JP2022547886A - コア-シェル構造の銀コーティング銅ナノワイヤを含む伝導性ペースト組成物およびこれを含む伝導性フィルム - Google Patents
コア-シェル構造の銀コーティング銅ナノワイヤを含む伝導性ペースト組成物およびこれを含む伝導性フィルム Download PDFInfo
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Abstract
Description
本発明による前記伝導性ペースト組成物は、シリコン樹脂バインダーおよび炭化水素系バインダーの混合物(以下、バインダー混合物)を含むことで、従来の伝導性ペーストよりも少ない含量の銀コーティング銅ナノワイヤを含有することができる。
前記基板は、有機および無機材料、そして金属で製造された基板を使用することができ、これを具体的に説明すると、プラスチック基板、ポリマーフィルム基板、ガラス基板、石英基板、シリコンウェハ基板、金属基板およびセラミック基板などであることができる。前記基板を構成する物質の例としては、メタクリレート重合体、芳香族ポリエステル系重合体、変性ポリフェニレンオキシド系重合体(Modified Polyphenylene Oxide:MPPO)、セルロースエステル(Cellulose ester)、セルロースアセテート、スチレン-ブタジエン共重合体、アクリロニトリル-ブタジエン-スチレン共重合体(acrylonitrile butadiene styrenecopolymer、ABS樹脂)、オレフィンマレイミド共重合体、石英(quartz)、シリコンウェハ、アルミニウム、ステンレス鋼、エポキシ樹脂、溶融シリカ、ガラス、再生セルロース(Regenerated cellulose)、トリアセチル・セルロース、フェノール樹脂、ポリジメチルシクロヘキセンテレフタレート、ポリジメチルシロキサン(polydimethylsiloxane、PDMS)、ポリメチルメタクリレート、ポリメチルアクリレート(polymethylacrylate)、ポリブタジエン、ポリブチレンテレフタレート、ポリフッ化ビニリデン、ポリビニリデンフルオライド(Polyvinylidenfluoride)、ポリビニルアセテート、ポリスルホネート、ポリスルホン(Polysulfone)、ポリスチレン(PS)、ポリシラザン(polysilazane)、ポリシラン(polysilane)、ポリシロキサン(polysiloxane)、ポリアラミド、ポリアリレート、ポリアミド、ポリアミドイミド、ポリアクリレート、ポリアクリロニトリル(Polyacrylonitrile、PAN)、ポリエステル、ポリエステルスルホン(Polyethersulfone、PES)、ポリエーテルニトリル、ポリエーテルスルホン、ポリエーテルイミド、ポリエーテルケトン、ポリエチレンナフタレート(polyethylenenaphthalte、PEN)、ポリエチレンスルホン、ポリエチレン(PE)、ポリエチレンテレフタレート(Polyethylene terephtalate、PET)、ポリエチルメタクリレート(polyethylmetacrylate)、ポリエチルアクリレート(polyethylacrylate)、ポリエポキシド、ポリ塩化ビニル、ポリオキシエチレン、ポリオレフィン、ポリウレタン、ポリイミド樹脂、ポリカルボシラン(polycarbosilane)、ポリカーボネート(Polycarbonate)、ポリフェニレンスルフィド、ポリフェニレンエーテル、ポリプロピレン(PP)、AS樹脂、GaAs、MgO、シリカ、ポリビニルクロライド、ポリジメチルシクロヘキセンテレフタレート、ポリカーボン(polycarbon)などであることができるが、これに制限されるものではない。
以下、実施例により、本発明をより詳細に説明する。これらの実施例は、単に本発明を例示するためのものであって、本発明の範囲がこれらの実施例によって制限されるものと解釈されないことは、当業界において通常の知識を有する者にとって自明である。
100mlの三角フラスコに有機溶媒であるテルピネオール(α-terpineol、Sigma-Aldrich)28.12g(全重量に対して76.8wt%)、エチルセルロース(Ethylcellulose、Sigma-Aldrich)2.36g(全重量に対して6.4wt%)を入れて、70℃のホットプレートで500rpmで撹拌してエチルセルロースを溶解する。その後、韓国登録特許KR10-1789213 B1(公告日:2017.10.26)に記載の方法にしたがって製造されたコア-シェル構造の銀コーティングされた銅ナノワイヤ5g(全重量に対して13.6wt%)を入れ、シリコン粘着剤(RSN-0806、ダウコーニング)3.16g(全重量に対して8.6wt%)を添加してからよく混合した後、3ロールミル(3-rollmill、EXAKT 50)を用いて、5回分散処理を行って伝導性ペースト組成物を製造した(図1)。
前記実施例1で銀コーティングされた銅ナノワイヤの含量を3gで使用した以外は、同様に実施した。
前記実施例2で銀コーティングされた銅ナノワイヤの代わりに銀ナノ粒子を使用した以外は、同様に実施した。
Claims (11)
- コア-シェル構造の銀コーティングされた銅ナノワイヤ、シリコン樹脂バインダーおよび炭化水素系樹脂バインダーを含むバインダー混合物、および有機溶媒を含む、伝導性ペースト組成物。
- コア-シェル構造の銀コーティング銅ナノワイヤ5~30重量%を含む、請求項1に記載の伝導性ペースト組成物。
- シリコン樹脂バインダー3~20重量%を含む、請求項1に記載の伝導性ペースト組成物。
- 前記バインダー混合物と前記銀コーティング銅ナノワイヤの重量比が1:0.1~1.2である、請求項1に記載の伝導性ペースト組成物。
- 前記シリコン樹脂バインダーは、シリコン樹脂バインダーの全重量に対して、シラノール基を0.1~10重量%含有し、メチル基に対するフェニル基の比率が0.3~2.5モル比である、請求項1に記載の伝導性ペースト組成物。
- 炭化水素系バインダー3~15重量%を含む、請求項1に記載の伝導性ペースト組成物。
- 前記炭化水素系バインダーは、セルロース系バインダー、活性水素を含むアクリル系繰り返し単位を含むアクリル系バインダーおよびポリビニル系バインダーから選択されるいずれか一つまたは2種以上を混合して使用される、請求項5に記載の伝導性ペースト組成物。
- 前記炭化水素系バインダーと前記シリコン樹脂バインダーの重量比が1:0.8~1.8である、請求項1に記載の伝導性ペースト組成物。
- 有機溶媒50~90重量%を含む、請求項1に記載の伝導性ペースト組成物。
- 前記有機溶媒は、アセトン、メチルエチルケトン、メチルアルコール、エチルアルコール、イソプロピルアルコール、ブチルアルコール、エチレングリコール、ポリエチレングリコール、テトラヒドロフラン、ジメチルホルムアミド、ジメチルアセトアミド、N-メチル-2-ピロリドン、ヘキサン、シクロヘキサノン、トルエン、クロロホルム、ジクロロベンゼン、ジメチルベンゼン、トリメチルベンゼン、ピリジン、メチルナフタレン、ニトロメタン、アクリロニトリル、オクタデシルアミン、アニリン、ジメチルスルホキシド、ジエチレングリコールエチルエーテルおよびテルピネオールから選択されるいずれか一つまたは二つ以上である、請求項1に記載の伝導性ペースト組成物。
- 請求項1から請求項10のいずれか一項に記載の伝導性ペースト組成物を含む、伝導性フィルム。
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PCT/KR2019/014588 WO2021045307A1 (ko) | 2019-09-06 | 2019-10-31 | 코어-쉘 구조의 은 코팅 구리 나노와이어를 포함하는 전도성 페이스트 조성물 및 이를 포함하는 전도성 필름 |
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JP2016533001A (ja) * | 2013-07-12 | 2016-10-20 | バイオニア コーポレーション | カーボンナノチューブまたはカーボンナノチューブ‐金属複合体を用いたセラミックペースト組成物およびそれを含む導電性フィルム |
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