JP2023161772A5 - - Google Patents

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JP2023161772A5
JP2023161772A5 JP2022072318A JP2022072318A JP2023161772A5 JP 2023161772 A5 JP2023161772 A5 JP 2023161772A5 JP 2022072318 A JP2022072318 A JP 2022072318A JP 2022072318 A JP2022072318 A JP 2022072318A JP 2023161772 A5 JP2023161772 A5 JP 2023161772A5
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Japan
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JP2022072318A
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JP7706415B2 (ja
JP2023161772A (ja
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Priority to JP2022072318A priority Critical patent/JP7706415B2/ja
Priority claimed from JP2022072318A external-priority patent/JP7706415B2/ja
Priority to US18/177,021 priority patent/US12568638B2/en
Priority to DE102023109805.5A priority patent/DE102023109805A1/de
Priority to CN202310433327.7A priority patent/CN116960121A/zh
Publication of JP2023161772A publication Critical patent/JP2023161772A/ja
Publication of JP2023161772A5 publication Critical patent/JP2023161772A5/ja
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Publication of JP7706415B2 publication Critical patent/JP7706415B2/ja
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JP2022072318A 2022-04-26 2022-04-26 半導体装置および電力変換装置 Active JP7706415B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022072318A JP7706415B2 (ja) 2022-04-26 2022-04-26 半導体装置および電力変換装置
US18/177,021 US12568638B2 (en) 2022-04-26 2023-03-01 Semiconductor device and power conversion apparatus
DE102023109805.5A DE102023109805A1 (de) 2022-04-26 2023-04-19 Halbleitervorrichtung und Leistungsumwandlungseinrichtung
CN202310433327.7A CN116960121A (zh) 2022-04-26 2023-04-21 半导体装置及电力变换装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022072318A JP7706415B2 (ja) 2022-04-26 2022-04-26 半導体装置および電力変換装置

Publications (3)

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JP2023161772A JP2023161772A (ja) 2023-11-08
JP2023161772A5 true JP2023161772A5 (https=) 2024-05-21
JP7706415B2 JP7706415B2 (ja) 2025-07-11

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ID=88238271

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JP2022072318A Active JP7706415B2 (ja) 2022-04-26 2022-04-26 半導体装置および電力変換装置

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US (1) US12568638B2 (https=)
JP (1) JP7706415B2 (https=)
CN (1) CN116960121A (https=)
DE (1) DE102023109805A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117581383A (zh) * 2021-07-20 2024-02-20 株式会社电装 半导体装置
JP2025025459A (ja) * 2023-08-09 2025-02-21 株式会社デンソー 半導体装置
WO2025225319A1 (ja) * 2024-04-23 2025-10-30 株式会社デンソー 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645611A (ja) * 1992-07-24 1994-02-18 Fuji Electric Co Ltd 電力用ｍｏｓ型半導体素子
JP5103830B2 (ja) * 2006-08-28 2012-12-19 三菱電機株式会社 絶縁ゲート型半導体装置
JP5680299B2 (ja) 2009-12-25 2015-03-04 トヨタ自動車株式会社 半導体装置
JP6117602B2 (ja) 2013-04-25 2017-04-19 トヨタ自動車株式会社 半導体装置
US9147727B2 (en) 2013-09-30 2015-09-29 Infineon Technologies Ag Semiconductor device and method for forming a semiconductor device
JP7225562B2 (ja) 2017-05-30 2023-02-21 富士電機株式会社 半導体装置
DE112018007723T5 (de) * 2018-06-12 2021-02-25 Mitsubishi Electric Corporation Leistungshalbleitermodul und leistungswandlervorrichtung
JP7404702B2 (ja) 2019-08-09 2023-12-26 富士電機株式会社 半導体装置

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