CN113242884B - 导热封装组合物 - Google Patents

导热封装组合物 Download PDF

Info

Publication number
CN113242884B
CN113242884B CN201880099023.9A CN201880099023A CN113242884B CN 113242884 B CN113242884 B CN 113242884B CN 201880099023 A CN201880099023 A CN 201880099023A CN 113242884 B CN113242884 B CN 113242884B
Authority
CN
China
Prior art keywords
thermally conductive
composition
epoxy resin
composition according
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880099023.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN113242884A (zh
Inventor
黄磊
武豪
邱雪宇
谢玄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of CN113242884A publication Critical patent/CN113242884A/zh
Application granted granted Critical
Publication of CN113242884B publication Critical patent/CN113242884B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
CN201880099023.9A 2018-10-29 2018-10-29 导热封装组合物 Active CN113242884B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/112319 WO2020087196A1 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Publications (2)

Publication Number Publication Date
CN113242884A CN113242884A (zh) 2021-08-10
CN113242884B true CN113242884B (zh) 2023-12-08

Family

ID=70464384

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880099023.9A Active CN113242884B (zh) 2018-10-29 2018-10-29 导热封装组合物

Country Status (8)

Country Link
US (1) US12503586B2 (https=)
EP (1) EP3873986B1 (https=)
JP (3) JP2022517694A (https=)
KR (1) KR102644123B1 (https=)
CN (1) CN113242884B (https=)
CA (1) CA3117241A1 (https=)
ES (1) ES3062588T3 (https=)
WO (1) WO2020087196A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物
EP4631988A1 (en) 2024-04-11 2025-10-15 Henkel AG & Co. KGaA Thermally conductive potting composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1887033A1 (en) * 2006-08-10 2008-02-13 National Starch and Chemical Investment Holding Corporation Thermally conductive material
WO2016130455A1 (en) * 2015-02-11 2016-08-18 Dow Global Technologies Llc Low temperature curable adhesives and use thereof
CN106753205A (zh) * 2017-01-11 2017-05-31 湖南博翔新材料有限公司 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用
CN106753143A (zh) * 2016-12-21 2017-05-31 南京诺邦新材料有限公司 一种具有导热功能的低温固化底部填充胶及其制备方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419496A (en) * 1982-02-22 1983-12-06 The Dow Chemical Company Particle agglomeration in rubber latices
US4871806A (en) * 1987-11-16 1989-10-03 The Sherwin-Williams Company Reactive coatings comprising an acid-functional compound, an anhydride-functional compound, an epoxy-functional compound and a hydroxy-functional compound
JP3454437B2 (ja) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JP2000239489A (ja) 1999-02-22 2000-09-05 Nippon Kayaku Co Ltd 封止材用液状エポキシ樹脂組成物及びその硬化物
JP4719976B2 (ja) * 1999-03-11 2011-07-06 東レ株式会社 エポキシ樹脂組成物及び繊維強化複合材料用エポキシ樹脂組成物並びにそれを有してなる繊維強化複合材料
DE50014006D1 (de) * 1999-03-16 2007-03-15 Huntsman Adv Mat Switzerland Härtbare zusammensetzung mit besonderer eigenschaftskombination
DE19912251A1 (de) * 1999-03-18 2000-09-21 Espe Dental Ag Zweikomponentige Zubereitungen zur Herstellung von zahntechnischen Modellen
JP2002158450A (ja) * 2000-09-06 2002-05-31 Ngk Spark Plug Co Ltd 配線基板
US7192997B2 (en) * 2001-02-07 2007-03-20 International Business Machines Corporation Encapsulant composition and electronic package utilizing same
US6512182B2 (en) 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
DE10138127A1 (de) 2001-08-03 2003-02-27 Henkel Kgaa Bindemittelkomponente für Oberflächenbeschichtungsmittel mit verbesserten Hafteigenschaften
JP2006045343A (ja) 2004-08-04 2006-02-16 Yaskawa Electric Corp 注形用エポキシ樹脂組成物およびそれを用いた電動機用モールドコイル
US20090023056A1 (en) * 2007-07-18 2009-01-22 Tesla Motors, Inc. Battery pack thermal management system
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
JP4614107B2 (ja) * 2008-06-20 2011-01-19 住友電気工業株式会社 半導体装置
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
JP2010132838A (ja) * 2008-12-08 2010-06-17 Mitsubishi Electric Corp 高熱伝導性熱硬化性樹脂組成物
WO2010103852A1 (ja) * 2009-03-12 2010-09-16 国立大学法人信州大学 熱伝導性材料及びその製造方法並びに大電流用インダクタ
DE102010022523B4 (de) * 2010-06-02 2017-09-14 Siemens Healthcare Gmbh Gradientenspule mit in einer Vergussmasse vergossenen Spulenwicklungen
US9196412B2 (en) * 2011-05-13 2015-11-24 Dow Global Technologies Llc Insulation formulations
AU2012275565B2 (en) 2011-06-26 2017-05-25 Inductotherm Corp. Molten metal holding and pouring box with dual pouring nozzles
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
JPWO2013100174A1 (ja) * 2011-12-27 2015-05-11 パナソニックＩｐマネジメント株式会社 熱伝導性樹脂組成物
JP2013144763A (ja) * 2012-01-16 2013-07-25 Shin-Etsu Chemical Co Ltd 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置
WO2014092196A1 (ja) * 2012-12-11 2014-06-19 東レ・ダウコーニング株式会社 透明性に優れた高屈折率熱伝導性組成物、それからなる熱伝導性グリース、熱伝導性硬化物、熱軟化性熱伝導性組成物およびその用途
JP5708666B2 (ja) 2013-01-08 2015-04-30 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
EP3243855A1 (en) * 2013-03-06 2017-11-15 DIC Corporation Epoxy resin composition, cured product, heat dissipation material, and electronic material
JP2015021118A (ja) * 2013-07-23 2015-02-02 スリーエム イノベイティブ プロパティズ カンパニー ２液型ポッティング組成物
JP6160775B2 (ja) * 2014-07-02 2017-07-12 Dic株式会社 電子材料用エポキシ樹脂組成物、その硬化物および電子部材
JP6655359B2 (ja) * 2015-11-09 2020-02-26 京セラ株式会社 電子・電気部品の製造方法及びエポキシ樹脂組成物
KR102716321B1 (ko) 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
US10707143B2 (en) * 2016-05-30 2020-07-07 Industrial Technology Research Institute Plug-in type power module and subsystem thereof
CN109219629B (zh) * 2016-06-20 2021-08-27 Sika技术股份公司 可用作结构加固件或结构泡沫的热固性环氧树脂组合物
GB201613414D0 (en) * 2016-08-03 2016-09-14 Dow Corning Elastomeric compositions and their applications
JP2018069708A (ja) * 2016-11-04 2018-05-10 Dic株式会社 積層体、電子部材及び熱伝導性部材
CN106519581B (zh) 2016-11-29 2018-11-02 华中科技大学 一种高导热低粘度环氧树脂复合材料及其制备方法和应用
CN111315819A (zh) * 2017-10-06 2020-06-19 3M创新有限公司 可固化组合物、由其制得的制品，及其制造和使用方法
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1887033A1 (en) * 2006-08-10 2008-02-13 National Starch and Chemical Investment Holding Corporation Thermally conductive material
CN101121878A (zh) * 2006-08-10 2008-02-13 国家淀粉及化学投资控股公司 导热材料
WO2016130455A1 (en) * 2015-02-11 2016-08-18 Dow Global Technologies Llc Low temperature curable adhesives and use thereof
CN106753143A (zh) * 2016-12-21 2017-05-31 南京诺邦新材料有限公司 一种具有导热功能的低温固化底部填充胶及其制备方法
CN106753205A (zh) * 2017-01-11 2017-05-31 湖南博翔新材料有限公司 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
高性能环氧树脂胶黏剂研究概况;陈卫东;张鹏云;陈艳丽;顾莉;;化工科技(第03期);全文 *

Also Published As

Publication number Publication date
EP3873986A4 (en) 2022-06-22
JP2025122035A (ja) 2025-08-20
US20210238408A1 (en) 2021-08-05
JP2023159356A (ja) 2023-10-31
KR20210084466A (ko) 2021-07-07
CA3117241A1 (en) 2020-05-07
WO2020087196A1 (en) 2020-05-07
KR102644123B1 (ko) 2024-03-07
JP2022517694A (ja) 2022-03-09
CN113242884A (zh) 2021-08-10
EP3873986A1 (en) 2021-09-08
EP3873986B1 (en) 2025-12-03
ES3062588T3 (en) 2026-04-13
US12503586B2 (en) 2025-12-23

Similar Documents

Publication Publication Date Title
CN107251665B (zh) 密封用树脂组合物、车载用电子控制单元的制造方法和车载用电子控制单元
JP2025122035A (ja) 熱伝導性注封組成物
JP6794626B2 (ja) 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
JP5736122B2 (ja) 構造用接着剤
JP2009013213A (ja) モーター封止用エポキシ樹脂成形材料及び成形品
JP2022003130A (ja) 封止用樹脂組成物、半導体装置、及び半導体装置の製造方法
US20010014399A1 (en) Conductive uv-curable epoxy formulations
JP2009155370A (ja) モーター封止用エポキシ樹脂成形材料及び成形品
JP6183685B2 (ja) 熱伝導性耐熱絶縁材充填コイル、その製造方法、モータ、及びトランス
JP4883842B2 (ja) エポキシ樹脂組成物用添加剤およびそのエポキシ樹脂組成物
JP2008266512A (ja) 半導体封止用難燃性液状エポキシ樹脂組成物及び半導体装置
JP6361352B2 (ja) ポリアミドエラストマー組成物、及びそれを用いた成形体
JP2018135447A (ja) 樹脂組成物及び構造体
JP7543689B2 (ja) 封止用樹脂組成物、当該組成物を用いた車載用電子制御ユニットの製造方法
JP6410494B2 (ja) 発熱体封止物の製造方法および誘導装置封止物の製造方法
JP7155502B2 (ja) 半導体装置およびその製造方法ならびに封止用樹脂組成物
JP2023146639A (ja) 封止用樹脂組成物
WO2023248380A1 (ja) 熱伝導性樹脂組成物、熱伝導性シートおよびその製造方法、熱伝導性硬化物およびその製造方法、パワーモジュール、ならびに、モータのステータ
CN115029093A (zh) 汽车薄膜电容用环氧树脂灌封胶及其制备方法
JP4435342B2 (ja) エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
KR20250157506A (ko) 이해체성 수지 조성물, 이해체성 수지 조성물의 경화물을 구비하는 구조체, 구조체의 해체 방법, 구조체를 구성하는 재료의 리사이클 방법
JP2025179455A (ja) 硬化性組成物及びその硬化物
JP2009013214A (ja) モーター封止用エポキシ樹脂成形材料及び成形品
JP2011236322A (ja) 構造用接着剤

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant