JPWO2019240915A5 - - Google Patents

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Publication number
JPWO2019240915A5
JPWO2019240915A5 JP2020568515A JP2020568515A JPWO2019240915A5 JP WO2019240915 A5 JPWO2019240915 A5 JP WO2019240915A5 JP 2020568515 A JP2020568515 A JP 2020568515A JP 2020568515 A JP2020568515 A JP 2020568515A JP WO2019240915 A5 JPWO2019240915 A5 JP WO2019240915A5
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Japan
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metal
based material
material comprises
planar surface
rough non
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JP2020568515A
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English (en)
Japanese (ja)
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JP7405776B2 (ja
JP2021527328A5 (https=
JP2021527328A (ja
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Priority claimed from PCT/US2019/033259 external-priority patent/WO2019240915A1/en
Publication of JP2021527328A publication Critical patent/JP2021527328A/ja
Publication of JP2021527328A5 publication Critical patent/JP2021527328A5/ja
Publication of JPWO2019240915A5 publication Critical patent/JPWO2019240915A5/ja
Priority to JP2023210900A priority Critical patent/JP7776483B2/ja
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Publication of JP7405776B2 publication Critical patent/JP7405776B2/ja
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JP2020568515A 2018-06-14 2019-05-21 保護コーティングを有するプロセスチャンバプロセスキット Active JP7405776B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023210900A JP7776483B2 (ja) 2018-06-14 2023-12-14 保護コーティングを有するプロセスチャンバプロセスキット

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862685098P 2018-06-14 2018-06-14
US62/685,098 2018-06-14
PCT/US2019/033259 WO2019240915A1 (en) 2018-06-14 2019-05-21 Process chamber process kit with protective coating

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023210900A Division JP7776483B2 (ja) 2018-06-14 2023-12-14 保護コーティングを有するプロセスチャンバプロセスキット

Publications (4)

Publication Number Publication Date
JP2021527328A JP2021527328A (ja) 2021-10-11
JP2021527328A5 JP2021527328A5 (https=) 2022-05-30
JPWO2019240915A5 true JPWO2019240915A5 (https=) 2022-05-30
JP7405776B2 JP7405776B2 (ja) 2023-12-26

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ID=68840245

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JP2020568515A Active JP7405776B2 (ja) 2018-06-14 2019-05-21 保護コーティングを有するプロセスチャンバプロセスキット
JP2023210900A Active JP7776483B2 (ja) 2018-06-14 2023-12-14 保護コーティングを有するプロセスチャンバプロセスキット

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JP2023210900A Active JP7776483B2 (ja) 2018-06-14 2023-12-14 保護コーティングを有するプロセスチャンバプロセスキット

Country Status (6)

Country Link
US (3) US12354843B2 (https=)
JP (2) JP7405776B2 (https=)
KR (2) KR102828235B1 (https=)
CN (2) CN112236839B (https=)
TW (2) TWI880527B (https=)
WO (1) WO2019240915A1 (https=)

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US20230064070A1 (en) * 2021-08-30 2023-03-02 Auo Crystal Corporation Semiconductor processing equipment part and method for making the same
US20230215702A1 (en) * 2021-12-30 2023-07-06 Applied Materials, Inc. Uniformity control for plasma processing using wall recombination
WO2024097505A1 (en) * 2022-10-31 2024-05-10 Lam Research Corporation Component with a dual layer hermetic atomic layer deposition coatings for a semiconductor processing chamber
US20250201527A1 (en) * 2023-12-19 2025-06-19 Applied Materials, Inc. High Conformal Coating on Textured Surface of Processing Chamber Component

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