ES3062588T3 - Thermal conductive potting composition - Google Patents

Thermal conductive potting composition

Info

Publication number
ES3062588T3
ES3062588T3 ES18938949T ES18938949T ES3062588T3 ES 3062588 T3 ES3062588 T3 ES 3062588T3 ES 18938949 T ES18938949 T ES 18938949T ES 18938949 T ES18938949 T ES 18938949T ES 3062588 T3 ES3062588 T3 ES 3062588T3
Authority
ES
Spain
Prior art keywords
thermally conductive
encapsulation composition
weight
composition according
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES18938949T
Other languages
English (en)
Spanish (es)
Inventor
Huang Lei
Hao Wu
Xueyu Qiu
Xue Xie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Application granted granted Critical
Publication of ES3062588T3 publication Critical patent/ES3062588T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
ES18938949T 2018-10-29 2018-10-29 Thermal conductive potting composition Active ES3062588T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/112319 WO2020087196A1 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Publications (1)

Publication Number Publication Date
ES3062588T3 true ES3062588T3 (en) 2026-04-13

Family

ID=70464384

Family Applications (1)

Application Number Title Priority Date Filing Date
ES18938949T Active ES3062588T3 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Country Status (8)

Country Link
US (1) US12503586B2 (https=)
EP (1) EP3873986B1 (https=)
JP (3) JP2022517694A (https=)
KR (1) KR102644123B1 (https=)
CN (1) CN113242884B (https=)
CA (1) CA3117241A1 (https=)
ES (1) ES3062588T3 (https=)
WO (1) WO2020087196A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物
JP7853135B2 (ja) * 2022-03-29 2026-04-28 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体
EP4631988A1 (en) 2024-04-11 2025-10-15 Henkel AG & Co. KGaA Thermally conductive potting composition

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JP2006045343A (ja) 2004-08-04 2006-02-16 Yaskawa Electric Corp 注形用エポキシ樹脂組成物およびそれを用いた電動機用モールドコイル
US20080039555A1 (en) * 2006-08-10 2008-02-14 Michel Ruyters Thermally conductive material
US20090023056A1 (en) * 2007-07-18 2009-01-22 Tesla Motors, Inc. Battery pack thermal management system
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
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KR102716321B1 (ko) * 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
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CN106753143A (zh) * 2016-12-21 2017-05-31 南京诺邦新材料有限公司 一种具有导热功能的低温固化底部填充胶及其制备方法
CN106753205B (zh) * 2017-01-11 2020-05-22 湖南博翔新材料有限公司 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用
CN111315819A (zh) * 2017-10-06 2020-06-19 3M创新有限公司 可固化组合物、由其制得的制品，及其制造和使用方法
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物

Also Published As

Publication number Publication date
US12503586B2 (en) 2025-12-23
CN113242884A (zh) 2021-08-10
KR20210084466A (ko) 2021-07-07
EP3873986B1 (en) 2025-12-03
JP2022517694A (ja) 2022-03-09
KR102644123B1 (ko) 2024-03-07
JP2025122035A (ja) 2025-08-20
CN113242884B (zh) 2023-12-08
WO2020087196A1 (en) 2020-05-07
US20210238408A1 (en) 2021-08-05
EP3873986A1 (en) 2021-09-08
JP2023159356A (ja) 2023-10-31
CA3117241A1 (en) 2020-05-07
EP3873986A4 (en) 2022-06-22

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