CN121127532A - 树脂组合物、带有树脂的金属箔、层叠板、印刷线路板及半导体封装体 - Google Patents

树脂组合物、带有树脂的金属箔、层叠板、印刷线路板及半导体封装体

Info

Publication number
CN121127532A
CN121127532A CN202480028620.8A CN202480028620A CN121127532A CN 121127532 A CN121127532 A CN 121127532A CN 202480028620 A CN202480028620 A CN 202480028620A CN 121127532 A CN121127532 A CN 121127532A
Authority
CN
China
Prior art keywords
resin
metal foil
resin composition
component
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480028620.8A
Other languages
English (en)
Chinese (zh)
Inventor
田端刊
日高圭芸
染川淳生
森田高示
林千寻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN121127532A publication Critical patent/CN121127532A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
CN202480028620.8A 2023-12-27 2024-12-24 树脂组合物、带有树脂的金属箔、层叠板、印刷线路板及半导体封装体 Pending CN121127532A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023221374 2023-12-27
JP2023-221374 2023-12-27
PCT/JP2024/045658 WO2025142909A1 (ja) 2023-12-27 2024-12-24 樹脂組成物、樹脂付き金属箔、積層板、プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
CN121127532A true CN121127532A (zh) 2025-12-12

Family

ID=96217906

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480028620.8A Pending CN121127532A (zh) 2023-12-27 2024-12-24 树脂组合物、带有树脂的金属箔、层叠板、印刷线路板及半导体封装体

Country Status (4)

Country Link
JP (1) JPWO2025142909A1 (https=)
CN (1) CN121127532A (https=)
TW (1) TW202533945A (https=)
WO (1) WO2025142909A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5417680B2 (ja) * 2006-03-31 2014-02-19 住友ベークライト株式会社 樹脂組成物、積層体、配線板および配線板の製造方法
JP7024174B2 (ja) * 2016-08-26 2022-02-24 味の素株式会社 樹脂組成物
JP7323314B2 (ja) * 2018-03-28 2023-08-08 積水化学工業株式会社 樹脂材料、積層フィルム及び多層プリント配線板
JP6805338B2 (ja) * 2018-03-28 2020-12-23 積水化学工業株式会社 樹脂材料、積層構造体及び多層プリント配線板
JP2019173009A (ja) * 2018-03-28 2019-10-10 積水化学工業株式会社 硬化体、樹脂材料及び多層プリント配線板
WO2019189466A1 (ja) * 2018-03-28 2019-10-03 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7226954B2 (ja) * 2018-09-28 2023-02-21 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP6724097B2 (ja) * 2018-09-28 2020-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品
JP7123731B2 (ja) * 2018-10-11 2022-08-23 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN111378253B (zh) * 2018-12-29 2023-07-11 太阳油墨（苏州）有限公司 树脂填充材料
CN114072444B (zh) * 2019-07-08 2024-07-09 日保丽公司 固化性组合物、固化物、外涂膜以及柔性配线板和其制造方法
JP7540347B2 (ja) * 2021-01-19 2024-08-27 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

Also Published As

Publication number Publication date
TW202533945A (zh) 2025-09-01
WO2025142909A1 (ja) 2025-07-03
JPWO2025142909A1 (https=) 2025-07-03

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