JPWO2025142909A1 - - Google Patents
Info
- Publication number
- JPWO2025142909A1 JPWO2025142909A1 JP2025567106A JP2025567106A JPWO2025142909A1 JP WO2025142909 A1 JPWO2025142909 A1 JP WO2025142909A1 JP 2025567106 A JP2025567106 A JP 2025567106A JP 2025567106 A JP2025567106 A JP 2025567106A JP WO2025142909 A1 JPWO2025142909 A1 JP WO2025142909A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023221374 | 2023-12-27 | ||
| PCT/JP2024/045658 WO2025142909A1 (ja) | 2023-12-27 | 2024-12-24 | 樹脂組成物、樹脂付き金属箔、積層板、プリント配線板及び半導体パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025142909A1 true JPWO2025142909A1 (https=) | 2025-07-03 |
Family
ID=96217906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025567106A Pending JPWO2025142909A1 (https=) | 2023-12-27 | 2024-12-24 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2025142909A1 (https=) |
| CN (1) | CN121127532A (https=) |
| TW (1) | TW202533945A (https=) |
| WO (1) | WO2025142909A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5417680B2 (ja) * | 2006-03-31 | 2014-02-19 | 住友ベークライト株式会社 | 樹脂組成物、積層体、配線板および配線板の製造方法 |
| JP7024174B2 (ja) * | 2016-08-26 | 2022-02-24 | 味の素株式会社 | 樹脂組成物 |
| JP7323314B2 (ja) * | 2018-03-28 | 2023-08-08 | 積水化学工業株式会社 | 樹脂材料、積層フィルム及び多層プリント配線板 |
| JP6805338B2 (ja) * | 2018-03-28 | 2020-12-23 | 積水化学工業株式会社 | 樹脂材料、積層構造体及び多層プリント配線板 |
| JP2019173009A (ja) * | 2018-03-28 | 2019-10-10 | 積水化学工業株式会社 | 硬化体、樹脂材料及び多層プリント配線板 |
| WO2019189466A1 (ja) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
| JP7226954B2 (ja) * | 2018-09-28 | 2023-02-21 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
| JP6724097B2 (ja) * | 2018-09-28 | 2020-07-15 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品 |
| JP7123731B2 (ja) * | 2018-10-11 | 2022-08-23 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
| CN111378253B (zh) * | 2018-12-29 | 2023-07-11 | 太阳油墨（苏州）有限公司 | 树脂填充材料 |
| CN114072444B (zh) * | 2019-07-08 | 2024-07-09 | 日保丽公司 | 固化性组合物、固化物、外涂膜以及柔性配线板和其制造方法 |
| JP7540347B2 (ja) * | 2021-01-19 | 2024-08-27 | 味の素株式会社 | 樹脂組成物及び樹脂組成物充填済みシリンジ |
-
2024
- 2024-12-24 JP JP2025567106A patent/JPWO2025142909A1/ja active Pending
- 2024-12-24 CN CN202480028620.8A patent/CN121127532A/zh active Pending
- 2024-12-24 WO PCT/JP2024/045658 patent/WO2025142909A1/ja active Pending
- 2024-12-25 TW TW113150598A patent/TW202533945A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202533945A (zh) | 2025-09-01 |
| WO2025142909A1 (ja) | 2025-07-03 |
| CN121127532A (zh) | 2025-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260129 |