JP2022062715A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022062715A5 JP2022062715A5 JP2021210036A JP2021210036A JP2022062715A5 JP 2022062715 A5 JP2022062715 A5 JP 2022062715A5 JP 2021210036 A JP2021210036 A JP 2021210036A JP 2021210036 A JP2021210036 A JP 2021210036A JP 2022062715 A5 JP2022062715 A5 JP 2022062715A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- core
- shell structure
- assembly
- metal particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 19
- 239000002184 metal Substances 0.000 claims 15
- 239000002923 metal particle Substances 0.000 claims 10
- 239000011258 core-shell material Substances 0.000 claims 9
- 239000002105 nanoparticle Substances 0.000 claims 9
- 239000011230 binding agent Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims 3
- 239000000843 powder Substances 0.000 claims 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 229920000307 polymer substrate Polymers 0.000 claims 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024009864A JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN2873CH2014 | 2014-06-12 | ||
| IN2873/CHE/2014 | 2014-06-12 | ||
| JP2019216135A JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019216135A Division JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024009864A Division JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022062715A JP2022062715A (ja) | 2022-04-20 |
| JP2022062715A5 true JP2022062715A5 (https=) | 2022-05-13 |
| JP7489956B2 JP7489956B2 (ja) | 2024-05-24 |
Family
ID=54834397
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016572384A Pending JP2017525839A (ja) | 2014-06-12 | 2015-06-12 | 焼結材料、及びそれを用いる接着方法 |
| JP2019216135A Active JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
| JP2021210036A Active JP7489956B2 (ja) | 2014-06-12 | 2021-12-24 | 焼結材料、及びそれを用いる接着方法 |
| JP2024009864A Withdrawn JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016572384A Pending JP2017525839A (ja) | 2014-06-12 | 2015-06-12 | 焼結材料、及びそれを用いる接着方法 |
| JP2019216135A Active JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024009864A Withdrawn JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11389865B2 (https=) |
| EP (1) | EP3154729A4 (https=) |
| JP (4) | JP2017525839A (https=) |
| KR (5) | KR20220106240A (https=) |
| CN (1) | CN106660120A (https=) |
| BR (1) | BR112016029118A2 (https=) |
| WO (1) | WO2015192004A1 (https=) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015120156B4 (de) * | 2015-11-20 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur materialschlüssigen Verbindung von Verbindungspartnern eines Leistungselekronik-Bauteils und Verwendung einer solchen Vorrichtung |
| JP6815133B2 (ja) | 2016-08-31 | 2021-01-20 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
| US20180166369A1 (en) * | 2016-12-14 | 2018-06-14 | Texas Instruments Incorporated | Bi-Layer Nanoparticle Adhesion Film |
| US9865527B1 (en) | 2016-12-22 | 2018-01-09 | Texas Instruments Incorporated | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation |
| MY195254A (en) * | 2017-01-11 | 2023-01-11 | Hitachi Chemical Co Ltd | Copper Paste for Pressureless Bonding, Bonded Body And Semiconductor Device |
| US9941194B1 (en) | 2017-02-21 | 2018-04-10 | Texas Instruments Incorporated | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer |
| DE112017007299B4 (de) * | 2017-03-23 | 2024-10-10 | Mitsubishi Electric Corporation | Halbleiterelement-bonding-körper, halbleitereinheit und verfahren zur herstellung eines halbleiterelement-bonding-körpers |
| JP7127269B2 (ja) * | 2017-10-23 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 部材接続方法 |
| JP7043794B2 (ja) | 2017-11-06 | 2022-03-30 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法 |
| CN108016032B (zh) * | 2017-12-05 | 2019-08-13 | 广西艾盛创制科技有限公司 | 一种提高打印件强度韧性的3d打印成型工艺方法和装置 |
| CN108098092A (zh) * | 2017-12-21 | 2018-06-01 | 成都川美新技术股份有限公司 | 一种采用焊锡膏对射频基板与壳体进行烧结的方法 |
| JP7143156B2 (ja) * | 2018-04-27 | 2022-09-28 | 日東電工株式会社 | 半導体装置製造方法 |
| KR102040020B1 (ko) * | 2018-08-29 | 2019-11-04 | 주식회사 영동테크 | 은과 구리의 고용체를 포함하는 금속 나노 분말 |
| JP7228422B2 (ja) * | 2019-03-15 | 2023-02-24 | 日東電工株式会社 | 焼結接合用シート、基材付き焼結接合用シート、および焼結接合用材料層付き半導体チップ |
| CN109819384A (zh) * | 2019-04-09 | 2019-05-28 | 重庆三峡学院 | 一种mems麦克风封装器件的制造方法 |
| JP6675622B1 (ja) * | 2019-04-25 | 2020-04-01 | アサヒ・エンジニアリング株式会社 | 電子部品のシンタリング装置および方法 |
| US12246376B2 (en) | 2019-05-07 | 2025-03-11 | Alpha Assembly Solutions Inc. | Sinter-ready silver films |
| JP6624626B1 (ja) * | 2019-07-29 | 2019-12-25 | アサヒ・エンジニアリング株式会社 | 電子部品のシンタリング装置 |
| US11373976B2 (en) * | 2019-08-02 | 2022-06-28 | Rockwell Collins, Inc. | System and method for extreme performance die attach |
| EP3817044A1 (en) * | 2019-11-04 | 2021-05-05 | Infineon Technologies Austria AG | Semiconductor package with a silicon carbide power semiconductor chip diffusion soldered to a copper leadframe part and a corresponding manufacturing method |
| CN113345861A (zh) * | 2020-02-18 | 2021-09-03 | 朋程科技股份有限公司 | 功率组件的半成品及其制造方法以及功率组件的制造方法 |
| JP7239051B2 (ja) * | 2020-03-04 | 2023-03-14 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP7604779B2 (ja) * | 2020-03-23 | 2024-12-24 | 富士電機株式会社 | 半導体製造装置及び半導体装置の製造方法 |
| WO2021259536A2 (de) * | 2020-06-23 | 2021-12-30 | Siemens Aktiengesellschaft | Verfahren zur kontaktierung eines leistungshalbleiters auf einem substrat |
| US20220230989A1 (en) * | 2021-01-18 | 2022-07-21 | Nitto Denko Corporation | Semiconductor device and method for producing semiconductor device |
| JP2022111042A (ja) * | 2021-01-18 | 2022-07-29 | 日東電工株式会社 | 半導体装置、及び、半導体装置の製造方法。 |
| FR3121277B1 (fr) * | 2021-03-26 | 2024-02-16 | Safran Electronics & Defense | Procédé pour assembler un composant électronique à un substrat |
| WO2023282976A2 (en) * | 2021-05-24 | 2023-01-12 | Corning Research & Development Corporation | Systems and methods of joining substrates using nano-particles |
| GB2612776A (en) * | 2021-11-10 | 2023-05-17 | Asm Assembly Systems Singapore Pte Ltd | Deposit levelling |
| JP2023073819A (ja) * | 2021-11-16 | 2023-05-26 | 富士電機株式会社 | 半導体装置及びその製造方法 |
| DK4494182T3 (da) * | 2022-03-15 | 2026-03-16 | Alpha Assembly Solutions Inc | Sinterklare bonding-områder på flerlagstråde/-bånd og fremgangsmåde til chipoversidefastgørelse |
| JP7683528B2 (ja) * | 2022-04-05 | 2025-05-27 | 株式会社三洋物産 | 遊技機 |
| JP7683529B2 (ja) * | 2022-04-05 | 2025-05-27 | 株式会社三洋物産 | 遊技機 |
| US20240182757A1 (en) * | 2022-12-02 | 2024-06-06 | Wolfspeed, Inc. | Core-Shell Particle Die-Attach Material |
| US12588521B2 (en) | 2023-02-15 | 2026-03-24 | Wolfspeed, Inc. | Metal nitride core-shell particle die-attach material |
| EP4421054A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Kupfer-keramik-substrat mit sinterbarer oberseite |
| EP4421055A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Kupfer-keramik-substrat mit sinterbarer oberseite |
| EP4421056A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit sinterbarer oberseite |
| DE102023104436A1 (de) | 2023-02-23 | 2024-08-29 | Heraeus Deutschland GmbH & Co. KG | Metall-Keramik-Substrat mit sinterbarer Oberseite |
| EP4443487A1 (de) | 2023-04-04 | 2024-10-09 | Heraeus Electronics GmbH & Co. KG | Substratanordnung mit oberflächenstruktur |
| EP4443488A1 (de) | 2023-04-04 | 2024-10-09 | Heraeus Electronics GmbH & Co. KG | Substratanordnung mit oberflächenstruktur |
| WO2024232130A1 (ja) | 2023-05-09 | 2024-11-14 | 株式会社新川 | 半導体装置の製造方法 |
| JP2025086811A (ja) | 2023-11-28 | 2025-06-09 | 株式会社Pfa | 接合体製造装置および接合体製造方法 |
| EP4700826A1 (de) | 2024-08-23 | 2026-02-25 | Heraeus Electronics GmbH & Co. KG | Substratanordnung, verfahren zur herstellung einer elektronischen baugruppe und elektronische baugruppe |
| CN118737861B (zh) * | 2024-09-04 | 2024-11-12 | 深圳平创半导体有限公司 | 一种晶圆的金属化方法 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3871845A (en) | 1973-06-25 | 1975-03-18 | Clarkes Sheet Metal | Industrial air filter |
| JPS5725248Y2 (https=) * | 1977-01-18 | 1982-06-01 | ||
| US6562169B2 (en) * | 2001-01-17 | 2003-05-13 | International Business Machines Corporation | Multi-level web structure in use for thin sheet processing |
| JP2004095832A (ja) | 2002-08-30 | 2004-03-25 | Fuji Electric Holdings Co Ltd | フリップチップ実装方法 |
| JP4495927B2 (ja) | 2003-07-28 | 2010-07-07 | 新日鉄マテリアルズ株式会社 | 半導体装置およびその製造方法 |
| US20050129843A1 (en) * | 2003-12-11 | 2005-06-16 | Xerox Corporation | Nanoparticle deposition process |
| US8257795B2 (en) * | 2004-02-18 | 2012-09-04 | Virginia Tech Intellectual Properties, Inc. | Nanoscale metal paste for interconnect and method of use |
| US7524351B2 (en) * | 2004-09-30 | 2009-04-28 | Intel Corporation | Nano-sized metals and alloys, and methods of assembling packages containing same |
| KR100718726B1 (ko) * | 2005-12-22 | 2007-05-16 | 성균관대학교산학협력단 | 폴리디비닐벤젠 구형 입자와 금속을 이용한 코어/쉘도전입자 및 이의 제조방법 |
| KR100781586B1 (ko) * | 2006-02-24 | 2007-12-05 | 삼성전기주식회사 | 코어-셀 구조의 금속 나노입자 및 이의 제조방법 |
| US7968008B2 (en) * | 2006-08-03 | 2011-06-28 | Fry's Metals, Inc. | Particles and inks and films using them |
| KR20080078396A (ko) * | 2007-02-23 | 2008-08-27 | 엘지전자 주식회사 | 전극용 페이스트 조성물과 그 제조방법 및 이를 이용하는플라즈마 디스플레이 패널과 그 제조방법 |
| KR101316253B1 (ko) * | 2007-06-27 | 2013-10-08 | 동우 화인켐 주식회사 | 도전성 페이스트 조성물, 이를 포함하는 전극 및 상기전극의 제조방법 |
| US8555491B2 (en) * | 2007-07-19 | 2013-10-15 | Alpha Metals, Inc. | Methods of attaching a die to a substrate |
| KR100838647B1 (ko) * | 2007-07-23 | 2008-06-16 | 한국과학기술원 | Ａｃｆ／ｎｃｆ 이중층을 이용한 웨이퍼 레벨 플립칩패키지의 제조방법 |
| US7749300B2 (en) | 2008-06-05 | 2010-07-06 | Xerox Corporation | Photochemical synthesis of bimetallic core-shell nanoparticles |
| KR20110028632A (ko) | 2008-06-23 | 2011-03-21 | 이섬 리서치 디벨러프먼트 컴파니 오브 더 히브루 유니버시티 오브 예루살렘 엘티디. | 코어-쉘 금속 나노입자, 그 제조 방법, 및 이를 함유하는 잉크 조성물들 |
| KR20100007035A (ko) * | 2008-07-11 | 2010-01-22 | 주식회사 효성 | 이방성 도전 필름의 제조방법 및 이에 의해 제조된 이방성도전 필름 |
| JP5748957B2 (ja) | 2009-01-14 | 2015-07-15 | 国立大学法人九州大学 | コアシェル型金属ナノ粒子の製造方法 |
| KR101074917B1 (ko) * | 2009-03-31 | 2011-10-18 | 전북대학교산학협력단 | 코어-쉘 구조 복합나노입자를 감지물질로 이용한 박막형 고활성 가스센서 및 그 제조방법 |
| WO2010117102A1 (ko) * | 2009-04-09 | 2010-10-14 | 서강대학교 산학협력단 | 콜로이드 입자들을 단결정들로 정렬하는 방법 |
| US20110318213A1 (en) | 2009-09-08 | 2011-12-29 | Carol Anne Handwerker | Shell activated sintering of core-shell particles |
| KR101651932B1 (ko) * | 2009-10-26 | 2016-08-30 | 한화케미칼 주식회사 | 카르복실산을 이용한 전도성 금속 박막의 제조방법 |
| WO2012052191A1 (de) * | 2010-10-20 | 2012-04-26 | Robert Bosch Gmbh | Ausgangswerkstoff und verfahren zur herstellung einer sinterverbindung |
| SG10201913296SA (en) | 2010-11-03 | 2020-02-27 | Frys Metals Inc | Sintering materials and attachment methods using same |
| US9475963B2 (en) * | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
| US20140141195A1 (en) * | 2012-11-16 | 2014-05-22 | Rong-Chang Liang | FIXED ARRAY ACFs WITH MULTI-TIER PARTIALLY EMBEDDED PARTICLE MORPHOLOGY AND THEIR MANUFACTURING PROCESSES |
| US20140120356A1 (en) * | 2012-06-18 | 2014-05-01 | Ormet Circuits, Inc. | Conductive film adhesive |
| US10239153B2 (en) * | 2012-09-06 | 2019-03-26 | Edison Welding Institute, Inc. | Inertia friction welding system for martensite-free joining of materials |
| KR102675888B1 (ko) | 2012-10-29 | 2024-06-14 | 알파 어셈블리 솔루션스 인크. | 소결 분말 |
| KR102210176B1 (ko) * | 2013-03-15 | 2021-01-29 | 산드빅 인터렉츄얼 프로퍼티 에이비 | 상이한 크기 및 형상의 소결 부분들을 접합하는 방법 |
| KR101455958B1 (ko) | 2013-09-09 | 2014-10-31 | 천광주 | 마름방지장치를 구비한 출몰식 필기구 |
| US10131177B2 (en) * | 2014-02-07 | 2018-11-20 | Entrust Datacard Corporation | Barrier coating for a substrate |
| JP6480806B2 (ja) * | 2014-05-23 | 2019-03-13 | ゼネラル・エレクトリック・カンパニイ | セラミックと金属を接合するための方法およびその封止構造 |
| JP6933712B2 (ja) * | 2016-09-27 | 2021-09-08 | ノベリス・インコーポレイテッドＮｏｖｅｌｉｓ Ｉｎｃ． | 表面品質を制御する金属の磁気浮上加熱 |
| CN108016032B (zh) * | 2017-12-05 | 2019-08-13 | 广西艾盛创制科技有限公司 | 一种提高打印件强度韧性的3d打印成型工艺方法和装置 |
| CN108098092A (zh) * | 2017-12-21 | 2018-06-01 | 成都川美新技术股份有限公司 | 一种采用焊锡膏对射频基板与壳体进行烧结的方法 |
-
2015
- 2015-06-12 WO PCT/US2015/035566 patent/WO2015192004A1/en not_active Ceased
- 2015-06-12 KR KR1020227025309A patent/KR20220106240A/ko not_active Ceased
- 2015-06-12 KR KR1020197003667A patent/KR20190016142A/ko not_active Ceased
- 2015-06-12 CN CN201580037893.XA patent/CN106660120A/zh active Pending
- 2015-06-12 EP EP15806611.8A patent/EP3154729A4/en active Pending
- 2015-06-12 KR KR1020167036636A patent/KR20170013927A/ko not_active Ceased
- 2015-06-12 KR KR1020207035949A patent/KR102424487B1/ko active Active
- 2015-06-12 KR KR1020247022325A patent/KR20240112953A/ko not_active Ceased
- 2015-06-12 BR BR112016029118A patent/BR112016029118A2/pt not_active Application Discontinuation
- 2015-06-12 JP JP2016572384A patent/JP2017525839A/ja active Pending
- 2015-06-12 US US15/316,684 patent/US11389865B2/en active Active
-
2019
- 2019-11-29 JP JP2019216135A patent/JP7001659B2/ja active Active
-
2021
- 2021-12-24 JP JP2021210036A patent/JP7489956B2/ja active Active
-
2024
- 2024-01-26 JP JP2024009864A patent/JP2024045324A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2022062715A5 (https=) | ||
| JP2014503936A5 (https=) | ||
| JP7001659B2 (ja) | 焼結材料、及びそれを用いる接着方法 | |
| JP2007243181A (ja) | インプリンティングによる基板の製造方法 | |
| CN105524293A (zh) | 一种具有超轻离型力的离型膜及其制备方法 | |
| JP6022492B2 (ja) | 微細空間内に導体を形成する製造方法 | |
| CN107791616A (zh) | 一种铜/石墨薄膜多层层合块状复合材料的制备方法 | |
| CN107215117B (zh) | 烫金膜及其制备方法和应用 | |
| JP6805064B2 (ja) | 耐熱離型シート | |
| JPWO2023145610A5 (https=) | ||
| CN102592763B (zh) | 陶瓷热敏电阻的制备方法 | |
| JP5535375B2 (ja) | 接続シート | |
| KR100915222B1 (ko) | 세라믹 적층 공정용 접착 시트 및 이를 이용한 적층 방법 | |
| JP4654572B2 (ja) | グリーンシートおよび積層型電子部品の製造方法 | |
| CN116656267B (zh) | 一种具有信息储存及读取功能的防伪转移材料及其制备方法 | |
| JP2013135140A (ja) | グリーンシートとセラミック多層基板およびセラミック多層基板の製造方法 | |
| CN101060033B (zh) | 制造电极图案的方法 | |
| TW201831315A (zh) | 輕量化立體複合均溫材 | |
| JP2022026653A (ja) | グラファイト積層体、グラファイトプレート、およびグラファイト積層体の製造方法 | |
| JP5316227B2 (ja) | コンデンサ、配線基板およびそれらの製造方法 | |
| CN109572262A (zh) | 一种用于膜压转移膜的镭射母膜及其制备方法和应用方法 | |
| JPS5857730A (ja) | 半導体パツケ−ジの製造方法 | |
| TW202249543A (zh) | 用於嵌入式積體電路總成之總成及其用途與製造方法 | |
| JP4689148B2 (ja) | 回折構造を有する転写箔 | |
| TWI491502B (zh) | Uncoated laser water transfer film |