JP2022537038A5 - - Google Patents

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Publication number
JP2022537038A5
JP2022537038A5 JP2021575229A JP2021575229A JP2022537038A5 JP 2022537038 A5 JP2022537038 A5 JP 2022537038A5 JP 2021575229 A JP2021575229 A JP 2021575229A JP 2021575229 A JP2021575229 A JP 2021575229A JP 2022537038 A5 JP2022537038 A5 JP 2022537038A5
Authority
JP
Japan
Prior art keywords
support stand
outer diameter
circuit board
substrate
ceramic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021575229A
Other languages
English (en)
Japanese (ja)
Other versions
JP7612618B2 (ja
JP2022537038A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2020/037699 external-priority patent/WO2020257095A1/en
Publication of JP2022537038A publication Critical patent/JP2022537038A/ja
Publication of JP2022537038A5 publication Critical patent/JP2022537038A5/ja
Priority to JP2024228084A priority Critical patent/JP7789172B2/ja
Application granted granted Critical
Publication of JP7612618B2 publication Critical patent/JP7612618B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021575229A 2019-06-18 2020-06-15 基板処理システム用の縮径キャリアリングハードウェア Active JP7612618B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024228084A JP7789172B2 (ja) 2019-06-18 2024-12-25 基板処理システム用の縮径キャリアリングハードウェア

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962862814P 2019-06-18 2019-06-18
US62/862,814 2019-06-18
PCT/US2020/037699 WO2020257095A1 (en) 2019-06-18 2020-06-15 Reduced diameter carrier ring hardware for substrate processing systems

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024228084A Division JP7789172B2 (ja) 2019-06-18 2024-12-25 基板処理システム用の縮径キャリアリングハードウェア

Publications (3)

Publication Number Publication Date
JP2022537038A JP2022537038A (ja) 2022-08-23
JP2022537038A5 true JP2022537038A5 (https=) 2023-05-31
JP7612618B2 JP7612618B2 (ja) 2025-01-14

Family

ID=74040878

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021575229A Active JP7612618B2 (ja) 2019-06-18 2020-06-15 基板処理システム用の縮径キャリアリングハードウェア
JP2024228084A Active JP7789172B2 (ja) 2019-06-18 2024-12-25 基板処理システム用の縮径キャリアリングハードウェア

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024228084A Active JP7789172B2 (ja) 2019-06-18 2024-12-25 基板処理システム用の縮径キャリアリングハードウェア

Country Status (7)

Country Link
US (1) US12480210B2 (https=)
EP (1) EP3987081A4 (https=)
JP (2) JP7612618B2 (https=)
KR (1) KR102916789B1 (https=)
CN (2) CN114008738B (https=)
TW (2) TWI849145B (https=)
WO (1) WO2020257095A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220117155A (ko) * 2021-02-16 2022-08-23 에이에스엠 아이피 홀딩 비.브이. 흐름 제어 링을 갖는 기판 처리 장치 및 기판 처리 방법

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WO2011058851A1 (ja) 2009-11-16 2011-05-19 シャープ株式会社 ドライエッチング装置およびドライエッチング方法
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JP6169040B2 (ja) * 2014-05-12 2017-07-26 東京エレクトロン株式会社 プラズマ処理装置の上部電極構造、プラズマ処理装置、及びプラズマ処理装置の運用方法
US20160289827A1 (en) * 2015-03-31 2016-10-06 Lam Research Corporation Plasma processing systems and structures having sloped confinement rings
US20170002465A1 (en) 2015-06-30 2017-01-05 Lam Research Corporation Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity
US10854492B2 (en) * 2015-08-18 2020-12-01 Lam Research Corporation Edge ring assembly for improving feature profile tilting at extreme edge of wafer
US10541117B2 (en) 2015-10-29 2020-01-21 Lam Research Corporation Systems and methods for tilting a wafer for achieving deposition uniformity
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US10923385B2 (en) * 2016-11-03 2021-02-16 Lam Research Corporation Carrier plate for use in plasma processing systems
US20180182635A1 (en) * 2016-12-27 2018-06-28 Tokyo Electron Limited Focus ring and substrate processing apparatus
KR102417931B1 (ko) * 2017-05-30 2022-07-06 에이에스엠 아이피 홀딩 비.브이. 기판 지지 장치 및 이를 포함하는 기판 처리 장치
WO2019103722A1 (en) * 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings

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