Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate

Definitions

• This embodiment relates to a resin composition, a resin-coated metal foil, a laminate, a printed wiring board, and a semiconductor package.
• the resin-coated metal foil does not develop cracks in the resin layer in the B-stage state during the manufacturing process and during use. According to the research of the present inventors, it has been found that, in order to suppress cracks in the resin layer, it is effective to add a highly flexible component to the resin layer, but there is room for improvement in the interlayer insulation properties of an insulating layer formed from a resin layer in which the occurrence of cracks has been suppressed by this method.
• the present embodiment aims to provide a resin composition capable of producing a resin-coated metal foil that suppresses the occurrence of cracks in the resin layer and has excellent interlayer insulation properties for the insulating layer formed from the resin layer, as well as a resin-coated metal foil, a laminate, a printed wiring board, and a semiconductor package that use the resin composition.
• this embodiment provides the following [1] to [12].
• [1] A resin composition used to form a resin layer of a resin-coated metal foil having a metal foil and a resin layer laminated on one side of the metal foil,
• (A) A resin composition containing an epoxy resin having an aliphatic ring and an epoxy equivalent of 240 g/eq or less.
• [2] The resin composition according to the above [1], wherein the aliphatic ring is a condensed ring.
• a laminate comprising a cured product of the resin composition according to any one of [1] to [7] above and a metal foil.
• a semiconductor package comprising the printed wiring board according to [11] above and a semiconductor element.
• a resin composition capable of producing a resin-coated metal foil that suppresses the occurrence of cracks in the resin layer and has excellent interlayer insulation properties for the insulating layer formed from the resin layer, as well as a resin-coated metal foil, a laminate, a printed wiring board, and a semiconductor package that use the resin composition.
• a numerical range indicated using “to” indicates a range including the numerical values before and after “to” as the minimum and maximum values, respectively.
• a numerical range of "X to Y" (X and Y are real numbers) means a numerical range of not less than X and not more than Y.
• the expression “not less than X” means X and a numerical value exceeding X.
• the expression “not more than Y” means Y and a numerical value less than Y.
• Each lower limit and upper limit of a numerical range described herein may be arbitrarily combined with the lower limit or upper limit of any other numerical range. In the numerical ranges described in this specification, the lower or upper limit of the numerical range may be replaced with values shown in the examples.
• each of the components and materials exemplified in this specification may be used alone or in combination of two or more.
• the content of each component in a resin composition means, when a plurality of substances corresponding to each component are present in the resin composition, the total amount of the plurality of substances present in the resin composition, unless otherwise specified.
• solids refers to components other than the solvent, including those that are liquid at room temperature.
• room temperature means 25°C.
• the weight average molecular weight (Mw) in this specification means a value measured in terms of polystyrene by gel permeation chromatography (GPC). Specifically, the weight average molecular weight (Mw) in this specification can be measured by the method described in the Examples.
• si-cured product is synonymous with a resin composition in the B-stage state in JIS K 6800:2006
• cured product is synonymous with a resin composition in the C-stage state in JIS K 6800:2006.
• layer when used, it includes not only a solid layer, but also layers that are not solid but have islands, holes, and layers where the interface with an adjacent layer is unclear.
• This embodiment also includes any combination of the items described in this specification.
• the resin composition of the present embodiment is A resin composition used to form a resin layer of a resin-coated metal foil having a metal foil and a resin layer laminated on one surface of the metal foil, (A) A resin composition containing an epoxy resin having an aliphatic ring and an epoxy equivalent of 240 g/eq or less.
• each component may be abbreviated as component (A), component (B), etc., and other components may be abbreviated in the same manner.
• the (A) component has an epoxy equivalent of 240 g/eq or less, the crosslink density of the cured product is high, and deterioration, moisture absorption, etc. due to the heating environment are less likely to occur, which is assumed to be the reason for the improvement of interlayer insulation.
• each component that may be contained in the resin composition of the present embodiment will be described in order.
• the epoxy equivalent of the component (A) is preferably 80 to 240 g/eq, more preferably 100 to 220 g/eq, even more preferably 120 to 200 g/eq, and particularly preferably 140 to 180 g/eq.
• the epoxy equivalent is the mass of the resin per epoxy group (g/eq) and can be measured according to the method specified in JIS K 7236:2001.
• the content of the (A) component in the resin composition of this embodiment is preferably 5 to 70 mass%, more preferably 10 to 60 mass%, even more preferably 15 to 40 mass%, and particularly preferably 19 to 25 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition of this embodiment.
• the content of the (A) component is equal to or greater than the lower limit, the crack resistance of the resin layer and the interlayer insulation of the insulating layer tend to be improved.
• the content of the (A) component is equal to or less than the upper limit, the heat resistance of the resin layer tends to be improved.
• Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R B1 in the above general formula (B-2) include alkyl groups having 1 to 5 carbon atoms, such as methyl groups, ethyl groups, n-propyl groups, isopropyl groups, n-butyl groups, isobutyl groups, t-butyl groups, and n-pentyl groups; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms.
• the aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched.
• the content of the maleimide resin (B) is preferably 30 to 90 mass%, more preferably 40 to 85 mass%, and even more preferably 50 to 80 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition of the present embodiment.
• the content of the maleimide resin (B) is equal to or greater than the lower limit, the heat resistance, moldability, processability, and conductor adhesion of the insulating layer tend to be improved, whereas when the content of the maleimide resin (B) is equal to or less than the upper limit, the dielectric properties of the insulating layer tend to be improved.

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• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Laminated Bodies (AREA)

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Citations (12)

• 2024
  • 2024-12-24 JP JP2025567106A patent/JPWO2025142909A1/ja active Pending
  • 2024-12-24 CN CN202480028620.8A patent/CN121127532A/zh active Pending
  • 2024-12-24 WO PCT/JP2024/045658 patent/WO2025142909A1/ja active Pending
  • 2024-12-25 TW TW113150598A patent/TW202533945A/zh unknown

Patent Citations (12)

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