JP2024518332A5 - - Google Patents
Info
- Publication number
- JP2024518332A5 JP2024518332A5 JP2023566021A JP2023566021A JP2024518332A5 JP 2024518332 A5 JP2024518332 A5 JP 2024518332A5 JP 2023566021 A JP2023566021 A JP 2023566021A JP 2023566021 A JP2023566021 A JP 2023566021A JP 2024518332 A5 JP2024518332 A5 JP 2024518332A5
- Authority
- JP
- Japan
- Prior art keywords
- base
- grinding
- engagement surface
- semiconductor structure
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163180481P | 2021-04-27 | 2021-04-27 | |
| US63/180,481 | 2021-04-27 | ||
| PCT/KR2022/006034 WO2022231308A1 (en) | 2021-04-27 | 2022-04-27 | Double side grinding apparatus having convex polygon-shaped abrasive members |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024518332A JP2024518332A (ja) | 2024-05-01 |
| JP2024518332A5 true JP2024518332A5 (https=) | 2025-04-09 |
Family
ID=83847073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023566021A Pending JP2024518332A (ja) | 2021-04-27 | 2022-04-27 | 凸多角形の研磨部材を有する両面研削装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240217053A1 (https=) |
| EP (1) | EP4329982A4 (https=) |
| JP (1) | JP2024518332A (https=) |
| KR (1) | KR20230175281A (https=) |
| CN (1) | CN117460597A (https=) |
| TW (1) | TW202245033A (https=) |
| WO (1) | WO2022231308A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026015651A1 (en) | 2024-07-11 | 2026-01-15 | Globalwafers Co., Ltd. | Double-side grinding apparatus and methods having a wheelbase with porous abrasive members |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11207634A (ja) * | 1998-01-26 | 1999-08-03 | Mitsubishi Materials Corp | カップ型砥石およびウェーハの平面研削方法 |
| JP4352588B2 (ja) * | 2000-06-19 | 2009-10-28 | 三菱マテリアル株式会社 | 研削砥石 |
| KR100486429B1 (ko) | 2000-09-13 | 2005-04-29 | 가부시키가이샤 아라이도 마테리아루 | 경면 가공용 초지립 휠 |
| US8066553B2 (en) * | 2004-03-19 | 2011-11-29 | Memc Electronic Materials, Inc. | Wafer clamping device for a double side grinder |
| JP2006224201A (ja) * | 2005-02-15 | 2006-08-31 | Disco Abrasive Syst Ltd | 研削ホイール |
| JP5541941B2 (ja) * | 2010-02-15 | 2014-07-09 | 金井 宏彰 | 固定砥粒式ソーワイヤ |
| CN202088116U (zh) * | 2011-04-26 | 2011-12-28 | 博深工具股份有限公司 | 一种钻石型金刚石磨盘 |
| JP6350384B2 (ja) * | 2015-05-11 | 2018-07-04 | 信越半導体株式会社 | 研削用砥石 |
| JP6281988B2 (ja) * | 2016-09-29 | 2018-02-21 | 株式会社フェムテック | 表面加工装置及び方法 |
| JP6948798B2 (ja) * | 2017-02-14 | 2021-10-13 | 株式会社ディスコ | 研削ホイール |
| JP2018199197A (ja) * | 2017-05-29 | 2018-12-20 | 株式会社アライドマテリアル | 超砥粒ホイール |
| CN110722465A (zh) * | 2019-11-06 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | 一种硅片减薄砂轮 |
-
2022
- 2022-04-27 WO PCT/KR2022/006034 patent/WO2022231308A1/en not_active Ceased
- 2022-04-27 TW TW111116079A patent/TW202245033A/zh unknown
- 2022-04-27 EP EP22796140.6A patent/EP4329982A4/en active Pending
- 2022-04-27 JP JP2023566021A patent/JP2024518332A/ja active Pending
- 2022-04-27 US US18/556,026 patent/US20240217053A1/en active Pending
- 2022-04-27 KR KR1020237040301A patent/KR20230175281A/ko active Pending
- 2022-04-27 CN CN202280037766.XA patent/CN117460597A/zh active Pending
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