JP7024174B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP7024174B2
JP7024174B2 JP2016166166A JP2016166166A JP7024174B2 JP 7024174 B2 JP7024174 B2 JP 7024174B2 JP 2016166166 A JP2016166166 A JP 2016166166A JP 2016166166 A JP2016166166 A JP 2016166166A JP 7024174 B2 JP7024174 B2 JP 7024174B2
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JP
Japan
Prior art keywords
mass
component
type epoxy
epoxy resin
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016166166A
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English (en)
Japanese (ja)
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JP2018030981A (ja
Inventor
賢司 川合
祥平 藤島
恒太 鳥居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2016166166A priority Critical patent/JP7024174B2/ja
Publication of JP2018030981A publication Critical patent/JP2018030981A/ja
Priority to JP2021137393A priority patent/JP7111233B2/ja
Application granted granted Critical
Publication of JP7024174B2 publication Critical patent/JP7024174B2/ja
Priority to JP2022116410A priority patent/JP7435665B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2016166166A 2016-08-26 2016-08-26 樹脂組成物 Active JP7024174B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016166166A JP7024174B2 (ja) 2016-08-26 2016-08-26 樹脂組成物
JP2021137393A JP7111233B2 (ja) 2016-08-26 2021-08-25 樹脂組成物
JP2022116410A JP7435665B2 (ja) 2016-08-26 2022-07-21 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016166166A JP7024174B2 (ja) 2016-08-26 2016-08-26 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021137393A Division JP7111233B2 (ja) 2016-08-26 2021-08-25 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2018030981A JP2018030981A (ja) 2018-03-01
JP7024174B2 true JP7024174B2 (ja) 2022-02-24

Family

ID=61304727

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2016166166A Active JP7024174B2 (ja) 2016-08-26 2016-08-26 樹脂組成物
JP2021137393A Active JP7111233B2 (ja) 2016-08-26 2021-08-25 樹脂組成物
JP2022116410A Active JP7435665B2 (ja) 2016-08-26 2022-07-21 樹脂組成物

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021137393A Active JP7111233B2 (ja) 2016-08-26 2021-08-25 樹脂組成物
JP2022116410A Active JP7435665B2 (ja) 2016-08-26 2022-07-21 樹脂組成物

Country Status (1)

Country Link
JP (3) JP7024174B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020029494A (ja) * 2018-08-21 2020-02-27 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP7241389B2 (ja) 2019-02-21 2023-03-17 ナミックス株式会社 液状エポキシ樹脂組成物及びそれを硬化させて得られる硬化物
WO2023120511A1 (ja) * 2021-12-20 2023-06-29 東洋紡株式会社 接着剤組成物および積層体
CN121127532A (zh) * 2023-12-27 2025-12-12 株式会社力森诺科 树脂组合物、带有树脂的金属箔、层叠板、印刷线路板及半导体封装体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013111345A1 (ja) 2012-01-23 2013-08-01 味の素株式会社 樹脂組成物
JP2014017301A (ja) 2012-07-06 2014-01-30 Ajinomoto Co Inc 絶縁樹脂シート
JP2014152306A (ja) 2013-02-13 2014-08-25 Ajinomoto Co Inc 樹脂組成物
WO2017057561A1 (ja) 2015-09-30 2017-04-06 積水化学工業株式会社 樹脂組成物及び多層基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6253327A (ja) * 1985-08-31 1987-03-09 Res Dev Corp Of Japan 硬化性組成物
JP2010185051A (ja) 2009-02-13 2010-08-26 Omron Corp 樹脂組成物および誘電体接着用接着剤
JP6222686B2 (ja) * 2013-03-22 2017-11-01 インテル・コーポレーション 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013111345A1 (ja) 2012-01-23 2013-08-01 味の素株式会社 樹脂組成物
JP2014017301A (ja) 2012-07-06 2014-01-30 Ajinomoto Co Inc 絶縁樹脂シート
JP2014152306A (ja) 2013-02-13 2014-08-25 Ajinomoto Co Inc 樹脂組成物
WO2017057561A1 (ja) 2015-09-30 2017-04-06 積水化学工業株式会社 樹脂組成物及び多層基板

Also Published As

Publication number Publication date
JP7435665B2 (ja) 2024-02-21
JP2021185239A (ja) 2021-12-09
JP7111233B2 (ja) 2022-08-02
JP2022159316A (ja) 2022-10-17
JP2018030981A (ja) 2018-03-01

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