JPWO2019240915A5 - - Google Patents
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- JPWO2019240915A5 JPWO2019240915A5 JP2020568515A JP2020568515A JPWO2019240915A5 JP WO2019240915 A5 JPWO2019240915 A5 JP WO2019240915A5 JP 2020568515 A JP2020568515 A JP 2020568515A JP 2020568515 A JP2020568515 A JP 2020568515A JP WO2019240915 A5 JPWO2019240915 A5 JP WO2019240915A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- based material
- material comprises
- planar surface
- rough non
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 14
- 239000007769 metal material Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 10
- 239000000377 silicon dioxide Substances 0.000 claims 7
- 229910052782 aluminium Inorganic materials 0.000 claims 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 230000003746 surface roughness Effects 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 238000009832 plasma treatment Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Claims (15)
粗い非平面表面を含む金属ベース材料であって、前記粗い非平面表面が、４マイクロインチから８０マイクロインチの間の平均表面粗さ（Ｒａ）を有する、金属ベース材料と、
前記粗い非平面表面上に形成された平面シリカコーティングであって、
前記粗い非平面表面のＲａよりも小さいＲａを有する表面と、
約０．２ミクロンから約１０ミクロンの間の厚さと、
体積で１％未満の多孔度とを有し、
２Ｅ １２ ａｔｏｍｓ／ｃｍ２未満のアルミニウムを含有する、
平面シリカコーティングと、
を含むチャンバコンポーネント。 A chamber component used within a plasma processing chamber,
A metal-based material comprising a rough non-planar surface, wherein the rough non-planar surface has an average surface roughness (Ra) between 4 microinch and 80 microinch.
A flat silica coating formed on the rough non-planar surface.
A surface having Ra smaller than Ra of the rough non-planar surface, and
With a thickness between about 0.2 micron and about 10 microns,
With a porosity of less than 1% by volume,
2E Contains less than 12 atoms / cm 2 of aluminum,
With flat silica coating,
Chamber components including.
粗い非平面表面を含む金属ベース材料から前記チャンバコンポーネントの本体を形成することと、
前記本体上にシリカの層を堆積させることと、
前記シリカの層および前記金属ベース材料を加熱することと、
を含み、前記シリカの層が、
前記粗い非平面表面のＲａ表面粗さよりも小さいＲａ表面粗さを有する表面と、
約０．２ミクロンから約１０ミクロンの間の厚さと、
体積で１％未満の多孔度とを含み、
２Ｅ １２ ａｔｏｍｓ／ｃｍ２未満のアルミニウムを含有する、
方法。 A method for manufacturing chamber components for use in plasma processing environments.
Forming the body of the chamber component from a metal- based material , including a rough non-planar surface ,
Placing a layer of silica on the body and
By heating the silica layer and the metal -based material,
The silica layer comprises:
A surface having a Ra surface roughness smaller than the Ra surface roughness of the rough non-planar surface,
With a thickness between about 0.2 micron and about 10 microns,
Including porosity of less than 1% by volume,
2E Contains less than 12 atoms / cm 2 of aluminum,
Method.
前記粗い非平面表面上に形成された平面シリカコーティングであって、前記粗い非平面表面のＲａよりも小さいＲａを有する表面と、約０．２ミクロンから約１０ミクロンの間の厚さと、体積で１％未満の多孔度とを有し、２Ｅ １２ ａｔｏｍｓ／ｃｍ２未満のアルミニウムを含有する平面シリカコーティングと、
を含むチャンバコンポーネントを含むプロセスチャンバを、窒素または酸素を含むプラズマでプラズマ処理することと、
基板であって、スタックが前記基板上に配置されている基板を、前記プロセスチャンバ内に配置することと、
前記基板上に配置された前記スタックを、プラズマ処理することと、
を含む方法。 A metal-based material comprising a rough non-planar surface, wherein the rough non-planar surface has an average surface roughness (Ra) between 4 microinch and 80 microinch.
A flat silica coating formed on the rough non-planar surface, with a surface having Ra smaller than Ra of the rough non-planar surface, and a thickness and volume between about 0.2 micron and about 10 micron. A planar silica coating with a porosity of less than 1% and an aluminum content of less than 2E 12 atoms / cm 2 .
Plasma treatment of a process chamber containing a chamber component containing nitrogen or oxygen with plasma containing nitrogen or oxygen.
The substrate, in which the stack is arranged on the substrate, is arranged in the process chamber.
Plasma treatment of the stack arranged on the substrate and
How to include.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023210900A JP2024037895A (en) | 2018-06-14 | 2023-12-14 | Process chamber process kit with protective coating |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862685098P | 2018-06-14 | 2018-06-14 | |
| US62/685,098 | 2018-06-14 | ||
| PCT/US2019/033259 WO2019240915A1 (en) | 2018-06-14 | 2019-05-21 | Process chamber process kit with protective coating |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023210900A Division JP2024037895A (en) | 2018-06-14 | 2023-12-14 | Process chamber process kit with protective coating |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021527328A JP2021527328A (en) | 2021-10-11 |
| JPWO2019240915A5 true JPWO2019240915A5 (en) | 2022-05-30 |
| JP7405776B2 JP7405776B2 (en) | 2023-12-26 |
Family
ID=68840245
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020568515A Active JP7405776B2 (en) | 2018-06-14 | 2019-05-21 | Process chamber process kit with protective coating |
| JP2023210900A Pending JP2024037895A (en) | 2018-06-14 | 2023-12-14 | Process chamber process kit with protective coating |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023210900A Pending JP2024037895A (en) | 2018-06-14 | 2023-12-14 | Process chamber process kit with protective coating |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20190385825A1 (en) |
| JP (2) | JP7405776B2 (en) |
| KR (1) | KR20210008931A (en) |
| CN (1) | CN112236839A (en) |
| TW (1) | TWI828704B (en) |
| WO (1) | WO2019240915A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11664247B2 (en) | 2020-10-16 | 2023-05-30 | Applied Materials, Inc. | Dynamic interface for providing a symmetric radio frequency return path |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238722A (en) * | 1997-12-17 | 1999-08-31 | Matsushita Electron Corp | Apparatus and method for plasma processing |
| US6251216B1 (en) * | 1997-12-17 | 2001-06-26 | Matsushita Electronics Corporation | Apparatus and method for plasma processing |
| US20040033361A1 (en) * | 2002-08-06 | 2004-02-19 | Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.) | Component of glass-like carbon for CVD apparatus and process for production thereof |
| US7250114B2 (en) * | 2003-05-30 | 2007-07-31 | Lam Research Corporation | Methods of finishing quartz glass surfaces and components made by the methods |
| JP4606121B2 (en) * | 2004-01-29 | 2011-01-05 | 京セラ株式会社 | Corrosion-resistant film laminated corrosion-resistant member and manufacturing method thereof |
| JP2006128370A (en) * | 2004-10-28 | 2006-05-18 | Tokyo Electron Ltd | Film forming apparatus and metod, program, and recording medium |
| CN101010448B (en) * | 2005-06-23 | 2010-09-29 | 东京毅力科创株式会社 | Constitutional member for semiconductor processing apparatus and method for producing same |
| US20060292310A1 (en) * | 2005-06-27 | 2006-12-28 | Applied Materials, Inc. | Process kit design to reduce particle generation |
| US7541094B1 (en) * | 2006-03-03 | 2009-06-02 | Quantum Global Technologies, Llc | Firepolished quartz parts for use in semiconductor processing |
| US20080063798A1 (en) * | 2006-08-30 | 2008-03-13 | Kher Shreyas S | Precursors and hardware for cvd and ald |
| US8097105B2 (en) * | 2007-01-11 | 2012-01-17 | Lam Research Corporation | Extending lifetime of yttrium oxide as a plasma chamber material |
| US8206829B2 (en) * | 2008-11-10 | 2012-06-26 | Applied Materials, Inc. | Plasma resistant coatings for plasma chamber components |
| US9337002B2 (en) * | 2013-03-12 | 2016-05-10 | Lam Research Corporation | Corrosion resistant aluminum coating on plasma chamber components |
| GB2513575B (en) * | 2013-04-29 | 2017-05-31 | Keronite Int Ltd | Corrosion and erosion-resistant mixed oxide coatings for the protection of chemical and plasma process chamber components |
| US9711334B2 (en) * | 2013-07-19 | 2017-07-18 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US9583369B2 (en) * | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| US9790581B2 (en) * | 2014-06-25 | 2017-10-17 | Fm Industries, Inc. | Emissivity controlled coatings for semiconductor chamber components |
| US20160258064A1 (en) * | 2015-03-06 | 2016-09-08 | Applied Materials, Inc. | Barrier anodization methods to develop aluminum oxide layer for plasma equipment components |
| US20180016678A1 (en) * | 2016-07-15 | 2018-01-18 | Applied Materials, Inc. | Multi-layer coating with diffusion barrier layer and erosion resistant layer |
-
2019
- 2019-05-21 CN CN201980037849.7A patent/CN112236839A/en active Pending
- 2019-05-21 JP JP2020568515A patent/JP7405776B2/en active Active
- 2019-05-21 US US16/418,274 patent/US20190385825A1/en active Pending
- 2019-05-21 WO PCT/US2019/033259 patent/WO2019240915A1/en active Application Filing
- 2019-05-21 KR KR1020217001257A patent/KR20210008931A/en unknown
- 2019-06-12 TW TW108120249A patent/TWI828704B/en active
-
2023
- 2023-04-05 US US18/131,306 patent/US20230245863A1/en active Pending
- 2023-12-14 JP JP2023210900A patent/JP2024037895A/en active Pending
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