JP2022168128A5 - - Google Patents
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- Publication number
- JP2022168128A5 JP2022168128A5 JP2022143070A JP2022143070A JP2022168128A5 JP 2022168128 A5 JP2022168128 A5 JP 2022168128A5 JP 2022143070 A JP2022143070 A JP 2022143070A JP 2022143070 A JP2022143070 A JP 2022143070A JP 2022168128 A5 JP2022168128 A5 JP 2022168128A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- die pad
- main surface
- semiconductor
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 23
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 238000007789 sealing Methods 0.000 claims 7
- 239000000463 material Substances 0.000 claims 4
- 239000011342 resin composition Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023218318A JP7665005B2 (ja) | 2018-07-20 | 2023-12-25 | ＳｉＣ半導体装置 |
| JP2025063880A JP2025096454A (ja) | 2018-07-20 | 2025-04-08 | 半導体装置 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018136826 | 2018-07-20 | ||
| JP2018136826 | 2018-07-20 | ||
| PCT/JP2019/028192 WO2020017574A1 (ja) | 2018-07-20 | 2019-07-18 | 半導体装置および半導体装置の製造方法 |
| JP2020531353A JP7141453B2 (ja) | 2018-07-20 | 2019-07-18 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020531353A Division JP7141453B2 (ja) | 2018-07-20 | 2019-07-18 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023218318A Division JP7665005B2 (ja) | 2018-07-20 | 2023-12-25 | ＳｉＣ半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022168128A JP2022168128A (ja) | 2022-11-04 |
| JP2022168128A5 true JP2022168128A5 (enExample) | 2022-12-19 |
| JP7411748B2 JP7411748B2 (ja) | 2024-01-11 |
Family
ID=69163830
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020531353A Active JP7141453B2 (ja) | 2018-07-20 | 2019-07-18 | 半導体装置 |
| JP2022143070A Active JP7411748B2 (ja) | 2018-07-20 | 2022-09-08 | 半導体装置 |
| JP2023218318A Active JP7665005B2 (ja) | 2018-07-20 | 2023-12-25 | ＳｉＣ半導体装置 |
| JP2025063880A Pending JP2025096454A (ja) | 2018-07-20 | 2025-04-08 | 半導体装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020531353A Active JP7141453B2 (ja) | 2018-07-20 | 2019-07-18 | 半導体装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023218318A Active JP7665005B2 (ja) | 2018-07-20 | 2023-12-25 | ＳｉＣ半導体装置 |
| JP2025063880A Pending JP2025096454A (ja) | 2018-07-20 | 2025-04-08 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US11545446B2 (enExample) |
| JP (4) | JP7141453B2 (enExample) |
| CN (2) | CN112424919B (enExample) |
| DE (1) | DE112019003664T5 (enExample) |
| WO (1) | WO2020017574A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12224220B2 (en) | 2020-02-06 | 2025-02-11 | Mitsubishi Electric Corporation | Semiconductor module and power conversion apparatus |
| KR102196385B1 (ko) * | 2020-05-04 | 2020-12-30 | 제엠제코(주) | 반도체 패키지 |
| CN116830260A (zh) * | 2021-02-12 | 2023-09-29 | 日本发条株式会社 | 电路基板以及制造方法 |
| EP4044226A1 (en) * | 2021-02-16 | 2022-08-17 | Nexperia B.V. | A semiconductor device and a method of manufacturing of a semiconductor device |
| JP2023058259A (ja) | 2021-10-13 | 2023-04-25 | 富士電機株式会社 | 半導体装置の製造方法及び半導体装置 |
| US20240021487A1 (en) * | 2022-07-12 | 2024-01-18 | Semiconductor Components Industries, Llc | Semiconductor device package |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2741204B2 (ja) | 1988-02-17 | 1998-04-15 | ローム 株式会社 | 半導体装置 |
| JP2734443B2 (ja) * | 1996-03-19 | 1998-03-30 | 日本電気株式会社 | 樹脂封止型半導体装置 |
| US5866953A (en) * | 1996-05-24 | 1999-02-02 | Micron Technology, Inc. | Packaged die on PCB with heat sink encapsulant |
| JP2000269394A (ja) | 1999-03-15 | 2000-09-29 | Toshiba Corp | 半導体素子 |
| JP2005093635A (ja) * | 2003-09-17 | 2005-04-07 | Fuji Electric Device Technology Co Ltd | 樹脂封止型半導体装置 |
| US20090032972A1 (en) | 2007-03-30 | 2009-02-05 | Kabushiki Kaisha Toshiba | Semiconductor device |
| JP5682341B2 (ja) * | 2011-02-01 | 2015-03-11 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP2012174927A (ja) * | 2011-02-22 | 2012-09-10 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| CN104428890B (zh) | 2012-07-11 | 2017-10-24 | 三菱电机株式会社 | 半导体装置及其制造方法 |
| JP2014072308A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置の製造方法、半導体装置 |
| JP5975911B2 (ja) * | 2013-03-15 | 2016-08-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6150718B2 (ja) * | 2013-12-10 | 2017-06-21 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP6520437B2 (ja) | 2015-06-12 | 2019-05-29 | 富士電機株式会社 | 半導体装置 |
| JP2017092389A (ja) * | 2015-11-16 | 2017-05-25 | シャープ株式会社 | 半導体装置 |
-
2019
- 2019-07-18 JP JP2020531353A patent/JP7141453B2/ja active Active
- 2019-07-18 CN CN201980046982.9A patent/CN112424919B/zh active Active
- 2019-07-18 US US17/260,499 patent/US11545446B2/en active Active
- 2019-07-18 DE DE112019003664.5T patent/DE112019003664T5/de active Pending
- 2019-07-18 CN CN202410128343.XA patent/CN117936471A/zh active Pending
- 2019-07-18 WO PCT/JP2019/028192 patent/WO2020017574A1/ja not_active Ceased
-
2022
- 2022-09-08 JP JP2022143070A patent/JP7411748B2/ja active Active
- 2022-12-02 US US18/074,399 patent/US11804453B2/en active Active
-
2023
- 2023-09-27 US US18/475,946 patent/US12176302B2/en active Active
- 2023-12-25 JP JP2023218318A patent/JP7665005B2/ja active Active
-
2024
- 2024-11-11 US US18/943,120 patent/US20250070051A1/en active Pending
-
2025
- 2025-04-08 JP JP2025063880A patent/JP2025096454A/ja active Pending
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