KR102828235B1 - 보호 코팅을 갖는 프로세스 챔버 프로세스 키트 - Google Patents

보호 코팅을 갖는 프로세스 챔버 프로세스 키트 Download PDF

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Publication number
KR102828235B1
KR102828235B1 KR1020217001257A KR20217001257A KR102828235B1 KR 102828235 B1 KR102828235 B1 KR 102828235B1 KR 1020217001257 A KR1020217001257 A KR 1020217001257A KR 20217001257 A KR20217001257 A KR 20217001257A KR 102828235 B1 KR102828235 B1 KR 102828235B1
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South Korea
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chamber
substrate material
metallic substrate
chamber component
flat
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Korean (ko)
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KR20210008931A (ko
Inventor
지안 우
웨이 리우
린린 왕
테레사 크라머 구아리니
말콤 베반
라라 호릴차크
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어플라이드 머티어리얼스, 인코포레이티드
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Priority to KR1020257021611A priority Critical patent/KR20250107284A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01L21/02274—
    • H01L21/56—
    • H01L21/67017—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020217001257A 2018-06-14 2019-05-21 보호 코팅을 갖는 프로세스 챔버 프로세스 키트 Active KR102828235B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257021611A KR20250107284A (ko) 2018-06-14 2019-05-21 보호 코팅을 갖는 프로세스 챔버 프로세스 키트

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862685098P 2018-06-14 2018-06-14
US62/685,098 2018-06-14
PCT/US2019/033259 WO2019240915A1 (en) 2018-06-14 2019-05-21 Process chamber process kit with protective coating

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257021611A Division KR20250107284A (ko) 2018-06-14 2019-05-21 보호 코팅을 갖는 프로세스 챔버 프로세스 키트

Publications (2)

Publication Number Publication Date
KR20210008931A KR20210008931A (ko) 2021-01-25
KR102828235B1 true KR102828235B1 (ko) 2025-07-03

Family

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Family Applications (2)

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KR1020217001257A Active KR102828235B1 (ko) 2018-06-14 2019-05-21 보호 코팅을 갖는 프로세스 챔버 프로세스 키트
KR1020257021611A Pending KR20250107284A (ko) 2018-06-14 2019-05-21 보호 코팅을 갖는 프로세스 챔버 프로세스 키트

Family Applications After (1)

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KR1020257021611A Pending KR20250107284A (ko) 2018-06-14 2019-05-21 보호 코팅을 갖는 프로세스 챔버 프로세스 키트

Country Status (6)

Country Link
US (3) US12354843B2 (https=)
JP (2) JP7405776B2 (https=)
KR (2) KR102828235B1 (https=)
CN (2) CN112236839B (https=)
TW (2) TWI880527B (https=)
WO (1) WO2019240915A1 (https=)

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US20230064070A1 (en) * 2021-08-30 2023-03-02 Auo Crystal Corporation Semiconductor processing equipment part and method for making the same
US20230215702A1 (en) * 2021-12-30 2023-07-06 Applied Materials, Inc. Uniformity control for plasma processing using wall recombination
WO2024097505A1 (en) * 2022-10-31 2024-05-10 Lam Research Corporation Component with a dual layer hermetic atomic layer deposition coatings for a semiconductor processing chamber
US20250201527A1 (en) * 2023-12-19 2025-06-19 Applied Materials, Inc. High Conformal Coating on Textured Surface of Processing Chamber Component

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US6863926B2 (en) 2002-01-15 2005-03-08 David Mark Lynn Corrosive-resistant coating over aluminum substrates for use in plasma deposition and etch environments
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Also Published As

Publication number Publication date
CN119890023A (zh) 2025-04-25
CN112236839B (zh) 2025-01-03
JP7776483B2 (ja) 2025-11-26
KR20250107284A (ko) 2025-07-11
WO2019240915A1 (en) 2019-12-19
TW202418348A (zh) 2024-05-01
JP7405776B2 (ja) 2023-12-26
CN112236839A (zh) 2021-01-15
US20250385080A1 (en) 2025-12-18
US20190385825A1 (en) 2019-12-19
TW202013426A (zh) 2020-04-01
US20230245863A1 (en) 2023-08-03
US12354843B2 (en) 2025-07-08
JP2024037895A (ja) 2024-03-19
KR20210008931A (ko) 2021-01-25
JP2021527328A (ja) 2021-10-11
TWI880527B (zh) 2025-04-11
TWI828704B (zh) 2024-01-11

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