KR20230175281A - 볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치 - Google Patents

볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치 Download PDF

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Publication number
KR20230175281A
KR20230175281A KR1020237040301A KR20237040301A KR20230175281A KR 20230175281 A KR20230175281 A KR 20230175281A KR 1020237040301 A KR1020237040301 A KR 1020237040301A KR 20237040301 A KR20237040301 A KR 20237040301A KR 20230175281 A KR20230175281 A KR 20230175281A
Authority
KR
South Korea
Prior art keywords
grinding
base
double
semiconductor structure
bonding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237040301A
Other languages
English (en)
Korean (ko)
Inventor
민규 이
철원 최
종선 김
효식 권
재훈 이
병철 이
Original Assignee
글로벌웨이퍼스 씨오., 엘티디.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 글로벌웨이퍼스 씨오., 엘티디. filed Critical 글로벌웨이퍼스 씨오., 엘티디.
Publication of KR20230175281A publication Critical patent/KR20230175281A/ko
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020237040301A 2021-04-27 2022-04-27 볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치 Pending KR20230175281A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163180481P 2021-04-27 2021-04-27
US63/180,481 2021-04-27
PCT/KR2022/006034 WO2022231308A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members

Publications (1)

Publication Number Publication Date
KR20230175281A true KR20230175281A (ko) 2023-12-29

Family

ID=83847073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237040301A Pending KR20230175281A (ko) 2021-04-27 2022-04-27 볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치

Country Status (7)

Country Link
US (1) US20240217053A1 (https=)
EP (1) EP4329982A4 (https=)
JP (1) JP2024518332A (https=)
KR (1) KR20230175281A (https=)
CN (1) CN117460597A (https=)
TW (1) TW202245033A (https=)
WO (1) WO2022231308A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015651A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Double-side grinding apparatus and methods having a wheelbase with porous abrasive members

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207634A (ja) * 1998-01-26 1999-08-03 Mitsubishi Materials Corp カップ型砥石およびウェーハの平面研削方法
JP4352588B2 (ja) * 2000-06-19 2009-10-28 三菱マテリアル株式会社 研削砥石
KR100486429B1 (ko) 2000-09-13 2005-04-29 가부시키가이샤 아라이도 마테리아루 경면 가공용 초지립 휠
US8066553B2 (en) * 2004-03-19 2011-11-29 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
JP5541941B2 (ja) * 2010-02-15 2014-07-09 金井 宏彰 固定砥粒式ソーワイヤ
CN202088116U (zh) * 2011-04-26 2011-12-28 博深工具股份有限公司 一种钻石型金刚石磨盘
JP6350384B2 (ja) * 2015-05-11 2018-07-04 信越半導体株式会社 研削用砥石
JP6281988B2 (ja) * 2016-09-29 2018-02-21 株式会社フェムテック 表面加工装置及び方法
JP6948798B2 (ja) * 2017-02-14 2021-10-13 株式会社ディスコ 研削ホイール
JP2018199197A (ja) * 2017-05-29 2018-12-20 株式会社アライドマテリアル 超砥粒ホイール
CN110722465A (zh) * 2019-11-06 2020-01-24 西安奕斯伟硅片技术有限公司 一种硅片减薄砂轮

Also Published As

Publication number Publication date
EP4329982A4 (en) 2025-02-12
JP2024518332A (ja) 2024-05-01
US20240217053A1 (en) 2024-07-04
WO2022231308A1 (en) 2022-11-03
CN117460597A (zh) 2024-01-26
EP4329982A1 (en) 2024-03-06
TW202245033A (zh) 2022-11-16

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