JP2022053956A - 配線形成方法及び転写型の製造方法 - Google Patents
配線形成方法及び転写型の製造方法 Download PDFInfo
- Publication number
- JP2022053956A JP2022053956A JP2020160867A JP2020160867A JP2022053956A JP 2022053956 A JP2022053956 A JP 2022053956A JP 2020160867 A JP2020160867 A JP 2020160867A JP 2020160867 A JP2020160867 A JP 2020160867A JP 2022053956 A JP2022053956 A JP 2022053956A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- substrate
- curing
- transfer type
- curing treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 61
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000001723 curing Methods 0.000 claims description 62
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 21
- 238000013007 heat curing Methods 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000007779 soft material Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 2
- 238000007639 printing Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/08—Forme preparation by embossing, e.g. with a typewriter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Methods (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
2 導電性部材
3 配線部
4 転写型
4a 凹部
Claims (13)
- 所定パターンの凹部が形成された転写型の該凹部に導電性部材を充填し、この導電性部材が充填された前記転写型を凹凸を有する基板の表面に重ね合わせ、前記導電性部材を前記基板の表面に転写して該導電性部材により該基板の表面上に配線部を形成する方法であって、前記転写型にデュロメータA硬度が40~70の軟質性のものを用いることを特徴とする配線形成方法。
- 請求項1記載の配線形成方法において、前記凹凸は、前記基板の表面に設けられたアスペクト比が1以上の配線段差であることを特徴とする配線形成方法。
- 請求項1,2いずれか1項に記載の配線形成方法において、前記転写型は、シリコーン系高分子化合物を主成分とする主剤に硬化剤が混合された樹脂材料からなるものであることを特徴とする配線形成方法。
- 請求項3記載の配線形成方法において、前記樹脂材料は、前記主剤と前記硬化剤とがほぼ5:1の混合比で混合されたものであることを特徴とする配線形成方法。
- 請求項3,4いずれか1項に記載の配線形成方法において、前記転写型は、所定パターンの凸部が形成された原版上に前記樹脂材料を設けた後、支持基板で加圧成形し、硬化処理を行うことで得られるものであることを特徴とする配線形成方法。
- 請求項5記載の配線形成方法において、前記硬化処理は、常温で硬化させる常温硬化処理及び200℃以上の温度で加熱して硬化させる加熱硬化処理であることを特徴とする配線形成方法。
- 請求項6記載の配線形成方法において、前記常温硬化処理は24時間以上かけて行うことを特徴とする配線形成方法。
- 請求項6,7いずれか1項に記載の配線形成方法において、前記硬化処理は、15℃~30℃に設定された空間内で48時間かけて前記常温硬化処理を行い、続いて、200℃~250℃、30分の前記加熱硬化処理を行うことを特徴とする配線形成方法。
- 所定パターンの凸部が形成された原版上に樹脂材料を設けた後、支持基板で加圧成形し、硬化処理を行うことで得られる転写型の製造方法であって、前記樹脂材料は、シリコーン系高分子化合物を主成分とする主剤に硬化剤が混合され、デュロメータA硬度が40~70の軟質性の転写型が得られるものであることを特徴とする転写型の製造方法。
- 請求項9記載の転写型の製造方法において、樹脂材料は、前記主剤と前記硬化剤とがほぼ5:1の混合比で混合されたものであることを特徴とする転写型の製造方法。
- 請求項9,10いずれか1項に記載の転写型の製造方法において、前記硬化処理は、常温で硬化させる常温硬化処理及び200℃以上の温度で加熱して硬化させる加熱硬化処理であることを特徴とする転写型の製造方法。
- 請求項11記載の転写型の製造方法において、前記常温硬化処理は24時間以上かけて行うことを特徴とする転写型の製造方法。
- 請求項11,12いずれか1項に記載の転写型の製造方法において、前記硬化処理は、15℃~30℃に設定された空間内で48時間かけて前記常温硬化処理を行い、続いて、200℃~250℃、30分の前記加熱硬化処理を行うことを特徴とする転写型の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020160867A JP7374059B2 (ja) | 2020-09-25 | 2020-09-25 | 配線形成方法 |
CN202180063636.9A CN116157273A (zh) | 2020-09-25 | 2021-01-08 | 布线形成方法及转印模的制造方法 |
US18/041,900 US20240032205A1 (en) | 2020-09-25 | 2021-01-08 | Wiring formation method and transfer mold manufacturing method |
EP21871866.6A EP4219165A1 (en) | 2020-09-25 | 2021-01-08 | Wiring formation method and method for manufacturing transfer mold |
KR1020237005121A KR20230084122A (ko) | 2020-09-25 | 2021-01-08 | 배선 형성 방법 및 전사 형틀의 제조 방법 |
PCT/JP2021/000514 WO2022064729A1 (ja) | 2020-09-25 | 2021-01-08 | 配線形成方法及び転写型の製造方法 |
TW110101041A TW202231496A (zh) | 2020-09-25 | 2021-01-12 | 配線形成方法及轉印模的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020160867A JP7374059B2 (ja) | 2020-09-25 | 2020-09-25 | 配線形成方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022053956A true JP2022053956A (ja) | 2022-04-06 |
JP2022053956A5 JP2022053956A5 (ja) | 2023-07-24 |
JP7374059B2 JP7374059B2 (ja) | 2023-11-06 |
Family
ID=80845109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020160867A Active JP7374059B2 (ja) | 2020-09-25 | 2020-09-25 | 配線形成方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20240032205A1 (ja) |
EP (1) | EP4219165A1 (ja) |
JP (1) | JP7374059B2 (ja) |
KR (1) | KR20230084122A (ja) |
CN (1) | CN116157273A (ja) |
TW (1) | TW202231496A (ja) |
WO (1) | WO2022064729A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000180862A (ja) * | 1998-12-11 | 2000-06-30 | Ricoh Microelectronics Co Ltd | 液晶表示装置用スペーサ形成方法、液晶表示装置用スペーサ形成装置、及び、液晶表示装置 |
JP2011502194A (ja) * | 2007-10-29 | 2011-01-20 | ダウ コーニング コーポレーション | 極性のポリジメチルシロキサンの型、この型の製造方法、およびパターン転写のためのこの型の使用方法 |
WO2015056483A1 (ja) * | 2013-10-18 | 2015-04-23 | 信越化学工業株式会社 | 紫外線硬化性オルガノポリシロキサン組成物及び版材の製造方法 |
JP2015182278A (ja) * | 2014-03-24 | 2015-10-22 | パナソニックIpマネジメント株式会社 | インプリント転写物、インプリント転写型、およびインプリント転写方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016058664A (ja) | 2014-09-11 | 2016-04-21 | コネクテックジャパン株式会社 | 導電部を有する基板 |
-
2020
- 2020-09-25 JP JP2020160867A patent/JP7374059B2/ja active Active
-
2021
- 2021-01-08 WO PCT/JP2021/000514 patent/WO2022064729A1/ja active Application Filing
- 2021-01-08 US US18/041,900 patent/US20240032205A1/en active Pending
- 2021-01-08 CN CN202180063636.9A patent/CN116157273A/zh active Pending
- 2021-01-08 KR KR1020237005121A patent/KR20230084122A/ko unknown
- 2021-01-08 EP EP21871866.6A patent/EP4219165A1/en active Pending
- 2021-01-12 TW TW110101041A patent/TW202231496A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000180862A (ja) * | 1998-12-11 | 2000-06-30 | Ricoh Microelectronics Co Ltd | 液晶表示装置用スペーサ形成方法、液晶表示装置用スペーサ形成装置、及び、液晶表示装置 |
JP2011502194A (ja) * | 2007-10-29 | 2011-01-20 | ダウ コーニング コーポレーション | 極性のポリジメチルシロキサンの型、この型の製造方法、およびパターン転写のためのこの型の使用方法 |
WO2015056483A1 (ja) * | 2013-10-18 | 2015-04-23 | 信越化学工業株式会社 | 紫外線硬化性オルガノポリシロキサン組成物及び版材の製造方法 |
JP2015182278A (ja) * | 2014-03-24 | 2015-10-22 | パナソニックIpマネジメント株式会社 | インプリント転写物、インプリント転写型、およびインプリント転写方法 |
Also Published As
Publication number | Publication date |
---|---|
US20240032205A1 (en) | 2024-01-25 |
TW202231496A (zh) | 2022-08-16 |
JP7374059B2 (ja) | 2023-11-06 |
CN116157273A (zh) | 2023-05-23 |
WO2022064729A1 (ja) | 2022-03-31 |
EP4219165A1 (en) | 2023-08-02 |
KR20230084122A (ko) | 2023-06-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3092587B2 (ja) | 半導体装置の製造方法 | |
TWI691976B (zh) | 異向性導電膜、其製造方法及連接構造體 | |
KR100344912B1 (ko) | 반도체소자의기판장착구조및그장착방법 | |
WO2022064729A1 (ja) | 配線形成方法及び転写型の製造方法 | |
JP6438794B2 (ja) | モールド金型、樹脂モールド装置及び樹脂モールド方法 | |
JP2022053956A5 (ja) | ||
JP2011060892A (ja) | 電子装置、電子装置の製造方法 | |
JP5083076B2 (ja) | 電子装置の製造方法 | |
WO2022085209A1 (ja) | 転写型及び配線形成方法 | |
JP2008181922A (ja) | 熱伝導基板、その製造方法および熱伝導基板を用いた半導体装置 | |
WO2010004903A1 (ja) | リードフレームおよびその製造方法 | |
WO2022079926A1 (ja) | 転写型及び配線形成方法 | |
WO2021140709A1 (ja) | 基板にパターン形成する導電部の形成方法 | |
JP2015153881A (ja) | 半導体接合方法 | |
JPS6258655B2 (ja) | ||
JP3985558B2 (ja) | 熱伝導性基板の製造方法 | |
WO2024095812A1 (ja) | 回路基板及び電子モジュール | |
TWI659476B (zh) | 製造半導體封裝基板的方法 | |
JP2013048152A (ja) | 回路基板の製造方法 | |
JP2005011877A (ja) | 回路パターン形成方法 | |
JP2003152143A (ja) | 熱伝導性基板の製造方法 | |
JP2021111668A5 (ja) | ||
JP2001057372A (ja) | Lsi内蔵ビルドアップ基板の作製方法 | |
JP2006156723A (ja) | 熱伝導性基板の製造方法 | |
JP2014165426A (ja) | 伸縮性配線基板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A80 | Written request to apply exceptions to lack of novelty of invention |
Free format text: JAPANESE INTERMEDIATE CODE: A80 Effective date: 20201008 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230713 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230713 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20230713 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231005 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231024 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7374059 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |