JP2022532832A - 撓んだ半導体ウェハを平坦化する真空押え付け装置 - Google Patents
撓んだ半導体ウェハを平坦化する真空押え付け装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title description 16
- 235000012431 wafers Nutrition 0.000 title 1
- 239000012530 fluid Substances 0.000 claims abstract description 16
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 230000036544 posture Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (20)
- ウェハを所望の位置及び向きに保つのに適した真空押え付け装置であり、
i.真空通流開口を有する真空チャック面を画定する真空チャックアセンブリと、
ii.前記真空チャックアセンブリに対し固定されており前記真空通流開口を介し前記真空チャック面に通ずるベンチュリ真空発生器と、
iii.前記ベンチュリ真空発生器に通ずる正圧流体ラインと、
を備える真空押え付け装置。 - 請求項1に係る真空押え付け装置であって、前記真空チャックアセンブリ及び前記ベンチュリ真空発生器が共に可動ステージ上に実装されている真空押え付け装置。
- 請求項2に係る真空押え付け装置であって、前記正圧流体ラインが可撓流体ラインである真空押え付け装置。
- 請求項3に係る真空押え付け装置であって、前記可動ステージ上に実装されている前記ベンチュリ真空発生器に前記正圧流体ラインを介し結合された、固定正圧流体源をも備える真空押え付け装置。
- 請求項1に係る真空押え付け装置であって、前記真空チャック面が前記真空チャックアセンブリに対し可回動な真空押え付け装置。
- 請求項1に係る真空押え付け装置であって、前記可動ステージがXY可動ステージである真空押え付け装置。
- 請求項1に係る真空押え付け装置であって、前記真空チャックアセンブリが、前記ベンチュリ真空発生器に対し可回動な真空チャック面画定要素を有する真空押え付け装置。
- 請求項7に係る真空押え付け装置であって、前記ベンチュリ真空発生器が、前記真空チャック面画定要素に対する可回動真空連結部を有する中央真空マニフォルド兼導路アセンブリを介し、当該真空チャック面画定要素の前記真空チャック面に結合されている真空押え付け装置。
- 請求項8に係る真空押え付け装置であって、前記ベンチュリ真空発生器が、前記中央真空マニフォルド兼導路アセンブリに備わる複数個の対応する真空入口ポートに連結された複数個の真空ポート及び複数本の真空導路を介し、前記真空チャック面画定要素の前記真空チャック面に結合されている真空押え付け装置。
- 請求項9に係る真空押え付け装置であって、前記中央真空マニフォルド兼導路アセンブリが、前記真空入口ポートに連結されたマニフォルドを備え、そのマニフォルドが、前記可回動真空連結部に結合された単一の真空出口導路部分を有する真空押え付け装置。
- 請求項2に係る真空押え付け装置であって、前記真空チャック面が前記真空チャックアセンブリに対し可回動な真空押え付け装置。
- 請求項2に係る真空押え付け装置であって、前記可動ステージがXY可動ステージである真空押え付け装置。
- 請求項2に係る真空押え付け装置であって、前記真空チャックアセンブリが、前記ベンチュリ真空発生器に対し可回動な真空チャック面画定要素を有する真空押え付け装置。
- 請求項13に係る真空押え付け装置であって、前記ベンチュリ真空発生器が、前記真空チャック面画定要素に対する可回動真空連結部を有する中央真空マニフォルド兼導路アセンブリを介し、当該真空チャック面画定要素の前記真空チャック面に結合されている真空押え付け装置。
- 請求項14に係る真空押え付け装置であって、前記ベンチュリ真空発生器が、前記中央真空マニフォルド兼導路アセンブリに備わる複数個の対応する真空入口ポートに連結された複数個の真空ポート及び複数本の真空導路を介し、前記真空チャック面画定要素の前記真空チャック面に結合されている真空押え付け装置。
- 請求項15に係る真空押え付け装置であって、前記中央真空マニフォルド兼導路アセンブリが、前記真空入口ポートに連結されたマニフォルドを備え、そのマニフォルドが、前記可回動真空連結部に結合された単一の真空出口導路部分を有する真空押え付け装置。
- 請求項1に係る真空押え付け装置であって、前記真空通流開口を介し前記真空チャック面に通ずる付加的真空連結部をも備える真空押え付け装置。
- 請求項17に係る真空押え付け装置であって、前記ベンチュリ真空発生器及び前記付加的真空連結部のうち何れかから選択的に前記真空チャックアセンブリへと真空を供給するよう動作させうる真空押え付け装置。
- 請求項2に係る真空押え付け装置であって、前記真空通流開口を介し前記真空チャック面に通ずる付加的真空発生器をも備え、その付加的真空発生器が前記可動ステージ上に実装されている真空押え付け装置。
- 請求項19に係る真空押え付け装置であって、前記ベンチュリ真空発生器及び前記付加的真空発生器のうち何れかから選択的に前記真空チャックアセンブリへと真空を供給するよう動作させうる真空押え付け装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/US2019/023918 WO2020197544A1 (en) | 2019-03-25 | 2019-03-25 | Vacuum hold-down apparatus for flattening bowed semiconductor wafers |
Publications (2)
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JP2022532832A true JP2022532832A (ja) | 2022-07-20 |
JP7461370B2 JP7461370B2 (ja) | 2024-04-03 |
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US (1) | US11430687B2 (ja) |
JP (1) | JP7461370B2 (ja) |
KR (1) | KR102666266B1 (ja) |
CN (1) | CN113519047A (ja) |
SG (1) | SG11202109859QA (ja) |
TW (1) | TWI812841B (ja) |
WO (1) | WO2020197544A1 (ja) |
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US11333616B2 (en) | 2020-07-30 | 2022-05-17 | Kla Corporation | Adaptive focusing system for a scanning metrology tool |
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JPS62216229A (ja) * | 1986-03-17 | 1987-09-22 | Nec Corp | スピンチヤツク |
JPH0837227A (ja) * | 1994-07-25 | 1996-02-06 | Hitachi Ltd | ウエハチャックおよびそれを用いた露光装置 |
JPH08503680A (ja) * | 1992-07-15 | 1996-04-23 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | 物品取扱いシステム |
JPH08108329A (ja) * | 1994-10-05 | 1996-04-30 | Disco Abrasive Syst Ltd | 負圧生成手段 |
JPH09251948A (ja) * | 1996-03-18 | 1997-09-22 | Fujitsu Ltd | 平坦性矯正装置および平坦性矯正方法 |
JPH10175136A (ja) * | 1996-12-13 | 1998-06-30 | New Sutorongu Hanbai Kk | 真空チャック |
JP2000308934A (ja) * | 1999-04-27 | 2000-11-07 | New Sutorongu Hanbai Kk | 真空チャック |
JP2005059173A (ja) * | 2003-08-18 | 2005-03-10 | Yoshioka Seiko:Kk | 吸着装置及びチャックテーブル |
JP2009262251A (ja) * | 2008-04-23 | 2009-11-12 | Disco Abrasive Syst Ltd | 切削装置 |
JP2010103426A (ja) * | 2008-10-27 | 2010-05-06 | Lintec Corp | 板状部材の支持装置および支持方法 |
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WO2017154173A1 (ja) * | 2016-03-10 | 2017-09-14 | 三菱電機株式会社 | 基板吸着ステージ、基板処理装置、基板処理方法 |
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KR20100045607A (ko) | 2008-10-24 | 2010-05-04 | 세크론 주식회사 | 비상 진공 발생 장치 |
US9401299B2 (en) | 2010-09-24 | 2016-07-26 | Rudolph Technologies, Inc. | Support for semiconductor substrate |
KR20140042337A (ko) | 2012-09-28 | 2014-04-07 | 한미반도체 주식회사 | 흡착 테이블 장치 |
US20140184003A1 (en) * | 2012-12-31 | 2014-07-03 | Cascade Microtech, Inc. | Systems and methods for rotational alignment of a device under test |
JP2015109416A (ja) | 2013-10-21 | 2015-06-11 | 東芝機械株式会社 | チャック装置 |
-
2019
- 2019-03-25 US US16/340,634 patent/US11430687B2/en active Active
- 2019-03-25 SG SG11202109859Q patent/SG11202109859QA/en unknown
- 2019-03-25 KR KR1020217034588A patent/KR102666266B1/ko active IP Right Grant
- 2019-03-25 WO PCT/US2019/023918 patent/WO2020197544A1/en active Application Filing
- 2019-03-25 JP JP2021557584A patent/JP7461370B2/ja active Active
- 2019-03-25 CN CN201980093474.6A patent/CN113519047A/zh active Pending
-
2020
- 2020-02-07 TW TW109103816A patent/TWI812841B/zh active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62216229A (ja) * | 1986-03-17 | 1987-09-22 | Nec Corp | スピンチヤツク |
JPH08503680A (ja) * | 1992-07-15 | 1996-04-23 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | 物品取扱いシステム |
JPH0837227A (ja) * | 1994-07-25 | 1996-02-06 | Hitachi Ltd | ウエハチャックおよびそれを用いた露光装置 |
JPH08108329A (ja) * | 1994-10-05 | 1996-04-30 | Disco Abrasive Syst Ltd | 負圧生成手段 |
JPH09251948A (ja) * | 1996-03-18 | 1997-09-22 | Fujitsu Ltd | 平坦性矯正装置および平坦性矯正方法 |
JPH10175136A (ja) * | 1996-12-13 | 1998-06-30 | New Sutorongu Hanbai Kk | 真空チャック |
JP2000308934A (ja) * | 1999-04-27 | 2000-11-07 | New Sutorongu Hanbai Kk | 真空チャック |
JP2005059173A (ja) * | 2003-08-18 | 2005-03-10 | Yoshioka Seiko:Kk | 吸着装置及びチャックテーブル |
JP2009262251A (ja) * | 2008-04-23 | 2009-11-12 | Disco Abrasive Syst Ltd | 切削装置 |
JP2010103426A (ja) * | 2008-10-27 | 2010-05-06 | Lintec Corp | 板状部材の支持装置および支持方法 |
JP2015233078A (ja) * | 2014-06-10 | 2015-12-24 | 株式会社ディスコ | チャックテーブル |
WO2017154173A1 (ja) * | 2016-03-10 | 2017-09-14 | 三菱電機株式会社 | 基板吸着ステージ、基板処理装置、基板処理方法 |
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Publication number | Publication date |
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US11430687B2 (en) | 2022-08-30 |
CN113519047A (zh) | 2021-10-19 |
KR102666266B1 (ko) | 2024-05-14 |
SG11202109859QA (en) | 2021-10-28 |
TWI812841B (zh) | 2023-08-21 |
WO2020197544A1 (en) | 2020-10-01 |
JP7461370B2 (ja) | 2024-04-03 |
US20210217645A1 (en) | 2021-07-15 |
TW202105557A (zh) | 2021-02-01 |
KR20210134061A (ko) | 2021-11-08 |
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