JP2021185239A5 - - Google Patents

Download PDF

Info

Publication number
JP2021185239A5
JP2021185239A5 JP2021137393A JP2021137393A JP2021185239A5 JP 2021185239 A5 JP2021185239 A5 JP 2021185239A5 JP 2021137393 A JP2021137393 A JP 2021137393A JP 2021137393 A JP2021137393 A JP 2021137393A JP 2021185239 A5 JP2021185239 A5 JP 2021185239A5
Authority
JP
Japan
Prior art keywords
mass
component
resin composition
epoxy resin
type epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021137393A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021185239A (ja
JP7111233B2 (ja
Filing date
Publication date
Priority claimed from JP2016166166A external-priority patent/JP7024174B2/ja
Application filed filed Critical
Priority to JP2021137393A priority Critical patent/JP7111233B2/ja
Publication of JP2021185239A publication Critical patent/JP2021185239A/ja
Publication of JP2021185239A5 publication Critical patent/JP2021185239A5/ja
Priority to JP2022116410A priority patent/JP7435665B2/ja
Application granted granted Critical
Publication of JP7111233B2 publication Critical patent/JP7111233B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021137393A 2016-08-26 2021-08-25 樹脂組成物 Active JP7111233B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021137393A JP7111233B2 (ja) 2016-08-26 2021-08-25 樹脂組成物
JP2022116410A JP7435665B2 (ja) 2016-08-26 2022-07-21 樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016166166A JP7024174B2 (ja) 2016-08-26 2016-08-26 樹脂組成物
JP2021137393A JP7111233B2 (ja) 2016-08-26 2021-08-25 樹脂組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2016166166A Division JP7024174B2 (ja) 2016-08-26 2016-08-26 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022116410A Division JP7435665B2 (ja) 2016-08-26 2022-07-21 樹脂組成物

Publications (3)

Publication Number Publication Date
JP2021185239A JP2021185239A (ja) 2021-12-09
JP2021185239A5 true JP2021185239A5 (https=) 2022-03-09
JP7111233B2 JP7111233B2 (ja) 2022-08-02

Family

ID=61304727

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2016166166A Active JP7024174B2 (ja) 2016-08-26 2016-08-26 樹脂組成物
JP2021137393A Active JP7111233B2 (ja) 2016-08-26 2021-08-25 樹脂組成物
JP2022116410A Active JP7435665B2 (ja) 2016-08-26 2022-07-21 樹脂組成物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2016166166A Active JP7024174B2 (ja) 2016-08-26 2016-08-26 樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022116410A Active JP7435665B2 (ja) 2016-08-26 2022-07-21 樹脂組成物

Country Status (1)

Country Link
JP (3) JP7024174B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020029494A (ja) * 2018-08-21 2020-02-27 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP7241389B2 (ja) 2019-02-21 2023-03-17 ナミックス株式会社 液状エポキシ樹脂組成物及びそれを硬化させて得られる硬化物
EP4455242A1 (en) * 2021-12-20 2024-10-30 Toyobo Co., Ltd. Adhesive composition and laminate
JPWO2025142909A1 (https=) * 2023-12-27 2025-07-03

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6253327A (ja) * 1985-08-31 1987-03-09 Res Dev Corp Of Japan 硬化性組成物
JP2010185051A (ja) 2009-02-13 2010-08-26 Omron Corp 樹脂組成物および誘電体接着用接着剤
KR101897955B1 (ko) 2012-01-23 2018-09-12 아지노모토 가부시키가이샤 수지 조성물
JP6044139B2 (ja) 2012-07-06 2016-12-14 味の素株式会社 絶縁樹脂シート
JP6048193B2 (ja) 2013-02-13 2016-12-21 味の素株式会社 樹脂組成物
JP6222686B2 (ja) * 2013-03-22 2017-11-01 インテル・コーポレーション 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
CN107849336B (zh) 2015-09-30 2023-11-10 积水化学工业株式会社 树脂组合物及多层基板

Similar Documents

Publication Publication Date Title
JP2021185239A5 (https=)
KR102399159B1 (ko) 수지 조성물, 이를 사용한 열경화성 필름, 수지 경화물, 적층판, 프린트 배선판 및 반도체 장치
TWI549241B (zh) Method for manufacturing wafer sealant and semiconductor device
JP2009511717A5 (https=)
CN109843994B (zh) 片状预浸料
JP2009280823A5 (https=)
JP2007314782A5 (https=)
CN106133054B (zh) 液状树脂组合物、固化物、配线结构体以及使用该配线结构体的组装体
CN111378093B (zh) 环氧树脂及其制造方法、环氧树脂组合物及环氧树脂硬化物
JP2016034996A (ja) エポキシ樹脂組成物、プリプレグ及び金属張積層板、プリント配線基板
CN115190899A (zh) 热固性树脂组合物、树脂片和金属基底基板
TW201930455A (zh) 球柵陣列封裝體密封用的環氧樹脂組成物、環氧樹脂硬化物和電子零件裝置
JP2025071162A (ja) エポキシ樹脂組成物、接着フィルム、プリント配線板、半導体チップパッケージ、半導体装置、及び接着フィルムの使用方法
WO2020158510A1 (ja) 硬化性フイルム
TW201124451A (en) Polyamide compound and epoxy resin composition formed by containing the same
CN104871653A (zh) 带树脂层的金属层、层叠体、电路基板以及半导体装置
WO2016093593A1 (ko) 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
TWI813852B (zh) 光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置
JP7185384B2 (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
TW201202291A (en) Epoxy resin composition and cured substance
WO2015107990A1 (ja) 接着組成物ならびにそれを有する接着フィルム、接着組成物付き基板、半導体装置およびその製造方法
JP2007169454A5 (https=)
JPH062797B2 (ja) エポキシ樹脂組成物
JP2019052258A (ja) 多価ヒドロキシ樹脂、その製造方法、エポキシ樹脂用硬化剤、エポキシ樹脂、エポキシ樹脂組成物、その硬化物、半導体封止材および積層板
JPS598718A (ja) エポキシ樹脂組成物