ES3062588T3 - Thermal conductive potting composition - Google Patents

Thermal conductive potting composition

Info

Publication number
ES3062588T3
ES3062588T3 ES18938949T ES18938949T ES3062588T3 ES 3062588 T3 ES3062588 T3 ES 3062588T3 ES 18938949 T ES18938949 T ES 18938949T ES 18938949 T ES18938949 T ES 18938949T ES 3062588 T3 ES3062588 T3 ES 3062588T3
Authority
ES
Spain
Prior art keywords
thermal conductive
potting composition
conductive potting
composition
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES18938949T
Other languages
English (en)
Spanish (es)
Inventor
Huang Lei
Hao Wu
Xueyu Qiu
Xue Xie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Application granted granted Critical
Publication of ES3062588T3 publication Critical patent/ES3062588T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
ES18938949T 2018-10-29 2018-10-29 Thermal conductive potting composition Active ES3062588T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/112319 WO2020087196A1 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Publications (1)

Publication Number Publication Date
ES3062588T3 true ES3062588T3 (en) 2026-04-13

Family

ID=70464384

Family Applications (1)

Application Number Title Priority Date Filing Date
ES18938949T Active ES3062588T3 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Country Status (8)

Country Link
US (1) US12503586B2 (https=)
EP (1) EP3873986B1 (https=)
JP (3) JP2022517694A (https=)
KR (1) KR102644123B1 (https=)
CN (1) CN113242884B (https=)
CA (1) CA3117241A1 (https=)
ES (1) ES3062588T3 (https=)
WO (1) WO2020087196A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物
EP4631988A1 (en) 2024-04-11 2025-10-15 Henkel AG & Co. KGaA Thermally conductive potting composition

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419496A (en) * 1982-02-22 1983-12-06 The Dow Chemical Company Particle agglomeration in rubber latices
US4871806A (en) * 1987-11-16 1989-10-03 The Sherwin-Williams Company Reactive coatings comprising an acid-functional compound, an anhydride-functional compound, an epoxy-functional compound and a hydroxy-functional compound
JP3454437B2 (ja) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JP2000239489A (ja) 1999-02-22 2000-09-05 Nippon Kayaku Co Ltd 封止材用液状エポキシ樹脂組成物及びその硬化物
JP4719976B2 (ja) * 1999-03-11 2011-07-06 東レ株式会社 エポキシ樹脂組成物及び繊維強化複合材料用エポキシ樹脂組成物並びにそれを有してなる繊維強化複合材料
DE50014006D1 (de) * 1999-03-16 2007-03-15 Huntsman Adv Mat Switzerland Härtbare zusammensetzung mit besonderer eigenschaftskombination
DE19912251A1 (de) * 1999-03-18 2000-09-21 Espe Dental Ag Zweikomponentige Zubereitungen zur Herstellung von zahntechnischen Modellen
JP2002158450A (ja) * 2000-09-06 2002-05-31 Ngk Spark Plug Co Ltd 配線基板
US7192997B2 (en) * 2001-02-07 2007-03-20 International Business Machines Corporation Encapsulant composition and electronic package utilizing same
US6512182B2 (en) 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
DE10138127A1 (de) 2001-08-03 2003-02-27 Henkel Kgaa Bindemittelkomponente für Oberflächenbeschichtungsmittel mit verbesserten Hafteigenschaften
JP2006045343A (ja) 2004-08-04 2006-02-16 Yaskawa Electric Corp 注形用エポキシ樹脂組成物およびそれを用いた電動機用モールドコイル
US20080039555A1 (en) * 2006-08-10 2008-02-14 Michel Ruyters Thermally conductive material
US20090023056A1 (en) * 2007-07-18 2009-01-22 Tesla Motors, Inc. Battery pack thermal management system
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
JP4614107B2 (ja) * 2008-06-20 2011-01-19 住友電気工業株式会社 半導体装置
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
JP2010132838A (ja) * 2008-12-08 2010-06-17 Mitsubishi Electric Corp 高熱伝導性熱硬化性樹脂組成物
WO2010103852A1 (ja) * 2009-03-12 2010-09-16 国立大学法人信州大学 熱伝導性材料及びその製造方法並びに大電流用インダクタ
DE102010022523B4 (de) * 2010-06-02 2017-09-14 Siemens Healthcare Gmbh Gradientenspule mit in einer Vergussmasse vergossenen Spulenwicklungen
US9196412B2 (en) * 2011-05-13 2015-11-24 Dow Global Technologies Llc Insulation formulations
AU2012275565B2 (en) 2011-06-26 2017-05-25 Inductotherm Corp. Molten metal holding and pouring box with dual pouring nozzles
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
JPWO2013100174A1 (ja) * 2011-12-27 2015-05-11 パナソニックＩｐマネジメント株式会社 熱伝導性樹脂組成物
JP2013144763A (ja) * 2012-01-16 2013-07-25 Shin-Etsu Chemical Co Ltd 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置
WO2014092196A1 (ja) * 2012-12-11 2014-06-19 東レ・ダウコーニング株式会社 透明性に優れた高屈折率熱伝導性組成物、それからなる熱伝導性グリース、熱伝導性硬化物、熱軟化性熱伝導性組成物およびその用途
JP5708666B2 (ja) 2013-01-08 2015-04-30 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
EP3243855A1 (en) * 2013-03-06 2017-11-15 DIC Corporation Epoxy resin composition, cured product, heat dissipation material, and electronic material
JP2015021118A (ja) * 2013-07-23 2015-02-02 スリーエム イノベイティブ プロパティズ カンパニー ２液型ポッティング組成物
JP6160775B2 (ja) * 2014-07-02 2017-07-12 Dic株式会社 電子材料用エポキシ樹脂組成物、その硬化物および電子部材
US20170349795A1 (en) * 2015-02-11 2017-12-07 Dow Global Technologies Llc Low temperature curable adhesives and use thereof
JP6655359B2 (ja) * 2015-11-09 2020-02-26 京セラ株式会社 電子・電気部品の製造方法及びエポキシ樹脂組成物
KR102716321B1 (ko) 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
US10707143B2 (en) * 2016-05-30 2020-07-07 Industrial Technology Research Institute Plug-in type power module and subsystem thereof
CN109219629B (zh) * 2016-06-20 2021-08-27 Sika技术股份公司 可用作结构加固件或结构泡沫的热固性环氧树脂组合物
GB201613414D0 (en) * 2016-08-03 2016-09-14 Dow Corning Elastomeric compositions and their applications
JP2018069708A (ja) * 2016-11-04 2018-05-10 Dic株式会社 積層体、電子部材及び熱伝導性部材
CN106519581B (zh) 2016-11-29 2018-11-02 华中科技大学 一种高导热低粘度环氧树脂复合材料及其制备方法和应用
CN106753143A (zh) * 2016-12-21 2017-05-31 南京诺邦新材料有限公司 一种具有导热功能的低温固化底部填充胶及其制备方法
CN106753205B (zh) * 2017-01-11 2020-05-22 湖南博翔新材料有限公司 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用
CN111315819A (zh) * 2017-10-06 2020-06-19 3M创新有限公司 可固化组合物、由其制得的制品，及其制造和使用方法
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物

Also Published As

Publication number Publication date
EP3873986A4 (en) 2022-06-22
JP2025122035A (ja) 2025-08-20
US20210238408A1 (en) 2021-08-05
JP2023159356A (ja) 2023-10-31
KR20210084466A (ko) 2021-07-07
CA3117241A1 (en) 2020-05-07
WO2020087196A1 (en) 2020-05-07
KR102644123B1 (ko) 2024-03-07
JP2022517694A (ja) 2022-03-09
CN113242884A (zh) 2021-08-10
EP3873986A1 (en) 2021-09-08
EP3873986B1 (en) 2025-12-03
CN113242884B (zh) 2023-12-08
US12503586B2 (en) 2025-12-23

Similar Documents

Publication Publication Date Title
KR102760484B9 (ko) 열 전도성 실리콘 포팅 조성물
EP3299420A4 (en) THERMOCONDUCTIVE COMPOSITION
EP3575365A4 (en) COMPOSITION OF THERMO-CONDUCTIVE POLYORGANOSILOXANE
SG11201706655VA (en) Electrically conductive composition
GB2547516B (en) Electrically conductive composition
PL3159975T3 (pl) Element uchwytu do etykiety dla listew zaciskowych elektrycznej rozdzielnicy tablicowej
GB201818644D0 (en) Electrical component
GB202104546D0 (en) Thermally conductive composition
GB201713246D0 (en) Insulation composition
PL3385462T3 (pl) Termoizolacyjny element budowlany
GB2578717B (en) Conductive element
KR102580350B9 (ko) 열전소자
GB201618420D0 (en) Thermal insulating material
HUE068629T2 (hu) Elektromos szerkezet
ES3062588T3 (en) Thermal conductive potting composition
GB201805920D0 (en) Electrical Switchgear
EP3594968A4 (en) CONDUCTIVE CERAMIC COMPOSITION HAVING EXCELLENT ELECTRICAL CONDUCTIVITY
GB201818641D0 (en) Electrical component
ZA201801983B (en) Heterophasic composition
GB201703777D0 (en) Conductive ink composition
GB2579152B (en) Insulation composition
GB2573106B (en) Insulation
PL3781632T3 (pl) Środek zapobiegający zamarzaniu
EP3580295A4 (en) ADHESIVE TAPE FOR DIGITAL PRINTED DUCTS
GB201502011D0 (en) Thermal insulating material