202245033A (https=)
WO (1) WO2022231308A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015651A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Double-side grinding apparatus and methods having a wheelbase with porous abrasive members

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
JP2018130791A (ja) * 2017-02-14 2018-08-23 株式会社ディスコ 研削ホイール
US20180290265A1 (en) * 2015-05-11 2018-10-11 Shin-Etsu Handotai Co., Ltd. Grinding wheel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207634A (ja) * 1998-01-26 1999-08-03 Mitsubishi Materials Corp カップ型砥石およびウェーハの平面研削方法
JP4352588B2 (ja) * 2000-06-19 2009-10-28 三菱マテリアル株式会社 研削砥石
KR100486429B1 (ko) 2000-09-13 2005-04-29 가부시키가이샤 아라이도 마테리아루 경면 가공용 초지립 휠
US8066553B2 (en) * 2004-03-19 2011-11-29 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
JP5541941B2 (ja) * 2010-02-15 2014-07-09 金井 宏彰 固定砥粒式ソーワイヤ
CN202088116U (zh) * 2011-04-26 2011-12-28 博深工具股份有限公司 一种钻石型金刚石磨盘
JP6281988B2 (ja) * 2016-09-29 2018-02-21 株式会社フェムテック 表面加工装置及び方法
JP2018199197A (ja) * 2017-05-29 2018-12-20 株式会社アライドマテリアル 超砥粒ホイール
CN110722465A (zh) * 2019-11-06 2020-01-24 西安奕斯伟硅片技术有限公司 一种硅片减薄砂轮

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
US20180290265A1 (en) * 2015-05-11 2018-10-11 Shin-Etsu Handotai Co., Ltd. Grinding wheel
JP2018130791A (ja) * 2017-02-14 2018-08-23 株式会社ディスコ 研削ホイール

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2022231308A1 *

Also Published As

Publication number Publication date
JP2024518332A (ja) 2024-05-01
US20240217053A1 (en) 2024-07-04
WO2022231308A1 (en) 2022-11-03
CN117460597A (zh) 2024-01-26
EP4329982A1 (en) 2024-03-06
TW202245033A (zh) 2022-11-16
KR20230175281A (ko) 2023-12-29

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Inventor name: LEE, MINKYU

Inventor name: CHOI, CHEULWON

Inventor name: KIM, JONGSUN

Inventor name: KWEON, HYOSHIK

Inventor name: LEE, JAEHOON

Inventor name: LEE, BYUNGCHUL