JP2022517694A - 熱伝導性注封組成物 - Google Patents

熱伝導性注封組成物 Download PDF

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Publication number
JP2022517694A
JP2022517694A JP2021547612A JP2021547612A JP2022517694A JP 2022517694 A JP2022517694 A JP 2022517694A JP 2021547612 A JP2021547612 A JP 2021547612A JP 2021547612 A JP2021547612 A JP 2021547612A JP 2022517694 A JP2022517694 A JP 2022517694A
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JP
Japan
Prior art keywords
thermally conductive
composition
encapsulation composition
particle size
component
Prior art date
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Pending
Application number
JP2021547612A
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English (en)
Japanese (ja)
Inventor
レイ・ホアン
ウー・ハオ
チウ・シュエユー
シエ・シュエ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of JP2022517694A publication Critical patent/JP2022517694A/ja
Priority to JP2023136348A priority Critical patent/JP2023159356A/ja
Priority to JP2025081179A priority patent/JP2025122035A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
JP2021547612A 2018-10-29 2018-10-29 熱伝導性注封組成物 Pending JP2022517694A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023136348A JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物
JP2025081179A JP2025122035A (ja) 2018-10-29 2025-05-14 熱伝導性注封組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/112319 WO2020087196A1 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023136348A Division JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物

Publications (1)

Publication Number Publication Date
JP2022517694A true JP2022517694A (ja) 2022-03-09

Family

ID=70464384

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021547612A Pending JP2022517694A (ja) 2018-10-29 2018-10-29 熱伝導性注封組成物
JP2023136348A Pending JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物
JP2025081179A Pending JP2025122035A (ja) 2018-10-29 2025-05-14 熱伝導性注封組成物

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023136348A Pending JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物
JP2025081179A Pending JP2025122035A (ja) 2018-10-29 2025-05-14 熱伝導性注封組成物

Country Status (8)

Country Link
US (1) US12503586B2 (https=)
EP (1) EP3873986B1 (https=)
JP (3) JP2022517694A (https=)
KR (1) KR102644123B1 (https=)
CN (1) CN113242884B (https=)
CA (1) CA3117241A1 (https=)
ES (1) ES3062588T3 (https=)
WO (1) WO2020087196A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023146870A (ja) * 2022-03-29 2023-10-12 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体
JP7853135B2 (ja) 2022-03-29 2026-04-28 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物
EP4631988A1 (en) 2024-04-11 2025-10-15 Henkel AG & Co. KGaA Thermally conductive potting composition

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JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
JP2010044998A (ja) * 2008-08-18 2010-02-25 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2010132838A (ja) * 2008-12-08 2010-06-17 Mitsubishi Electric Corp 高熱伝導性熱硬化性樹脂組成物
JP2018069708A (ja) * 2016-11-04 2018-05-10 Dic株式会社 積層体、電子部材及び熱伝導性部材
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023146870A (ja) * 2022-03-29 2023-10-12 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体
JP7853135B2 (ja) 2022-03-29 2026-04-28 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体

Also Published As

Publication number Publication date
EP3873986A4 (en) 2022-06-22
JP2025122035A (ja) 2025-08-20
US20210238408A1 (en) 2021-08-05
JP2023159356A (ja) 2023-10-31
KR20210084466A (ko) 2021-07-07
CA3117241A1 (en) 2020-05-07
WO2020087196A1 (en) 2020-05-07
KR102644123B1 (ko) 2024-03-07
CN113242884A (zh) 2021-08-10
EP3873986A1 (en) 2021-09-08
EP3873986B1 (en) 2025-12-03
CN113242884B (zh) 2023-12-08
ES3062588T3 (en) 2026-04-13
US12503586B2 (en) 2025-12-23

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