CN113519047A - 用于平整化弯曲半导体晶片的真空压紧设备 - Google Patents

用于平整化弯曲半导体晶片的真空压紧设备 Download PDF

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CN113519047A
CN113519047A CN201980093474.6A CN201980093474A CN113519047A CN 113519047 A CN113519047 A CN 113519047A CN 201980093474 A CN201980093474 A CN 201980093474A CN 113519047 A CN113519047 A CN 113519047A
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compaction apparatus
venturi
chuck surface
generator
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A·希尔德斯海姆
O·安格尔
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KLA Corp
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Abstract

本发明公开一种适用于将晶片保持在所要位置及定向中的真空压紧设备，所述设备包含：真空卡盘组合件，其界定具有真空连通孔隙的真空卡盘表面；文氏管(venturi)真空产生器，其相对于所述真空卡盘组合件固定且经由所述真空连通孔隙与所述真空卡盘表面连通；及正压流体管线，其与所述文氏管真空产生器连通。

Description

用于平整化弯曲半导体晶片的真空压紧设备
技术领域
本发明大体上涉及真空压紧设备及真空卡盘，且更特定来说，涉及用于在半导体产业中使用的真空压紧设备。
背景技术
已知在半导体产业中使用的各种类型的真空卡盘。
发明内容
本发明试图提供尤其适合在半导体产业中使用但不限于在所述产业中使用的经改进真空压紧设备。
因此，根据本发明的优选实施例，提供一种适用于将晶片保持在所要位置及定向中的真空压紧设备，所述设备包含：真空卡盘组合件，其界定具有真空连通孔隙的真空卡盘表面；文氏管(venturi)真空产生器，其相对于所述真空卡盘组合件固定且经由所述真空连通孔隙与所述真空卡盘表面连通；及正压流体管线，其与所述文氏管真空产生器连通。
根据本发明的优选实施例，所述真空卡盘组合件及所述文氏管真空产生器两者经安装在可移动载物台上。
根据本发明的优选实施例，所述正压流体管线为柔性流体管线。
根据本发明的优选实施例，所述真空压紧设备还包含经由所述正压流体管线耦合到安装在所述可移动载物台上的所述文氏管真空产生器的固定正压流体源。
优选地，所述真空卡盘表面可相对于所述真空卡盘组合件旋转。
根据本发明的优选实施例，所述可移动载物台为X-Y可移动载物台。
优选地，所述真空卡盘组合件包含可相对于所述文氏管真空产生器旋转的真空卡盘表面界定元件。另外，所述文氏管真空产生器经由具有到所述真空卡盘表面界定元件的可旋转真空连接的中心真空歧管及导管组合件耦合到所述真空卡盘表面界定元件的所述真空卡盘表面。
根据本发明的优选实施例，所述文氏管真空产生器经由多个真空端口及多个真空导管耦合到所述真空卡盘表面界定元件的所述真空卡盘表面，所述多个真空导管连接到所述中心真空歧管及导管组合件的多个对应真空输入端口。另外，所述中心真空歧管及导管组合件包含连接到所述真空输入端口的歧管且包含耦合到所述可旋转真空连接的单一真空输出导管部分。
根据优选实施例，所述装置还包含经由所述真空连通孔隙与所述真空卡盘表面连通的额外真空连接。
根据优选实施例，所述真空压紧设备可操作以将真空从所述文氏管真空产生器或从所述额外真空连接选择性地供应到所述真空卡盘组合件。
附图说明
从结合附图进行的以下详细描述将更完全理解并了解本发明，其中：
图1A、1B及1C为从各个视角获取的简化立体图解，其展示根据本发明的优选实施例建构且可操作的半导体晶片处理机器的部分；
图2A、2B及2C为形成图1A到1C的半导体晶片处理机器的部分的可移动载物台组合件的简化立体图解且展示到形成其部分的文氏管子组合件的柔性正流体压力连接；
图3A、3B及3C为简化相应立体组装、立体部分分解及横截面视图图解，其展示图2A到2C的文氏管子组合件与耦合到图2A到2C的可移动载物台组合件的真空压紧表面中的孔隙的中心真空歧管及导管组合件之间的真空连接；
图4A及4B为图3A到3C的中心真空歧管及导管组合件的相应分解视图及横截面图解；
图5A、5B及5C为在三个不同典型可操作定向中的图3A到4B的可移动载物台组合件的简化俯视图图解；及
图6为图1A到5C的半导体晶片处理机器的额外实施例的简化示意性图解。
具体实施方式
现参考图1A、1B及1C，其为从各个视角获取的简化立体图解，其展示根据本发明的优选实施例建构且可操作的半导体晶片处理机器的部分，且参考图2A、2B及2C，其为形成图1A到1C的半导体晶片处理机器的部分的可移动载物台组合件的简化立体图解，且展示到形成其部分的文氏管子组合件的柔性正流体压力连接。
如图1A到2C中所见，看见适用于将半导体晶片保持在所要位置及定向中，从而形成半导体晶片处理机器100(例如商业上可购自美国加利福尼亚州米尔皮塔斯市(Milpitas)的科磊半导体设备技术公司(KLA-Tencor Corporation)的ArcherTM600)的部分的真空压紧设备。如尤其在图1A到1C中所见，正压源(例如设置在制造设施中且耦合到空气压缩机的正压出口)经由一或多个正压导管102耦合到尤其包含可人工操作压力切断开关的正压控制器104。额外一或多个柔性正压导管106提供从压力控制器104到可移动载物台组合件110的正压供应。
可移动载物台组合件110可为经布置用于旋转真空卡盘组合件120的可选择X及Y方向移位的任何适合可移动载物台组合件110。真空卡盘组合件120可操作用于具有在真空卡盘表面134的中心处的真空连通孔隙132的真空卡盘表面界定元件130的可选择旋转定位。
如图3A到3C中所见，本发明的实施例的特定特征为文氏管真空产生器150相对于真空卡盘组合件120固定以用于将真空提供到真空卡盘表面界定元件130。文氏管真空产生器150经由柔性正压导管106接收正压流体流(通常在8巴的压力下的空气流)。文氏管产生器150优选为商业上可购自日本长野(Nagano)冈谷(Okaya)的日本匹士克公司(NihonPisco Co.,Ltd.)的VRL100-100202且包含至少一个正压输入连接器端口152及至少一个真空端口154。
文氏管真空产生器150优选经由多个真空端口154及多个真空导管156与真空卡盘表面界定元件130连通，所述多个真空导管156连接到具有在真空连通孔隙132处到真空卡盘表面界定元件130的可旋转真空连接162的中心真空歧管及导管组合件160的多个对应真空输入端口158。
应了解，由于文氏管真空产生器150紧邻真空卡盘表面134，故真空导管156的范围缩短，且由此最小化真空损失。
现另外参考图4A及4B，中心真空歧管及导管组合件160还优选包含连接到真空输入端口158的歧管164且包含耦合到可旋转真空连接162的单一真空输出导管部分166。
现另外参考图5A到5C，看见真空卡盘表面界定元件130可具有在X-Y平面中的各种位置及相对于真空卡盘组合件120的各种旋转定向。
如图6中所见，在本发明的额外实施例中，真空卡盘组合件120连接到文氏管真空产生器150及额外真空源180两者。文氏管真空产生器150耦合到正压源182(例如设置在制造设施中的正压出口)。额外真空源180为除文氏管真空产生器150之外的真空源，例如设置在制造设施中的真空出口。
将真空选择性地提供到真空卡盘表面界定元件130。最初通过文氏管真空产生器150将真空提供到真空卡盘表面界定元件130，且当真空传感器186提供在真空卡盘表面界定元件130处已建立足够真空的指示时，额外真空源180将真空提供到真空卡盘表面界定元件130且关闭文氏管真空产生器150。
应了解，在图6中展示的额外实施例中，中心真空歧管及导管组合件160包含额外真空输入端口158以容纳在额外真空源180与真空连通孔隙132之间连通的额外柔性真空连接器。类似地，在图6中展示的额外实施例中，半导体晶片处理机器100包含对于额外真空源180的完全起作用所必需的多个额外配件及管道。
所属领域的技术人员将了解，本发明不限于上文已特定展示且描述的内容。实情是，本发明包含上文描述的各种特征的组合及子组合以及不在现有技术中的本发明的修改及变动。

Claims (20)

1.一种适用于将晶片保持在所要位置及定向中的真空压紧设备，所述设备包括：
i.真空卡盘组合件，其界定具有真空连通孔隙的真空卡盘表面；
ii.文氏管真空产生器，其相对于所述真空卡盘组合件固定且经由所述真空连通孔隙与所述真空卡盘表面连通；及
iii.正压流体管线，其与所述文氏管真空产生器连通。
2.根据权利要求1所述的真空压紧设备，且其中所述真空卡盘组合件及所述文氏管真空产生器两者经安装在可移动载物台上。
3.根据权利要求2所述的真空压紧设备，且其中所述正压流体管线为柔性流体管线。
4.根据权利要求3所述的真空压紧设备，且其还包括经由所述正压流体管线耦合到安装在所述可移动载物台上的所述文氏管真空产生器的固定正压流体源。
5.根据权利要求1所述的真空压紧设备，且其中所述真空卡盘表面可相对于所述真空卡盘组合件旋转。
6.根据权利要求1所述的真空压紧设备，且其中所述可移动载物台为X-Y可移动载物台。
7.根据权利要求1所述的真空压紧设备，且其中所述真空卡盘组合件包含可相对于所述文氏管真空产生器旋转的真空卡盘表面界定元件。
8.根据权利要求7所述的真空压紧设备，且其中所述文氏管真空产生器经由具有到所述真空卡盘表面界定元件的可旋转真空连接的中心真空歧管及导管组合件耦合到所述真空卡盘表面界定元件的所述真空卡盘表面。
9.根据权利要求8所述的真空压紧设备，且其中所述文氏管真空产生器经由多个真空端口及多个真空导管耦合到所述真空卡盘表面界定元件的所述真空卡盘表面，所述多个真空导管连接到所述中心真空歧管及导管组合件的多个对应真空输入端口。
10.根据权利要求9所述的真空压紧设备，且其中所述中心真空歧管及导管组合件包括连接到所述真空输入端口的歧管且包含耦合到所述可旋转真空连接的单一真空输出导管部分。
11.根据权利要求2所述的真空压紧设备，且其中所述真空卡盘表面可相对于所述真空卡盘组合件旋转。
12.根据权利要求2所述的真空压紧设备，且其中所述可移动载物台为X-Y可移动载物台。
13.根据权利要求2所述的真空压紧设备，且其中所述真空卡盘组合件包含可相对于所述文氏管真空产生器旋转的真空卡盘表面界定元件。
14.根据权利要求13所述的真空压紧设备，且其中所述文氏管真空产生器经由具有到所述真空卡盘表面界定元件的可旋转真空连接的中心真空歧管及导管组合件耦合到所述真空卡盘表面界定元件的所述真空卡盘表面。
15.根据权利要求14所述的真空压紧设备，且其中所述文氏管真空产生器经由多个真空端口及多个真空导管耦合到所述真空卡盘表面界定元件的所述真空卡盘表面，所述多个真空导管连接到所述中心真空歧管及导管组合件的多个对应真空输入端口。
16.根据权利要求15所述的真空压紧设备，且其中所述中心真空歧管及导管组合件包括连接到所述真空输入端口的歧管且包含耦合到所述可旋转真空连接的单一真空输出导管部分。
17.根据权利要求1所述的真空压紧设备，且其还包括经由所述真空连通孔隙与所述真空卡盘表面连通的额外真空连接。
18.根据权利要求17所述的真空压紧设备，且其中所述真空压紧设备可操作以将真空从所述文氏管真空产生器或从所述额外真空连接选择性地供应到所述真空卡盘组合件。
19.根据权利要求2所述的真空压紧设备，且其还包括经由所述真空连通孔隙与所述真空卡盘表面连通的额外真空产生器，且其中所述额外真空产生器经安装在所述可移动载物台上。
20.根据权利要求19所述的真空压紧设备，且其中所述真空压紧设备可操作以将真空从所述文氏管真空产生器或从所述额外真空产生器选择性地供应到所述真空卡盘组合件。
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