JP2022003010A - 接合体の製造方法および回路基板の製造方法 - Google Patents
接合体の製造方法および回路基板の製造方法 Download PDFInfo
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Abstract
Description
セラミックス基板として、表1に示す窒化珪素基板を用意した。
Claims (9)
- セラミックス部材と銅板とを接合する接合層を形成する工程を具備し、
前記接合層を形成する工程は、
前記セラミックス部材上に接合ろう材ペーストを塗布し、前記接合ろう材ペースト上に前記銅板を配置する工程と、
非酸化性雰囲気中、700℃以上900℃以下の温度および1×10−3Pa以下の圧力下で、前記接合ろう材ペーストを介して前記セラミックス部材と前記銅板とを加熱接合する工程と、
を含み、
前記接合ろう材ペーストは、Agと、Cuと、Tiと、を含有するとともに、Sn、In、およびCからなる群から選ばれる少なくとも一つの元素をさらに含有し、
前記接合ろう材ペーストの前記Cuに対する前記Agの質量比Ag/Cuは、2.1以下であり、
前記接合ろう材ペーストのTiの含有量は、5質量%以上である、接合体の製造方法。 - 前記接合層のナノインデンテーション硬さHITは、1.0GPa以上2.5GPa以下である、請求項1に記載の接合体の製造方法。
- 前記接合ろう材ペーストの塗布厚さは、10μm以上40μm以下である、請求項1または請求項2に記載の接合体の製造方法。
- 前記接合層を形成する工程は、前記加熱接合する工程の後に、5℃/分以上の冷却速度で前記接合層を急冷する工程をさらに具備する、請求項1ないし請求項3のいずれか1項に記載の接合体の製造方法。
- 前記接合ろう材ペーストのSnおよびInからなる群より選ばれる少なくとも一つの元素の含有量は5質量%以上20質量%以下である、請求項1ないし請求項4のいずれか1項に記載の接合体の製造方法。
- 前記接合層は、Ag−Ti結晶を有し、
前記接合層のX線回折パターンの37.5度以上38.5度以下の範囲において、Ag結晶に起因する最大ピークに対する前記Ag−Ti結晶に起因する最大ピークの比は、0.5以上1.2以下である、請求項1ないし請求項5のいずれか1項に記載の接合体の製造方法。 - 前記セラミックス部材は、厚さ0.4mm以下の窒化珪素基板である、請求項1ないし請求項6のいずれか1項に記載の接合体の製造方法。
- 前記銅板の厚さは、0.7mm以上である、請求項1ないし請求項7のいずれか1項に記載の接合体の製造方法。
- 請求項1ないし請求項8のいずれか1項に記載の製造方法により前記接合体を製造する工程と、
前記接合体にエッチング工程を行うことにより、前記銅板をパターニングする工程と、
を具備する、回路基板の製造方法。
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JP2016148105 | 2016-07-28 | ||
JP2016148105 | 2016-07-28 | ||
JP2018530386A JP7013374B2 (ja) | 2016-07-28 | 2017-07-27 | 接合体、回路基板、および半導体装置 |
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JP7155372B2 JP7155372B2 (ja) | 2022-10-18 |
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JP2018530386A Active JP7013374B2 (ja) | 2016-07-28 | 2017-07-27 | 接合体、回路基板、および半導体装置 |
JP2021153047A Active JP7155372B2 (ja) | 2016-07-28 | 2021-09-21 | 接合体の製造方法および回路基板の製造方法 |
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EP (1) | EP3492441A4 (ja) |
JP (2) | JP7013374B2 (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220183138A1 (en) * | 2020-12-09 | 2022-06-09 | Schweizer Electronic Ag | Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP7052374B2 (ja) | 2017-02-06 | 2022-04-12 | 三菱マテリアル株式会社 | セラミックス/アルミニウム接合体の製造方法、絶縁回路基板の製造方法 |
EP3632879B1 (en) | 2017-05-30 | 2022-02-09 | Denka Company Limited | Ceramic circuit board and method of production |
JP7230432B2 (ja) * | 2017-11-02 | 2023-03-01 | 三菱マテリアル株式会社 | 接合体、及び、絶縁回路基板 |
WO2019088222A1 (ja) * | 2017-11-02 | 2019-05-09 | 三菱マテリアル株式会社 | 接合体、及び、絶縁回路基板 |
JP7332588B2 (ja) | 2018-05-16 | 2023-08-23 | 株式会社東芝 | セラミックス銅回路基板およびその製造方法 |
JP7240511B2 (ja) | 2019-09-02 | 2023-03-15 | 株式会社東芝 | 接合体 |
KR20220116213A (ko) * | 2019-12-19 | 2022-08-22 | 미쓰비시 마테리알 가부시키가이샤 | 구리/세라믹스 접합체, 및, 절연 회로 기판 |
JP6939973B2 (ja) * | 2019-12-19 | 2021-09-22 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、及び、絶縁回路基板 |
WO2021166762A1 (ja) | 2020-02-17 | 2021-08-26 | 株式会社 東芝 | ろう材、接合体、セラミックス回路基板、及び接合体の製造方法 |
WO2021187201A1 (ja) | 2020-03-18 | 2021-09-23 | 株式会社 東芝 | 接合体、セラミックス銅回路基板、接合体の製造方法、およびセラミックス銅回路基板の製造方法 |
WO2021235387A1 (ja) | 2020-05-20 | 2021-11-25 | 株式会社 東芝 | 接合体、セラミックス銅回路基板、及び半導体装置 |
CN111885852A (zh) * | 2020-07-24 | 2020-11-03 | 深圳市环基实业有限公司 | 一种陶瓷覆铜板的制备方法 |
JPWO2022024990A1 (ja) * | 2020-07-27 | 2022-02-03 | ||
EP4190764A1 (en) | 2020-07-27 | 2023-06-07 | Kabushiki Kaisha Toshiba | Joining body, circuit substrate, semiconductor device, and method for manufacturing joining body |
CN115989579A (zh) | 2020-10-07 | 2023-04-18 | 株式会社东芝 | 接合体、陶瓷电路基板及半导体装置 |
CN116018884A (zh) * | 2020-10-20 | 2023-04-25 | 株式会社东芝 | 接合体及采用其的陶瓷电路基板以及半导体装置 |
JP2022165046A (ja) * | 2021-04-19 | 2022-10-31 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、および、絶縁回路基板 |
JP2023013629A (ja) * | 2021-07-16 | 2023-01-26 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、および、絶縁回路基板 |
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JP3834351B2 (ja) * | 1996-04-09 | 2006-10-18 | 株式会社東芝 | セラミックス回路基板 |
EP2811513B1 (en) * | 2012-02-01 | 2019-12-18 | Mitsubishi Materials Corporation | Method for producing substrate for power modules |
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EP3492441A1 (en) | 2019-06-05 |
WO2018021472A1 (ja) | 2018-02-01 |
CN109476556B (zh) | 2022-03-01 |
JPWO2018021472A1 (ja) | 2019-05-23 |
CN109476556A (zh) | 2019-03-15 |
CN114478045B (zh) | 2023-08-15 |
EP3492441A4 (en) | 2020-03-04 |
JP7155372B2 (ja) | 2022-10-18 |
CN114478045A (zh) | 2022-05-13 |
JP7013374B2 (ja) | 2022-01-31 |
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