JP2021527328A5 - - Google Patents
Info
- Publication number
- JP2021527328A5 JP2021527328A5 JP2020568515A JP2020568515A JP2021527328A5 JP 2021527328 A5 JP2021527328 A5 JP 2021527328A5 JP 2020568515 A JP2020568515 A JP 2020568515A JP 2020568515 A JP2020568515 A JP 2020568515A JP 2021527328 A5 JP2021527328 A5 JP 2021527328A5
- Authority
- JP
- Japan
- Prior art keywords
- base material
- metal base
- rough
- material includes
- planar surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023210900A JP7776483B2 (ja) | 2018-06-14 | 2023-12-14 | 保護コーティングを有するプロセスチャンバプロセスキット |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862685098P | 2018-06-14 | 2018-06-14 | |
| US62/685,098 | 2018-06-14 | ||
| PCT/US2019/033259 WO2019240915A1 (en) | 2018-06-14 | 2019-05-21 | Process chamber process kit with protective coating |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023210900A Division JP7776483B2 (ja) | 2018-06-14 | 2023-12-14 | 保護コーティングを有するプロセスチャンバプロセスキット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021527328A JP2021527328A (ja) | 2021-10-11 |
| JP2021527328A5 true JP2021527328A5 (https=) | 2022-05-30 |
| JP7405776B2 JP7405776B2 (ja) | 2023-12-26 |
Family
ID=68840245
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020568515A Active JP7405776B2 (ja) | 2018-06-14 | 2019-05-21 | 保護コーティングを有するプロセスチャンバプロセスキット |
| JP2023210900A Active JP7776483B2 (ja) | 2018-06-14 | 2023-12-14 | 保護コーティングを有するプロセスチャンバプロセスキット |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023210900A Active JP7776483B2 (ja) | 2018-06-14 | 2023-12-14 | 保護コーティングを有するプロセスチャンバプロセスキット |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US12354843B2 (https=) |
| JP (2) | JP7405776B2 (https=) |
| KR (2) | KR102828235B1 (https=) |
| CN (2) | CN112236839B (https=) |
| TW (2) | TWI880527B (https=) |
| WO (1) | WO2019240915A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11664247B2 (en) | 2020-10-16 | 2023-05-30 | Applied Materials, Inc. | Dynamic interface for providing a symmetric radio frequency return path |
| US20230064070A1 (en) * | 2021-08-30 | 2023-03-02 | Auo Crystal Corporation | Semiconductor processing equipment part and method for making the same |
| US20230215702A1 (en) * | 2021-12-30 | 2023-07-06 | Applied Materials, Inc. | Uniformity control for plasma processing using wall recombination |
| KR20250099351A (ko) * | 2022-10-31 | 2025-07-01 | 램 리써치 코포레이션 | 반도체 프로세싱 챔버를 위한 이중층 기밀 원자 층 증착 코팅을 갖는 구성요소 |
| US20250201527A1 (en) * | 2023-12-19 | 2025-06-19 | Applied Materials, Inc. | High Conformal Coating on Textured Surface of Processing Chamber Component |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3362552B2 (ja) * | 1995-03-10 | 2003-01-07 | 東京エレクトロン株式会社 | 成膜処理装置 |
| US6251216B1 (en) * | 1997-12-17 | 2001-06-26 | Matsushita Electronics Corporation | Apparatus and method for plasma processing |
| JPH11238722A (ja) * | 1997-12-17 | 1999-08-31 | Matsushita Electron Corp | プラズマ処理装置及びプラズマ処理方法 |
| US6863926B2 (en) | 2002-01-15 | 2005-03-08 | David Mark Lynn | Corrosive-resistant coating over aluminum substrates for use in plasma deposition and etch environments |
| US6780787B2 (en) * | 2002-03-21 | 2004-08-24 | Lam Research Corporation | Low contamination components for semiconductor processing apparatus and methods for making components |
| US7311797B2 (en) * | 2002-06-27 | 2007-12-25 | Lam Research Corporation | Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor |
| US20040033361A1 (en) * | 2002-08-06 | 2004-02-19 | Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.) | Component of glass-like carbon for CVD apparatus and process for production thereof |
| US7250114B2 (en) * | 2003-05-30 | 2007-07-31 | Lam Research Corporation | Methods of finishing quartz glass surfaces and components made by the methods |
| JP4606121B2 (ja) * | 2004-01-29 | 2011-01-05 | 京セラ株式会社 | 耐食膜積層耐食性部材およびその製造方法 |
| JP2006128370A (ja) * | 2004-10-28 | 2006-05-18 | Tokyo Electron Ltd | 成膜装置、成膜方法、プログラムおよび記録媒体 |
| KR100915722B1 (ko) * | 2005-06-23 | 2009-09-04 | 도쿄엘렉트론가부시키가이샤 | 반도체 처리 장치용의 구성 부재 및 그 제조 방법, 및반도체 처리 장치 |
| US20060292310A1 (en) | 2005-06-27 | 2006-12-28 | Applied Materials, Inc. | Process kit design to reduce particle generation |
| US7541094B1 (en) * | 2006-03-03 | 2009-06-02 | Quantum Global Technologies, Llc | Firepolished quartz parts for use in semiconductor processing |
| US20080063798A1 (en) * | 2006-08-30 | 2008-03-13 | Kher Shreyas S | Precursors and hardware for cvd and ald |
| US8097105B2 (en) | 2007-01-11 | 2012-01-17 | Lam Research Corporation | Extending lifetime of yttrium oxide as a plasma chamber material |
| AT504482B1 (de) | 2007-03-01 | 2008-06-15 | Ruebig Gmbh & Co Kg | Verfahren zur herstellung einer beschichtung |
| JP5475261B2 (ja) | 2008-03-31 | 2014-04-16 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US20100272982A1 (en) * | 2008-11-04 | 2010-10-28 | Graeme Dickinson | Thermal spray coatings for semiconductor applications |
| US8206829B2 (en) * | 2008-11-10 | 2012-06-26 | Applied Materials, Inc. | Plasma resistant coatings for plasma chamber components |
| CN107731648B (zh) | 2010-10-28 | 2020-02-14 | 应用材料公司 | 高纯度铝涂层硬阳极化 |
| JP2014158009A (ja) * | 2012-07-03 | 2014-08-28 | Hitachi High-Technologies Corp | 熱処理装置 |
| US9337002B2 (en) * | 2013-03-12 | 2016-05-10 | Lam Research Corporation | Corrosion resistant aluminum coating on plasma chamber components |
| GB2513575B (en) | 2013-04-29 | 2017-05-31 | Keronite Int Ltd | Corrosion and erosion-resistant mixed oxide coatings for the protection of chemical and plasma process chamber components |
| US9711334B2 (en) | 2013-07-19 | 2017-07-18 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US9583369B2 (en) * | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| CN106029948B (zh) | 2014-01-17 | 2020-02-21 | Iones株式会社 | 用于形成具有改善的等离子体耐受性的陶瓷涂层的方法和由此形成的陶瓷涂层 |
| WO2015116455A1 (en) * | 2014-01-31 | 2015-08-06 | Applied Materials, Inc. | Chamber coatings |
| US9869013B2 (en) | 2014-04-25 | 2018-01-16 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US9790581B2 (en) | 2014-06-25 | 2017-10-17 | Fm Industries, Inc. | Emissivity controlled coatings for semiconductor chamber components |
| US20160258064A1 (en) | 2015-03-06 | 2016-09-08 | Applied Materials, Inc. | Barrier anodization methods to develop aluminum oxide layer for plasma equipment components |
| EP3165629A1 (en) | 2015-11-06 | 2017-05-10 | Rolls-Royce Corporation | Plasma spray physical vapor deposition deposited environmental barrier coating |
| US20170291856A1 (en) * | 2016-04-06 | 2017-10-12 | Applied Materials, Inc. | Solution precursor plasma spray of ceramic coating for semiconductor chamber applications |
| US10262839B2 (en) * | 2016-06-14 | 2019-04-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Aluminum apparatus with aluminum oxide layer and method for forming the same |
| US20180016678A1 (en) | 2016-07-15 | 2018-01-18 | Applied Materials, Inc. | Multi-layer coating with diffusion barrier layer and erosion resistant layer |
| TWM563652U (zh) * | 2016-10-13 | 2018-07-11 | 美商應用材料股份有限公司 | 用於電漿處理裝置的腔室部件及包含其之裝置 |
-
2019
- 2019-05-21 CN CN201980037849.7A patent/CN112236839B/zh active Active
- 2019-05-21 CN CN202411905565.4A patent/CN119890023A/zh active Pending
- 2019-05-21 KR KR1020217001257A patent/KR102828235B1/ko active Active
- 2019-05-21 WO PCT/US2019/033259 patent/WO2019240915A1/en not_active Ceased
- 2019-05-21 KR KR1020257021611A patent/KR20250107284A/ko active Pending
- 2019-05-21 JP JP2020568515A patent/JP7405776B2/ja active Active
- 2019-05-21 US US16/418,274 patent/US12354843B2/en active Active
- 2019-06-12 TW TW112148937A patent/TWI880527B/zh active
- 2019-06-12 TW TW108120249A patent/TWI828704B/zh active
-
2023
- 2023-04-05 US US18/131,306 patent/US20230245863A1/en not_active Abandoned
- 2023-12-14 JP JP2023210900A patent/JP7776483B2/ja active Active
-
2025
- 2025-09-02 US US19/316,924 patent/US20250385080A1/en active Pending
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