JP2022524453A - 新規な3d nandメモリデバイスおよびそれを形成する方法 - Google Patents
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Abstract
Description
10a 上面
12 NMOSトランジスタ
14 PMOSトランジスタ
16 ボンディングVIA
18 第2の基板
18a 上面
18b 下面
20 上ソース線
22 第3のVIA
24 M1配線
26 第2のVIA
28 アレイ共通ソース(ACS)構造
28’ 上部分
28” 下部分
30 nウェル領域
32 第1のVIA
34 下ソース線
36 pウェル領域
38 チャネル構造
40 ダミーチャネル構造
42 ワード線
44 絶縁層
46 誘電体層
48 下チャネルコンタクト
50 スペーサ層
70 CMOS基板
70a 上面
72 NMOSトランジスタ
74 PMOSトランジスタ
76 ボンディングVIA
78 nウェル領域
80 セルアレイ基板
80a 上面
82 ACS構造
84 チャネル領域
86 M1配線
88 M1 VIA
90 M2 VIA
92 ソース線
94 pウェル領域
100 3D-NANDメモリデバイス
200 3D-NANDメモリデバイス
Claims (20)
- メモリセルを形成するための第1の側および前記第1の側と反対である第2の側を有する第1の基板と、
前記第1の基板の前記第1の側に形成され、少なくともトランジスタのソース端子に電気的に結合されるドープ領域と、
前記第1の基板の前記第2の側にわたって形成され、第1のVIAであって、前記第1の基板の前記第2の側から前記ドープ領域に延びる第1のVIAを通じて前記ドープ領域に結合される第1の接続構造と、
を備える、半導体デバイス。 - 前記ドープ領域の上方に形成され、前記ドープ領域に結合される共通ソース構造と、
第2のVIAを通じて前記共通ソース構造に結合される、前記共通ソース構造の上方に形成されるビット線と、
第3のVIAを通じて前記ビット線に結合される、前記ビット線の上方に配設される第2の接続構造とを更に備え、前記第1の接続構造および前記第2の接続構造が互いに結合される、
請求項1に記載の半導体デバイス。 - 第2の基板の第1の側に形成されるトランジスタと、
前記トランジスタの上方に形成され、前記トランジスタに結合されるボンディングVIAとを更に備え、
前記第1の基板の前記第1の側および前記第2の基板の前記第1の側が、前記トランジスタが前記ボンディングVIAを通じて前記第2の接続構造に結合されるように互いに向き合って位置合わせされる、
請求項2に記載の半導体デバイス。 - 前記第2の接続構造と前記ボンディングVIAとの間に配置される第4のVIAを更に備える、
請求項3に記載の半導体デバイス。 - 前記第1のVIAが前記ドープ領域を通って延び、前記共通ソース構造と接触している、請求項2に記載の半導体デバイス。
- 前記第1のVIAを前記第1の基板から絶縁する、前記第1のVIAと前記第1の基板との間に設けられるスペーサ層を更に備える、
請求項1に記載の半導体デバイス。 - 前記第1のVIAと前記ドープ領域との間に配置されるn+領域であって、前記ドープ領域がn型である、n+領域を更に備える、
請求項1に記載の半導体デバイス。 - 前記第1のVIAが、テーパー横断面を有する延長壁形状または截頭円錐形状の少なくとも1つを有する、請求項1に記載の半導体デバイス。
- 前記第1の基板の前記第1の側から延びる複数のチャネル構造と、
階段構成で前記第1の基板の前記第1の側の上方に配設される複数のワード線とを更に備え、
前記複数のワード線が複数の絶縁層によって互いから離間され、
前記複数のチャネル構造が前記複数のワード線および前記複数の絶縁層を通って延び、
前記複数のチャネル構造が前記ビット線より下に設けられ、
前記共通ソース構造が前記複数のワード線および前記複数の絶縁層を通って延び、前記複数のチャネル構造を分離する、
請求項2に記載の半導体デバイス。 - 第1の基板の第2の側から延びる第1のVIAを形成するステップであって、前記第1の基板が、メモリスタックが形成される反対の第1の側を有し、前記メモリスタックが、前記第1の基板の前記第1の側に配設され、少なくともトランジスタのソース端子に電気的に結合されるドープ領域を含み、前記第1のVIAが前記ドープ領域と電気的に接続される、ステップと、
第1の接続構造を、前記第1の接続構造が前記第1のVIAを通じて前記ドープ領域に結合されるように前記第1のVIAの上方に形成するステップとを含む、
半導体デバイスを製造するための方法。 - 前記第1のVIAの上方に前記第1の接続構造を形成するステップが、
前記第1の基板の前記第2の側から第1の基板の一部分を除去することと、
前記第1の基板の前記第2の側から前記ドープ領域に延びる前記第1のVIAを形成することと、
前記第1のVIAの上方に前記第1の接続構造を形成することとを更に含む、請求項10に記載の方法。 - 前記第1のVIAが、テーパー横断面を有する延長壁形状または截頭円錐形状の少なくとも1つを有する、請求項10に記載の方法。
- 前記メモリスタックを形成するステップが、
前記ドープ領域の上方に、前記ドープ領域と結合される共通ソース構造を形成することと、
前記共通ソース構造の上方にビット線を形成することであって、前記ビット線が第2のVIAを通じて前記共通ソース構造に結合される、形成することと、
前記ビット線の上方に第2の接続構造を形成することであって、前記第2の接続構造が第3のVIAを通じて前記ビット線に結合される、形成することとを更に含み、前記第1の接続構造および前記第2の接続構造が互いに結合される、請求項10に記載の方法。 - 第2の基板の第1の側にわたってトランジスタを形成するステップと、
前記トランジスタの上方にボンディングVIAを形成するステップであって、前記ボンディングVIAが前記トランジスタに電気的に結合される、ステップと、
前記ボンディングVIAを通じて前記第1の基板および前記第2の基板を接合するステップとを更に含み、前記第2の接続構造が前記トランジスタと位置合わせされ、前記ボンディングVIAを通じて前記トランジスタに結合される、請求項13に記載の方法。 - 前記第1の基板の前記第2の側から前記第1の基板の前記第1の側に延びるシリコン貫通VIA(TSV)を形成するステップを更に含み、前記第1の接続構造および前記第2の接続構造が前記TSVを通じて電気的に接続される、
請求項13に記載の方法。 - 前記第1のVIAと前記ドープ領域との間にn+領域を形成するステップであって、前記ドープ領域がn型である、ステップを更に含む、
請求項10に記載の方法。 - 周辺回路基板の第1の側に形成されるトランジスタと、
セルアレイ基板の第1の側の上方に形成されるメモリセルスタックと、
前記セルアレイ基板の反対の第2の側にわたって形成される第1の接続構造とを備え、
前記メモリセルスタックが、
前記セルアレイ基板の前記第1の側に形成され、少なくともメモリセルのソース端子に電気的に結合されるドープ領域であって、前記セルアレイ基板の前記第2の側から前記ドープ領域に延びる第1のVIAを通じて前記第1の接続構造に結合される、ドープ領域と、
前記ドープ領域から前記周辺回路基板の前記第1の側に向けて延び、前記ドープ領域に結合される共通ソース構造と、
前記共通ソース構造と第2の接続構造との間に配設されるビット線とを含み、
前記ビット線が第2のVIAを通じて前記共通ソース構造に結合され、前記第2の接続構造が第3のVIAを通じて前記ビット線に結合され、前記セルアレイ基板の前記第1の側および前記周辺回路基板の前記第1の側が、前記トランジスタが前記第2の接続構造に結合されるように互いに向き合って位置合わせされる、
3D-NANDメモリ。 - 前記第2の接続構造がボンディングVIAを通じて前記トランジスタに結合される、請求項17に記載の3D-NANDメモリ。
- 前記第1のVIAと前記ドープ領域との間に形成されるn+領域であって、前記ドープ領域がn型である、n+領域を更に備える、
請求項17に記載の3D-NANDメモリ。 - 前記第1のVIAが、テーパー横断面を有する延長壁形状または截頭円錐形状の少なくとも1つを有する、請求項17に記載の3D-NANDメモリ。
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