US20240217053A1 - Double side grinding apparatus having convex polygon-shaped abrasive members - Google Patents

Double side grinding apparatus having convex polygon-shaped abrasive members Download PDF

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Publication number
US20240217053A1
US20240217053A1 US18/556,026 US202218556026A US2024217053A1 US 20240217053 A1 US20240217053 A1 US 20240217053A1 US 202218556026 A US202218556026 A US 202218556026A US 2024217053 A1 US2024217053 A1 US 2024217053A1
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US
United States
Prior art keywords
base
grinding
wafer
set forth
engaging surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US18/556,026
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English (en)
Inventor
Minkyu Lee
Cheulwon Choi
Jongsun Kim
Hyoshik Kweon
Jaehoon Lee
Byungchul LEE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
Original Assignee
GlobalWafers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Priority to US18/556,026 priority Critical patent/US20240217053A1/en
Assigned to GLOBALWAFERS CO., LTD. reassignment GLOBALWAFERS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KWEON, Hyoshik, CHOI, Cheulwon, KIM, JONGSUN, LEE, BYUNGCHUL, LEE, JAEHOON, LEE, MINKYU
Publication of US20240217053A1 publication Critical patent/US20240217053A1/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Definitions

  • FIG. 14 illustrates box plots of the change in bow before and after the simultaneous double side grind (delta) for semiconductor structures simultaneous double side ground by convex polygon-shaped abrasive members and by conventional abrasive members;
  • FIG. 16 is a time series plot of the current of the right grinding wheel for semiconductor structures simultaneous double side ground by convex polygon-shaped abrasive members and by conventional abrasive members;
  • FIG. 19 is a time series plot of the CRING value for convex polygon-shaped abrasive members and conventional abrasive members.
  • a pair of first and second grinding wheels 133 , 135 (“left” and “right” grinding wheels) extend through the hydrostatic pads 105 , 110 .
  • the pair of grinding wheels 133 , 135 rotate in opposite directions relative to each other.
  • the grinding wheels 133 , 135 may be connected with air spindles 141 , 142 and an electric motor rotates the grinding wheels 133 , 135 .
  • the grinding wheels 133 , 135 may include full peripheral contact with the semiconductor structure as they rotate.
  • the wafer-engaging surface 225 includes a fourth side 250 that connects to the first side 239 at a first end 267 of the fourth side 250 .
  • the wafer-engaging surface 225 includes a fifth side 255 that connects to the second end 243 at a first end 272 of the fifth side 255 .
  • the fourth and fifth sides 250 , 255 connect at second sides 270 , 275 of the fourth and fifth sides 250 , 255 .
  • FIGS. 7 - 8 Another embodiment of the grinding wheel 300 is shown in FIGS. 7 - 8 .
  • the components shown in FIGS. 7 - 8 that are analogous to those of FIGS. 4 - 5 are designated by the corresponding reference number of FIGS. 4 - 5 plus “100” (e.g., part 212 becomes 312).
  • the orientation of the abrasive member 312 is turned 180° from the abrasive member 212 of FIGS. 4 - 6 (compare FIGS. 6 and 9 ).
  • the average distance D 335 of the base 335 from the rotational axis A is greater than the average distance from the rotational axis A of each of the other sides 239 , 243 , 250 , 255 (i.e., the base 235 is further from the rotational axis A than the other sides of the convex polygon).
  • the abrasive member 312 may be the same as the abrasive member 212 of FIGS. 4 - 6 .
  • a first set of semiconductor structures were simultaneously double-side ground by a grinding wheel having abrasive members as shown in FIGS. 4-7 of U.S. Pat. No. 6,692,343.
  • a second set of semiconductor structures were simultaneously double-side ground by a grinding wheel having abrasive members with a convex polygon shape (convex pentagon).
  • FIG. 10 shows the peak to valley nanotopography
  • FIG. 11 shows peak to valley of a 10 mm ⁇ 10 mm window of the wafer.
  • the pentagon-shaped abrasive members have improved nanotopography.
  • Example 2 Reduction in Distorted Area by Use of a Convex Polygon-Shaped Abrasive Members
  • FIG. 12 shows wafer images for a wafer ground by a grinding wheel of FIGS. 4 - 6 of the application having pentagon-shaped abrasive members “(1)” and grinding wheels having the abrasive members shown in FIGS. 4-7 of U.S. Pat. No. 6,692,343 with “(2)” being a center pattern and “(3)” being an edge pattern.
  • the pentagon-shaped abrasive members were better able to apply holding force toward the rotating wafer surface and sustained generated slope without having to change over the grinding sequence.
  • the wafer ground with the pentagon-shaped abrasive members prevented generation of distorted area on the ground wafer, thereby improving nanotopography.
  • Example 3 Change in Bow by Use of a Convex Polygon-Shaped Abrasive Members
  • FIG. 17 shows the accumulated percentage of particle count (DIC mode) for grinding wheels having abrasive members as shown in FIGS. 4-7 of U.S. Pat. No. 6,692,343 (left column) and for grinding wheels having pentagon-shaped abrasive members (right column).
  • the pentagon-shaped abrasive members resulted in less surface damage with less grinding current ( FIGS. 15 - 16 ).
  • Example 5 Grinding Stability by Use of a Convex Polygon-Shaped Abrasive Members
  • the terms “about,” “substantially,” “essentially” and “approximately” when used in conjunction with ranges of dimensions, concentrations, temperatures or other physical or chemical properties or characteristics is meant to cover variations that may exist in the upper and/or lower limits of the ranges of the properties or characteristics, including, for example, variations resulting from rounding, measurement methodology or other statistical variation.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
US18/556,026 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members Pending US20240217053A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/556,026 US20240217053A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163180481P 2021-04-27 2021-04-27
US18/556,026 US20240217053A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members
PCT/KR2022/006034 WO2022231308A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members

Publications (1)

Publication Number Publication Date
US20240217053A1 true US20240217053A1 (en) 2024-07-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US18/556,026 Pending US20240217053A1 (en) 2021-04-27 2022-04-27 Double side grinding apparatus having convex polygon-shaped abrasive members

Country Status (7)

Country Link
US (1) US20240217053A1 (https=)
EP (1) EP4329982A4 (https=)
JP (1) JP2024518332A (https=)
KR (1) KR20230175281A (https=)
CN (1) CN117460597A (https=)
TW (1) TW202245033A (https=)
WO (1) WO2022231308A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015651A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Double-side grinding apparatus and methods having a wheelbase with porous abrasive members

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180290265A1 (en) * 2015-05-11 2018-10-11 Shin-Etsu Handotai Co., Ltd. Grinding wheel

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPH11207634A (ja) * 1998-01-26 1999-08-03 Mitsubishi Materials Corp カップ型砥石およびウェーハの平面研削方法
JP4352588B2 (ja) * 2000-06-19 2009-10-28 三菱マテリアル株式会社 研削砥石
KR100486429B1 (ko) 2000-09-13 2005-04-29 가부시키가이샤 아라이도 마테리아루 경면 가공용 초지립 휠
US8066553B2 (en) * 2004-03-19 2011-11-29 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
JP2006224201A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
JP5541941B2 (ja) * 2010-02-15 2014-07-09 金井 宏彰 固定砥粒式ソーワイヤ
CN202088116U (zh) * 2011-04-26 2011-12-28 博深工具股份有限公司 一种钻石型金刚石磨盘
JP6281988B2 (ja) * 2016-09-29 2018-02-21 株式会社フェムテック 表面加工装置及び方法
JP6948798B2 (ja) * 2017-02-14 2021-10-13 株式会社ディスコ 研削ホイール
JP2018199197A (ja) * 2017-05-29 2018-12-20 株式会社アライドマテリアル 超砥粒ホイール
CN110722465A (zh) * 2019-11-06 2020-01-24 西安奕斯伟硅片技术有限公司 一种硅片减薄砂轮

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180290265A1 (en) * 2015-05-11 2018-10-11 Shin-Etsu Handotai Co., Ltd. Grinding wheel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015651A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Double-side grinding apparatus and methods having a wheelbase with porous abrasive members

Also Published As

Publication number Publication date
EP4329982A4 (en) 2025-02-12
JP2024518332A (ja) 2024-05-01
WO2022231308A1 (en) 2022-11-03
CN117460597A (zh) 2024-01-26
EP4329982A1 (en) 2024-03-06
TW202245033A (zh) 2022-11-16
KR20230175281A (ko) 2023-12-29

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