JP2023160648A - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

Info

Publication number
JP2023160648A
JP2023160648A JP2022071142A JP2022071142A JP2023160648A JP 2023160648 A JP2023160648 A JP 2023160648A JP 2022071142 A JP2022071142 A JP 2022071142A JP 2022071142 A JP2022071142 A JP 2022071142A JP 2023160648 A JP2023160648 A JP 2023160648A
Authority
JP
Japan
Prior art keywords
substrate
guide
substrates
processing
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022071142A
Other languages
English (en)
Japanese (ja)
Inventor
直嗣 前川
Naotada Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2022071142A priority Critical patent/JP2023160648A/ja
Priority to KR1020230051969A priority patent/KR102690118B1/ko
Priority to CN202310437087.8A priority patent/CN116936402A/zh
Publication of JP2023160648A publication Critical patent/JP2023160648A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2022071142A 2022-04-22 2022-04-22 基板処理装置および基板処理方法 Pending JP2023160648A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022071142A JP2023160648A (ja) 2022-04-22 2022-04-22 基板処理装置および基板処理方法
KR1020230051969A KR102690118B1 (ko) 2022-04-22 2023-04-20 기판 처리 장치 및 기판 처리 방법
CN202310437087.8A CN116936402A (zh) 2022-04-22 2023-04-21 基板处理装置及基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022071142A JP2023160648A (ja) 2022-04-22 2022-04-22 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
JP2023160648A true JP2023160648A (ja) 2023-11-02

Family

ID=88385291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022071142A Pending JP2023160648A (ja) 2022-04-22 2022-04-22 基板処理装置および基板処理方法

Country Status (3)

Country Link
JP (1) JP2023160648A (zh)
KR (1) KR102690118B1 (zh)
CN (1) CN116936402A (zh)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001274131A (ja) 2000-03-28 2001-10-05 Toshiba Corp バッチ式処理装置およびバッチ式処理方法

Also Published As

Publication number Publication date
KR102690118B1 (ko) 2024-07-30
CN116936402A (zh) 2023-10-24
KR20230150744A (ko) 2023-10-31

Similar Documents

Publication Publication Date Title
KR102429748B1 (ko) 기판 처리 장치
CN114582751A (zh) 用于处理基板的装置
JP2022057798A (ja) 基板処理システム、および基板搬送方法
JP7024032B2 (ja) 基板処理装置
JP2010067871A (ja) 基板搬送装置およびそれを備えた基板処理装置
US7549428B2 (en) Substrate processing apparatus
JP2023160648A (ja) 基板処理装置および基板処理方法
TWI803011B (zh) 基板處理裝置
CN115966504A (zh) 处理基板的装置和方法
KR20220037989A (ko) 기판 처리 장치 및 기판 처리 방법
JP2021106253A (ja) 基板処理装置
TW202302235A (zh) 基板處理裝置及基板處理方法
US20240105483A1 (en) Substrate treating apparatus
JP5490860B2 (ja) 基板搬送装置およびそれを備えた基板処理装置
US20240105486A1 (en) Substrate treating apparatus
US20240066715A1 (en) Substrate treating apparatus
US20240014050A1 (en) Batch substrate treatment apparatus
WO2024042815A1 (ja) 基板処理装置
WO2024062695A1 (ja) 基板処理装置
WO2023042529A1 (ja) 基板処理装置、基板処理システムおよび基板処理方法
KR102186069B1 (ko) 기판 처리 장치 및 방법
JP2023129235A (ja) 基板処理システム及び基板処理方法
KR20220076279A (ko) 기판 처리 장치
KR20230175105A (ko) 기판 처리 장치

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20240626