TW202533945A - 樹脂組成物、附有樹脂之金屬箔、積層板、印刷線路板及半導體封裝體 - Google Patents

樹脂組成物、附有樹脂之金屬箔、積層板、印刷線路板及半導體封裝體

Info

Publication number
TW202533945A
TW202533945A TW113150598A TW113150598A TW202533945A TW 202533945 A TW202533945 A TW 202533945A TW 113150598 A TW113150598 A TW 113150598A TW 113150598 A TW113150598 A TW 113150598A TW 202533945 A TW202533945 A TW 202533945A
Authority
TW
Taiwan
Prior art keywords
resin
metal foil
resin composition
component
coated metal
Prior art date
Application number
TW113150598A
Other languages
English (en)
Chinese (zh)
Inventor
田端栞
日高圭芸
染川淳生
森田高示
林千尋
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202533945A publication Critical patent/TW202533945A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
TW113150598A 2023-12-27 2024-12-25 樹脂組成物、附有樹脂之金屬箔、積層板、印刷線路板及半導體封裝體 TW202533945A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023221374 2023-12-27
JP2023-221374 2023-12-27

Publications (1)

Publication Number Publication Date
TW202533945A true TW202533945A (zh) 2025-09-01

Family

ID=96217906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113150598A TW202533945A (zh) 2023-12-27 2024-12-25 樹脂組成物、附有樹脂之金屬箔、積層板、印刷線路板及半導體封裝體

Country Status (4)

Country Link
JP (1) JPWO2025142909A1 (https=)
CN (1) CN121127532A (https=)
TW (1) TW202533945A (https=)
WO (1) WO2025142909A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5417680B2 (ja) * 2006-03-31 2014-02-19 住友ベークライト株式会社 樹脂組成物、積層体、配線板および配線板の製造方法
JP7024174B2 (ja) * 2016-08-26 2022-02-24 味の素株式会社 樹脂組成物
JP7323314B2 (ja) * 2018-03-28 2023-08-08 積水化学工業株式会社 樹脂材料、積層フィルム及び多層プリント配線板
JP6805338B2 (ja) * 2018-03-28 2020-12-23 積水化学工業株式会社 樹脂材料、積層構造体及び多層プリント配線板
JP2019173009A (ja) * 2018-03-28 2019-10-10 積水化学工業株式会社 硬化体、樹脂材料及び多層プリント配線板
WO2019189466A1 (ja) * 2018-03-28 2019-10-03 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7226954B2 (ja) * 2018-09-28 2023-02-21 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP6724097B2 (ja) * 2018-09-28 2020-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品
JP7123731B2 (ja) * 2018-10-11 2022-08-23 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN111378253B (zh) * 2018-12-29 2023-07-11 太阳油墨（苏州）有限公司 树脂填充材料
CN114072444B (zh) * 2019-07-08 2024-07-09 日保丽公司 固化性组合物、固化物、外涂膜以及柔性配线板和其制造方法
JP7540347B2 (ja) * 2021-01-19 2024-08-27 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

Also Published As

Publication number Publication date
WO2025142909A1 (ja) 2025-07-03
JPWO2025142909A1 (https=) 2025-07-03
CN121127532A (zh) 2025-12-12

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