JP2023059893A - 電子デバイスを乾燥させるための方法及び装置 - Google Patents
電子デバイスを乾燥させるための方法及び装置 Download PDFInfo
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Abstract
Description
ドア22を開けて、加熱伝導プラテン16から持ち上げた真空チャンバ3の下側に、濡れた又は湿気に曝された携帯電子デバイスを配置することで、デバイスは対流チャンバ4に入れられる。真空チャンバ3の持上げは、手動で行われてもよいし、持上機構によって行われてもよい。ドア22は、対流チャンバ4の上部にヒンジ留めされてよい。(何れの手法も、本発明の精神又は目的を損なわず、強化もしない。)
Claims (38)
- 水分の侵入によって少なくとも部分的に動作不能となった携帯電子デバイスを低圧チャンバ内に配置する工程と、
電子デバイスを加熱する工程と、
低圧チャンバ内の圧力を下げる工程と、
携帯電子デバイスの内部から携帯電子デバイスの外部へと水分を除去する工程と、
前記圧力を下げる工程の後に、低圧チャンバ内の圧力を上げる工程と、
低圧チャンバ内の圧力を低圧チャンバの外側の圧力と等しくする工程と、
低圧チャンバから携帯電子デバイスを取り出す工程と、
を含む方法。 - 前記配置する工程は、携帯電子デバイスをプラテン上に配置する工程を含んでおり、前記加熱する工程は、低くとも約110°F、高くとも約120°Fにプラテンを加熱する工程を含む、請求項1に記載の方法。
- 前記圧力を下げる工程は、チャンバの外側の圧力未満である低くとも約28Hgインチに圧力を下げる工程を含む、請求項1に記載の方法。
- 前記圧力を下げる工程は、低圧チャンバの外側の圧力未満である低くとも約30Hgインチに圧力を下げる工程を含む、請求項1に記載の方法。
- 前記配置する工程は、携帯電子デバイスをプラテン上に配置する工程を含み、前記加熱する工程は、低くとも約110°F、かつ高くとも約120°Fにプラテンを加熱する工程を含み、前記圧力を下げる工程は、チャンバの外側の圧力未満である低くとも約28Hgインチに圧力を下げる工程を含む、請求項1に記載の方法。
- 前記圧力を下げる工程と前記圧力を上げる工程は、前記携帯電子デバイスを取り出す工程の前に、逐次的に繰り返される、請求項1に記載の方法。
- 前記圧力を下げる工程と前記圧力を上げる工程の繰り返しを、少なくとも1つの予め定めた基準に従って、自動的に制御する工程を含む、請求項6に記載の方法。
- 十分な量の水分が電子デバイスから取り出された時点を検出する工程と、
前記圧力を下げる工程と前記圧力を上げる工程の繰り返しを、前記検出する工程の後に止める工程と、
を含む、請求項6に記載の方法。 - 低圧チャンバ内で相対湿度を測定する工程と、
相対湿度が下がり、かつ相対湿度の低下レートが遅くなった後に、圧力を上げる工程と、
を含む、請求項1から請求項8の何れかに記載の方法。 - 低圧チャンバ内で相対湿度を測定する工程を含み、
前記圧力を下げる工程と前記圧力を上げる工程は、前記携帯電子デバイスを取り出す工程の前に、逐次的に繰り返され、
前記圧力を下げる工程は、相対湿度が上がって、相対湿度の増大速度が遅くなると開始する、請求項1から請求項8の何れかに記載の方法。 - 低圧チャンバ内で相対湿度を測定する工程を含み、
前記圧力を下げる工程と前記圧力を上げる工程は、前記携帯電子デバイスを取り出す工程の前に、逐次的に繰り返され、
前記圧力を下げる工程と前記圧力を上げる工程の繰り返しは、連続する相対湿度極大値と相対湿度極小値との差が予め定めた許容範囲内となると止められる、請求項1から請求項8の何れかに記載の方法。 - 低圧チャンバ内で相対湿度を測定する工程を含み、
前記圧力を下げる工程と前記圧力を上げる工程は、前記携帯電子デバイスを取り出す工程の前に、逐次的に繰り返され、
前記圧力を下げる工程と前記圧力を上げる工程の繰り返しは、チャンバ内の相対湿度が予め定めた値に達すると止められる、請求項1から請求項8の何れかに記載の方法。 - 低圧チャンバ内の圧力を、ポンプを用いて下げる工程と、
ポンプによりチャンバから吸い出されているガスから、ガスがポンプに達する前に、水分を除去する工程と、
を含む、請求項1から請求項8の何れかに記載の方法。 - 前記水分を除去する工程は、乾燥剤を含有するデシケータを用いて水分を除去する工程を含む、請求項13に記載の方法。
- 乾燥剤から水分を除去する工程を含む、請求項14に記載の方法。
- 前記乾燥剤から水分を除去する工程の前に、ポンプから乾燥剤を隔絶する工程を含む、請求項15に記載の方法。
- 乾燥剤から水分を除去する工程の間、デシケータを通るエアの流れを反転させる工程を含む、請求項15に記載の方法。
- 前記乾燥剤から水分を除去する工程の間、乾燥剤を加熱する工程を含む、請求項15に記載の方法。
- 前記加熱する工程は、低くとも200°F、高くとも300°Fに乾燥剤を加熱する工程を含む、請求項15に記載の方法。
- 前記加熱する工程は、約250°Fに乾燥剤を加熱する工程を含む、請求項15に記載の方法。
- 電子デバイスの殺菌をする工程を含む、請求項1から請求項8の何れかに記載の方法。
- 前記殺菌をする工程は、電子デバイスにUV光を照射する工程を含む、請求項21に記載の方法。
- 十分な量の水分が電子デバイスから取り出された時点を検出する工程を含む、請求項1から請求項7の何れかに記載の方法。
- 内部を規定する低圧チャンバであって、内部に電子デバイスを配置し、内部から電子デバイスから取り出せるように内部の大きさが決められ、内部が構成されている低圧チャンバと、
チャンバに接続された排気ポンプと、
チャンバに接続されたヒータと、
排気ポンプ及びヒータに接続されたコントローラであって、低圧チャンバ内の圧力を下げるように排気ポンプを制御し、熱を電子デバイスに加えるようにヒータの運転を制御することによって、電子デバイスからの水分除去を制御するコントローラと、
を備えている装置。 - コントローラは、排気ポンプを制御して、低圧チャンバ内の圧力を複数回下げて、低圧チャンバ内の圧力は、圧力の逐次的な低下の間では上がる、請求項24に記載の装置。
- 低圧チャンバ及びコントローラに接続された湿度センサを更に備えており、コントローラは、湿度センサから受信した信号に少なくとも部分的に基づいて、排気ポンプを制御し、低圧チャンバ内の圧力を下げることを少なくとも一時的に止める、請求項24又は請求項25に記載の装置。
- 相対湿度の変化レートが低下する、又は約ゼロであると、コントローラは、排気ポンプを制御して、低圧チャンバ内の圧力を下げることを少なくとも一時的に止める、請求項26に記載の装置。
- 排気ポンプが低圧チャンバ内の圧力を複数回下げると、湿度センサは、相対湿度の極大値及び極小値を検出し、コントローラは、連続する極大相対湿度値と極小相対湿度値との差が予め定めた値と等しいかそれ未満である場合に、デバイスが乾燥していると判定する、請求項26に記載の装置。
- 低圧チャンバ及びコントローラに接続された湿度センサを備えており、コントローラは、排気ポンプを制御して、相対湿度の変化レートが低下する、又は約ゼロである場合に、低圧チャンバ内の圧力を下げ始める、請求項24又は請求項25に記載の装置。
- 低圧チャンバ及びコントローラに接続された弁を備えており、コントローラが弁を制御して圧力を上げることに少なくとも部分的に起因して、低圧チャンバ内の圧力が、圧力の逐次的な低下の間では上がる、請求項25から請求項29の何れかに記載の装置。
- コントローラは、弁を制御して低圧チャンバ内の圧力を上げ、ほぼ同時に、コントローラは、排気ポンプを制御して、低圧チャンバ内の圧力を下げるのを止める、請求項30に記載の装置。
- コントローラは、弁を制御して、低圧チャンバの内部と低圧チャンバの外側との間で圧力を等しくする、請求項29に記載の装置。
- ヒータ及びコントローラに接続された温度センサを備えており、コントローラは、圧力センサから受信された信号に少なくとも部分的に基づいてヒータを制御して、予め定めた温度を維持する、請求項24又は請求項25に記載の装置。
- 低圧チャンバ及びコントローラに接続された圧力センサを備えており、コントローラは、圧力センサから受信された信号に少なくとも部分的に基づいて排気ポンプを制御して、低圧チャンバ内の圧力を下げるのを少なくとも一時的に止める、請求項24又は請求項25に記載の装置。
- ヒータは、電子デバイスから水分を除去する間、電子デバイスが直接的に接触するプラテンを含んでいる、請求項24に記載の装置。
- チャンバに接続されており、チャンバ内に配置される電子デバイスの雑菌を殺すように設計及び構成された殺菌部を含む、請求項24に記載の装置。
- 滅菌部は、紫外灯である、請求項24に記載の装置。
- 電子デバイスを加熱する手段と、
電子デバイス内の圧力を下げる手段と、
十分な量の水分が電子デバイスから取り出された時点を検出する手段と、
を含む装置。
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