JP2022029549A - 積層体、画像表示部材とその製造方法、および、モバイル電子機器とその製造方法 - Google Patents
積層体、画像表示部材とその製造方法、および、モバイル電子機器とその製造方法 Download PDFInfo
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- IEFUHGXOQSVRDQ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;1-methyl-1-propylpiperidin-1-ium Chemical compound CCC[N+]1(C)CCCCC1.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F IEFUHGXOQSVRDQ-UHFFFAOYSA-N 0.000 description 1
- DKNRELLLVOYIIB-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;1-methyl-1-propylpyrrolidin-1-ium Chemical compound CCC[N+]1(C)CCCC1.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F DKNRELLLVOYIIB-UHFFFAOYSA-N 0.000 description 1
- NFLGAVZONHCOQE-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;trimethyl(propyl)azanium Chemical compound CCC[N+](C)(C)C.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F NFLGAVZONHCOQE-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- RNOOHTVUSNIPCJ-UHFFFAOYSA-N butan-2-yl prop-2-enoate Chemical compound CCC(C)OC(=O)C=C RNOOHTVUSNIPCJ-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- YTIVTFGABIZHHX-UHFFFAOYSA-N butynedioic acid Chemical compound OC(=O)C#CC(O)=O YTIVTFGABIZHHX-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910003473 lithium bis(trifluoromethanesulfonyl)imide Inorganic materials 0.000 description 1
- 229940006487 lithium cation Drugs 0.000 description 1
- VDVLPSWVDYJFRW-UHFFFAOYSA-N lithium;bis(fluorosulfonyl)azanide Chemical compound [Li+].FS(=O)(=O)[N-]S(F)(=O)=O VDVLPSWVDYJFRW-UHFFFAOYSA-N 0.000 description 1
- QSZMZKBZAYQGRS-UHFFFAOYSA-N lithium;bis(trifluoromethylsulfonyl)azanide Chemical compound [Li+].FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F QSZMZKBZAYQGRS-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- VMVNZNXAVJHNDJ-UHFFFAOYSA-N methyl 2,2,2-trifluoroacetate Chemical compound COC(=O)C(F)(F)F VMVNZNXAVJHNDJ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- OIRDBPQYVWXNSJ-UHFFFAOYSA-N methyl trifluoromethansulfonate Chemical compound COS(=O)(=O)C(F)(F)F OIRDBPQYVWXNSJ-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011591 potassium Chemical group 0.000 description 1
- XRVCFZPJAHWYTB-UHFFFAOYSA-N prenderol Chemical compound CCC(CC)(CO)CO XRVCFZPJAHWYTB-UHFFFAOYSA-N 0.000 description 1
- 229950006800 prenderol Drugs 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001422 pyrrolinyl group Chemical group 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- VFWRGKJLLYDFBY-UHFFFAOYSA-N silver;hydrate Chemical compound O.[Ag].[Ag] VFWRGKJLLYDFBY-UHFFFAOYSA-N 0.000 description 1
- 239000011734 sodium Chemical group 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 125000004436 sodium atom Chemical group 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000011366 tin-based material Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000002827 triflate group Chemical class FC(S(=O)(=O)O*)(F)F 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
Abstract
Description
樹脂フィルム(1)、粘着剤層(1)、樹脂フィルム(2)をこの順に有する、3層以上の積層体であって、
該積層体の全光線透過率が20%~83%である。
上記積層体を用いた画像表示部材の製造方法であって、
上記樹脂フィルム(1)と上記粘着剤層(1)が直接に積層され、
該粘着剤層(1)から該樹脂フィルム(1)を剥離する工程と、
露出した該粘着剤層(1)にOLEDパネルを貼り合わせる工程と、
を含む。
上記積層体を用いたモバイル電子機器の製造方法であって、
上記樹脂フィルム(1)と上記粘着剤層(1)が直接に積層され、
該粘着剤層(1)から該樹脂フィルム(1)を剥離する工程と、
露出した該粘着剤層(1)にOLEDパネルを貼り合わせる工程と、
該積層体の、該粘着剤層(1)から見て上記樹脂フィルム(2)側の最外層上に、粘着剤層(2)を設ける工程と、
該粘着剤層(2)の、該樹脂フィルム(2)の存在する側とは反対側に、筐体を貼り合わせる工程と、
を含む。
本発明の実施形態による積層体は、樹脂フィルム(1)、粘着剤層(1)、樹脂フィルム(2)をこの順に有する、3層以上の積層体である。
樹脂フィルム(1)の厚みとしては、本発明の効果をより発現させ得る点で、好ましくは20μm~100μmであり、より好ましくは20μm~80μmであり、さらに好ましくは20μm~70μmであり、特に好ましくは20μm~60μmであり、最も好ましくは25μm~50μmである。
粘着剤層(1)は、本発明の効果を損なわない範囲で、任意の適切な粘着剤層を採用し得る。粘着剤層(1)は、1層のみであってもよいし、2層以上であってもよい。
アクリル系粘着剤は、アクリル系粘着剤組成物から形成される。
ウレタン系粘着剤としては、本発明の効果を損なわない範囲で、例えば、特開2017-039859号公報などに記載の公知のウレタン系粘着剤など、任意の適切なウレタン系粘着剤を採用し得る。このようなウレタン系粘着剤としては、例えば、ウレタン系粘着剤組成物から形成されるウレタン系粘着剤であって、該ウレタン系粘着剤組成物が、ウレタンプレポリマーおよびポリオールからなる群から選ばれる少なくとも1種と架橋剤とを含むものである。ウレタン系粘着剤は、1種のみであってもよいし、2種以上であってもよい。ウレタン系粘着剤は、本発明の効果を損なわない範囲で、任意の適切な成分を含有し得る。
ゴム系粘着剤は、代表的には、ゴム系粘着剤組成物から形成される。ゴム系粘着剤組成物は、代表的には、ゴム系ポリマーを含む。ゴム系粘着剤としては、本発明の効果を損なわない範囲で、例えば、特開2015-074771号公報などに記載の公知のゴム系粘着剤など、任意の適切なゴム系粘着剤を採用し得る。これらは、1種のみであってもよいし、2種以上であってもよい。ゴム系粘着剤は、本発明の効果を損なわない範囲で、任意の適切な成分を含有し得る。
シリコーン系粘着剤は、代表的には、シリコーン系粘着剤組成物から形成される。シリコーン系粘着剤組成物は、代表的には、シリコーン系ポリマーを含む。シリコーン系粘着剤としては、本発明の効果を損なわない範囲で、例えば、特開2014-047280号公報などに記載の公知のシリコーン系粘着剤など、任意の適切なシリコーン系粘着剤を採用し得る。これらは、1種のみであってもよいし、2種以上であってもよい。シリコーン系粘着剤は、本発明の効果を損なわない範囲で、任意の適切な成分を含有し得る。
粘着剤層(1)は導電成分を含んでいてもよい。代表的には、粘着剤層(1)の材料となる粘着剤組成物(アクリル系粘着剤組成物、ウレタン系粘着剤組成物、ゴム系粘着剤組成物、シリコーン系粘着剤組成物からなる群から選ばれる少なくとも1種)は、導電成分を含んでいてもよい。
粘着剤層(1)の材料となる粘着剤組成物(アクリル系粘着剤組成物、ウレタン系粘着剤組成物、ゴム系粘着剤組成物、シリコーン系粘着剤組成物からなる群から選ばれる少なくとも1種)は、本発明の効果を損なわない範囲で、任意の適切な他の成分を含有し得る。このような他の成分としては、例えば、他のポリマー成分、架橋促進剤、架橋触媒、シランカップリング剤、粘着付与樹脂(ロジン誘導体、ポリテルペン樹脂、石油樹脂、油溶性フェノールなど)、老化防止剤、無機充填剤、有機充填剤、金属粉、着色剤(顔料や染料など)、箔状物、紫外線吸収剤、酸化防止剤、光安定剤、連鎖移動剤、可塑剤、軟化剤、界面活性剤、帯電防止剤、導電剤、安定剤、表面潤滑剤、レベリング剤、腐食防止剤、耐熱安定剤、重合禁止剤、滑剤、溶剤、触媒などが挙げられる。
樹脂フィルム(2)の厚みとしては、本発明の効果を損なわない範囲で、目的に応じて、任意の適切な厚みを採用し得る。このような厚みとしては、本発明の効果をより発現させ得る点で、好ましくは20μm~125μmであり、より好ましくは25μm~100μmであり、さらに好ましくは38μm~100μmであり、特に好ましくは40μm~80μmであり、最も好ましくは50μm~75μmである。
本発明の実施形態による積層体は、樹脂フィルム(1)、粘着剤層(1)、樹脂フィルム(2)以外に、任意の適切な他の層を有していてもよい。このような他の層は、1層のみであってもよいし、2層以上であってもよい。
粘着剤層(2)は、本発明の効果を損なわない範囲で、任意の適切な粘着剤層を採用し得る。粘着剤層(2)は、1層のみであってもよいし、2層以上であってもよい。
樹脂フィルム(3)の厚みは、本発明の効果をより発現させ得る点で、好ましくは4μm~450μmであり、より好ましくは8μm~350μmであり、さらに好ましくは12μm~250μmであり、特に好ましくは16μm~150μmであり、最も好ましくは20μm~100μmである。
本発明の実施形態による積層体は、本発明の効果を損なわない範囲で、任意の適切な方法によって製造し得る。
本発明の実施形態による画像表示部材の製造方法は、本発明の積層体を用いる。
本発明の実施形態によるモバイル電子機器の製造方法は、本発明の積層体を用いる。
重量平均分子量は、ゲルパーミエーションクロマトグラフ(GPC)法により測定した。具体的には、GPC測定装置として、商品名「HLC-8120GPC」(東ソー株式会社製)を用いて、下記の条件にて測定し、標準ポリスチレン換算値により算出した。
(分子量測定条件)
・サンプル濃度:0.2重量%(テトラヒドロフラン溶液)
・サンプル注入量:10μL
・カラム:商品名「TSKguardcolumn SuperHZ-H(1本)+TSKgel SuperHZM-H(2本)」(東ソー株式会社製)
・リファレンスカラム:商品名「TSKgel SuperH-RC(1本)」(東ソー株式会社製)
・溶離液:テトラヒドロフラン(THF)
・流量:0.6mL/min
・検出器:示差屈折計(RI)
・カラム温度(測定温度):40℃
村上色彩技術研究所のHM-150Nを使用し、JIS-K-7361の条件で全光線透過率を測定した。この際、積層体は、光源側に樹脂フィルム(2)(樹脂フィルム(3)を備える場合は樹脂フィルム(3))が向くように設置した。
剥離樹脂フィルム-光学用アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(CS9660TB、全光線透過率>87%、日東電工製)の片面の剥離樹脂フィルムを剥がし、測定対象の積層体(I)の樹脂フィルム(2)(粘着剤層(2)と樹脂フィルム(3)を備える場合は樹脂フィルム(3))の面側に貼り合わせた。その後、残る剥離樹脂フィルムを剥がし、アルミホイル(三菱アルミニウム製)を積層体(I)の平面側の大きさの半分程度にカットし、測定対象の積層体(I)上の光学用アクリル系粘着剤と貼り合わせた。次に、積層体(I)から、樹脂フィルム(1)を剥離した。露出した粘着剤層(1)の面側に、ポリイミド樹脂フィルム(「UPILEX-50S」、厚み50μm、宇部興産製)を貼り合わせ、続いて、ポリイミド樹脂フィルム上に、偏光フィルム(「REGQ1698GDUHC3+H2-BW」、厚み78μm、日東電工製)を貼り合わせた。偏光フィルムの面側が上向き方向になるように試験台に載置し、図3に示すように、偏光板から30cmの距離から垂直方向に反射防止性を確認した。アルミホイルを貼り合わせた部分と貼り合わせていない部分がはっきりと区別できるどうかを基準として判定した。
〇:はっきり区別できない。
×:はっきり区別できる。
測定対象の積層体(I)から、樹脂フィルム(1)を剥離した。露出した粘着剤層(1)の面側を、マジック印字されたポリイミド樹脂フィルム(「UPILEX-50S」、厚み50μm、宇部興産製)と偏光フィルム(「REGQ1698GDUHC3+H2-BW」、厚み78μm、日東電工製)の積層体(II)のマジック印字された面側に貼り合わせた。偏光板の面側が下向き方向になるように、デジタルマイクロスコープ(VHX200、キーエンス社製)の試料台にセットした。マイクロスコープレンズの倍率を10倍に設定し、ピントを合わせ、図4に示すように、ポリイミド樹脂フィルムのマジック印字を確認した。マジック印字が見られるかどうかを基準として判定した。
〇:印字が見られる。
×:印字が見られない。
温度計、攪拌機、還流冷却管および窒素ガス導入管を備えた反応容器に、モノマーとして、2-エチルヘキシルアクリレート(2EHA):63重量部、N-ビニルピロリドン(NVP):15重量部、メチルメタクリレート(MMA):9重量部、およびヒドロキシエチルアクリレート(HEA):13重量部、重合開始剤としてアゾビスイソブチロニトリル:0.2重量部、ならびに溶媒として酢酸エチル:233重量部を投入し、窒素ガスを流し、攪拌しながら約1時間窒素置換を行った。その後、60℃に加熱し、7時間反応させて、重量平均分子量(Mw)が120万のアクリル系ポリマー溶液を得た。得られたアクリル系ポリマー溶液に、アクリル系ポリマー:100重量部に対して、タケネートD110N(三井化学)を1重量部添加して、均一に混合し、さらに反応させ、アクリル系ポリマーAの溶液を得た。
得られたアクリル系ポリマーAの溶液に、アクリル系ポリマーA:100重量部に対して、黒色顔料(Alfa Aesar製、カーボンブラック):1重量部を添加し、黒色の粘着剤組成物A1を製造した。
製造例1で得られた得られたアクリル系ポリマーAの溶液に、アクリル系ポリマーA:100重量部に対して、黒色顔料(Alfa Aesar製、カーボンブラック):1.5重量部を添加し、黒色の粘着剤組成物A2を製造した。
製造例1で得られた得られたアクリル系ポリマーAの溶液そのものを、粘着剤組成物A3とした。
製造例1で得られた得られたアクリル系ポリマーAの溶液に、アクリル系ポリマーA:100重量部に対して、黒色顔料(Alfa Aesar製、カーボンブラック):3重量部を添加し、黒色の粘着剤組成物A4を製造した。
剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率80%、巴川製紙所製)の片面の剥離樹脂フィルムを剥がし、ポリエステル樹脂からなる基材(「T910J75」、厚み75μm、三菱ケミカル製)の非帯電防止処理面と貼り合わせた。次いで、残る剥離樹脂フィルムを剥がし、シリコーン処理を施したポリエステル樹脂からなる基材(「MRQ50T100J」、厚み50μm、三菱ケミカル製)のシリコーン処理面を貼り合わせた。
以上により、全光線透過率80%の、樹脂フィルム(1-1)(シリコーン処理面付)(厚み50μm)/粘着剤層(1-1)(厚み25μm)/樹脂フィルム(2-1)(厚み75μm)の構成の積層体1を得た。
結果を表1に示した。
剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率80%、巴川製紙所製)に代えて、剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率75%、巴川製紙所製)を用いた以外は、実施例1と同様に行い、全光線透過率75%の、樹脂フィルム(1-2)(シリコーン処理面付)(厚み50μm)/粘着剤層(1-2)(厚み25μm)/樹脂フィルム(2-2)(厚み75μm)の構成の積層体2を得た。
結果を表1に示した。
剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率80%、巴川製紙所製)に代えて、剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率69%、巴川製紙所製)を用いた以外は、実施例1と同様に行い、全光線透過率69%の、樹脂フィルム(1-3)(シリコーン処理面付)(厚み50μm)/粘着剤層(1-3)(厚み25μm)/樹脂フィルム(2-3)(厚み75μm)の構成の積層体3を得た。
結果を表1に示した。
剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率80%、巴川製紙所製)に代えて、剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率59%、巴川製紙所製)を用いた以外は、実施例1と同様に行い、全光線透過率59%の、樹脂フィルム(1-4)(シリコーン処理面付)(厚み50μm)/粘着剤層(1-4)(厚み25μm)/樹脂フィルム(2-4)(厚み75μm)の構成の積層体4を得た。
結果を表1に示した。
剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率80%、巴川製紙所製)に代えて、剥離樹脂フィルム-アクリル系粘着剤-剥離樹脂フィルムの3層構成の両面テープ(全光線透過率49%、巴川製紙所製)を用いた以外は、実施例1と同様に行い、全光線透過率49%の、樹脂フィルム(1-5)(シリコーン処理面付)(厚み50μm)/粘着剤層(1-5)(厚み25μm)/樹脂フィルム(2-5)(厚み75μm)の構成の積層体5を得た。
結果を表1に示した。
製造例1で得られた粘着剤組成物A1を、ポリエステル樹脂からなる基材(「ルミラーS10」、厚み75μm、東レ製)にファウンテンロールで乾燥後の厚みが25μmとなるよう塗布し、乾燥温度130℃、乾燥時間2分の条件でキュアーして乾燥した。このようにして、基材上に粘着剤層を作製した。次いで、粘着剤層の表面に、一方の面にシリコーン処理を施したポリエステル樹脂(「ルミラーS10」、厚み25μm、東レ製)からなる基材のシリコーン処理面を貼合せて、全光線透過率30%の、樹脂フィルム(1-6)(シリコーン処理面付)(厚み25μm)/粘着剤層(1-6)(厚み25μm)/樹脂フィルム(2-6)(厚み75μm)の構成の積層体6を得た。
結果を表1に示した。
製造例1で得られた粘着剤組成物A1に代えて、製造例2で得られた粘着剤組成物A2を用いた以外は、実施例6と同様に行い、全光線透過率21%の、樹脂フィルム(1-7)(シリコーン処理面付)(厚み25μm)/粘着剤層(1-7)(厚み25μm)/樹脂フィルム(2-7)(厚み75μm)の構成の積層体7を得た。
結果を表1に示した。
製造例1で得られた粘着剤組成物A1に代えて、製造例3で得られた粘着剤組成物A3を用いた以外は、実施例6と同様に行い、全光線透過率87%の、樹脂フィルム(1-C1)(シリコーン処理面付)(厚み25μm)/粘着剤層(1-C1)(厚み25μm)/樹脂フィルム(2-C1)(厚み75μm)の構成の積層体C1を得た。
結果を表1に示した。
製造例1で得られた粘着剤組成物A1に代えて、製造例4で得られた粘着剤組成物A4を用いた以外は、実施例6と同様に行い、全光線透過率5%の、樹脂フィルム(1-C2)(シリコーン処理面付)(厚み25μm)/粘着剤層(1-C2)(厚み25μm)/樹脂フィルム(2-C2)(厚み75μm)の構成の積層体C2を得た。
結果を表1に示した。
粘着剤層(1) 20
樹脂フィルム(2) 30
粘着剤層(2) 40
樹脂フィルム(3) 50
光学用アクリル系粘着剤層 60
ポリイミド樹脂フィルム 70
印字部 75
偏光フィルム 80
アルミホイル 90
積層体 100
Claims (3)
- 樹脂フィルム(1)、粘着剤層(1)、樹脂フィルム(2)をこの順に有する、3層以上の積層体であって、
該積層体の全光線透過率が20%~83%である、
積層体。 - 請求項1に記載の積層体を用いた画像表示部材の製造方法であって、
前記樹脂フィルム(1)と前記粘着剤層(1)が直接に積層され、
該粘着剤層(1)から該樹脂フィルム(1)を剥離する工程と、
露出した該粘着剤層(1)にOLEDパネルを貼り合わせる工程と、
を含む、
画像表示部材の製造方法。 - 請求項1に記載の積層体を用いたモバイル電子機器の製造方法であって、
前記樹脂フィルム(1)と前記粘着剤層(1)が直接に積層され、
該粘着剤層(1)から該樹脂フィルム(1)を剥離する工程と、
露出した該粘着剤層(1)にOLEDパネルを貼り合わせる工程と、
該積層体の、該粘着剤層(1)から見て前記樹脂フィルム(2)側の最外層上に、粘着剤層(2)を設ける工程と、
該粘着剤層(2)の、該樹脂フィルム(2)の存在する側とは反対側に、筐体を貼り合わせる工程と、
を含む、
モバイル電子機器の製造方法。
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JP5707365B2 (ja) * | 2012-06-08 | 2015-04-30 | 日東電工株式会社 | 粘着剤層付光学フィルムの製造方法 |
JP6613516B2 (ja) | 2014-07-07 | 2019-12-04 | リンテック株式会社 | 表面保護フィルム |
JP5825450B2 (ja) * | 2015-02-16 | 2015-12-02 | 株式会社バッファロー | 保護フィルムの貼付方法、保護フィルムの位置決めシステム、及びプログラム |
JP6259789B2 (ja) * | 2015-05-28 | 2018-01-10 | 双葉電子工業株式会社 | 有機el表示モジュール |
CN110121416B (zh) * | 2016-12-28 | 2021-10-26 | 日东电工株式会社 | 表面保护薄膜 |
JP6979285B2 (ja) * | 2017-05-26 | 2021-12-08 | 日東電工株式会社 | 画像表示装置 |
JPWO2019026760A1 (ja) * | 2017-07-31 | 2020-05-28 | 日東電工株式会社 | フレキシブル画像表示装置用積層体、及び、フレキシブル画像表示装置 |
JP7219006B2 (ja) * | 2018-02-27 | 2023-02-07 | 日東電工株式会社 | 透明導電性フィルム積層体および透明導電性フィルムの製造方法 |
CN113330085A (zh) * | 2019-01-21 | 2021-08-31 | 日东电工株式会社 | 加强用层叠薄膜 |
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2020
- 2020-08-05 JP JP2020132869A patent/JP2022029549A/ja active Pending
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2021
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- 2021-07-02 CN CN202180058411.4A patent/CN116056889A/zh active Pending
- 2021-07-02 KR KR1020237006936A patent/KR20230043200A/ko unknown
- 2021-08-02 TW TW110128342A patent/TW202210289A/zh unknown
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