CN117460597A - 具有凸多边形磨料部件的双面研磨设备 - Google Patents

具有凸多边形磨料部件的双面研磨设备 Download PDF

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Publication number
CN117460597A
CN117460597A CN202280037766.XA CN202280037766A CN117460597A CN 117460597 A CN117460597 A CN 117460597A CN 202280037766 A CN202280037766 A CN 202280037766A CN 117460597 A CN117460597 A CN 117460597A
Authority
CN
China
Prior art keywords
grinding
double
abrasive
base
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280037766.XA
Other languages
English (en)
Chinese (zh)
Inventor
李旻圭
崔哲原
金钟善
权孝植
李载勋
李秉哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
Original Assignee
GlobalWafers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Publication of CN117460597A publication Critical patent/CN117460597A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CN202280037766.XA 2021-04-27 2022-04-27 具有凸多边形磨料部件的双面研磨设备 Pending CN117460597A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163180481P 2021-04-27 2021-04-27
US63/180,481 2021-04-27
PCT/KR2022/006034 WO2022231308A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members

Publications (1)

Publication Number Publication Date
CN117460597A true CN117460597A (zh) 2024-01-26

Family

ID=83847073

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280037766.XA Pending CN117460597A (zh) 2021-04-27 2022-04-27 具有凸多边形磨料部件的双面研磨设备

Country Status (7)

Country Link
US (1) US20240217053A1 (https=)
EP (1) EP4329982A4 (https=)
JP (1) JP2024518332A (https=)
KR (1) KR20230175281A (https=)
CN (1) CN117460597A (https=)
TW (1) TW202245033A (https=)
WO (1) WO2022231308A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015651A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Double-side grinding apparatus and methods having a wheelbase with porous abrasive members

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207634A (ja) * 1998-01-26 1999-08-03 Mitsubishi Materials Corp カップ型砥石およびウェーハの平面研削方法
JP2002001672A (ja) * 2000-06-19 2002-01-08 Mitsubishi Materials Corp 研削砥石およびその製造方法
US20080020684A1 (en) * 2004-03-19 2008-01-24 Memc Electronic Materials, Incorporated Wafer Clamping Device For A Double Side Grinder
JP2011161613A (ja) * 2010-02-15 2011-08-25 Kanai Hiroaki 固定砥粒式ソーワイヤ
JP2017035778A (ja) * 2016-09-29 2017-02-16 株式会社フェムテック 表面加工装置及び方法
JP2018130791A (ja) * 2017-02-14 2018-08-23 株式会社ディスコ 研削ホイール
US20180290265A1 (en) * 2015-05-11 2018-10-11 Shin-Etsu Handotai Co., Ltd. Grinding wheel
CN110722465A (zh) * 2019-11-06 2020-01-24 西安奕斯伟硅片技术有限公司 一种硅片减薄砂轮

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486429B1 (ko) 2000-09-13 2005-04-29 가부시키가이샤 아라이도 마테리아루 경면 가공용 초지립 휠
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
CN202088116U (zh) * 2011-04-26 2011-12-28 博深工具股份有限公司 一种钻石型金刚石磨盘
JP2018199197A (ja) * 2017-05-29 2018-12-20 株式会社アライドマテリアル 超砥粒ホイール

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207634A (ja) * 1998-01-26 1999-08-03 Mitsubishi Materials Corp カップ型砥石およびウェーハの平面研削方法
JP2002001672A (ja) * 2000-06-19 2002-01-08 Mitsubishi Materials Corp 研削砥石およびその製造方法
US20080020684A1 (en) * 2004-03-19 2008-01-24 Memc Electronic Materials, Incorporated Wafer Clamping Device For A Double Side Grinder
JP2011161613A (ja) * 2010-02-15 2011-08-25 Kanai Hiroaki 固定砥粒式ソーワイヤ
US20180290265A1 (en) * 2015-05-11 2018-10-11 Shin-Etsu Handotai Co., Ltd. Grinding wheel
JP2017035778A (ja) * 2016-09-29 2017-02-16 株式会社フェムテック 表面加工装置及び方法
JP2018130791A (ja) * 2017-02-14 2018-08-23 株式会社ディスコ 研削ホイール
CN110722465A (zh) * 2019-11-06 2020-01-24 西安奕斯伟硅片技术有限公司 一种硅片减薄砂轮

Also Published As

Publication number Publication date
EP4329982A4 (en) 2025-02-12
JP2024518332A (ja) 2024-05-01
US20240217053A1 (en) 2024-07-04
WO2022231308A1 (en) 2022-11-03
EP4329982A1 (en) 2024-03-06
TW202245033A (zh) 2022-11-16
KR20230175281A (ko) 2023-12-29

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